Patents by Inventor Kazuo Tasaka
Kazuo Tasaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7965371Abstract: A method of manufacturing an electro-optical device by cutting up a pair of mother substrates that are joined to each other by means of a sealant with an electro-optical material being sandwiched therebetween into a plurality of panel formation regions. The method includes: forming a groove along each of at least two pre-work cut lines in either one of the pair of mother substrates; blowing air on one edge face of a region between the grooves formed in the one of the pair of mother substrates; and removing the region between the grooves formed in the one of the pair of mother substrates by vacuuming the region. Herein, the vacuuming is applied to the other edge face of the region.Type: GrantFiled: January 15, 2008Date of Patent: June 21, 2011Assignee: Seiko Epson CorporationInventor: Kazuo Tasaka
-
Patent number: 7881819Abstract: A substrate transfer apparatus transfers substrates stored in a first substrate storage case, which has support grooves in its inner wall, along the support grooves to substrate storage surfaces included in a second substrate storage case.Type: GrantFiled: March 6, 2006Date of Patent: February 1, 2011Assignee: Seiko Epson CorporationInventors: Kazuo Tasaka, Hirokazu Fujishima
-
Patent number: 7557898Abstract: A substrate gap adjusting device adjusts a gap between first and second substrates in a composite substrate. In the substrate gap adjusting device, the composite substrate includes the first substrate; the second substrate that is oppositely bonded to the first substrate through a sealant, the second substrate having a smaller area than the first substrate; and liquid crystal that is injected into a space surrounded by the first substrate, the second substrate, and the sealant.Type: GrantFiled: March 28, 2006Date of Patent: July 7, 2009Assignee: Seiko Epson CorporationInventors: Kazuo Tasaka, Narumi Ishibashi, Masanori Akiyama
-
Publication number: 20080180628Abstract: A method of manufacturing an electro-optical device by cutting up a pair of mother substrates that are joined to each other by means of a sealant with an electro-optical material being sandwiched therebetween into a plurality of panel formation regions. The method includes: forming a groove along each of at least two pre-work cut lines in either one of the pair of mother substrates; blowing air on one edge face of a region between the grooves formed in the one of the pair of mother substrates; and removing the region between the grooves formed in the one of the pair of mother substrates by vacuuming the region. Herein, the vacuuming is applied to the other edge face of the region.Type: ApplicationFiled: January 15, 2008Publication date: July 31, 2008Applicant: Seiko Epson CorporationInventor: Kazuo TASAKA
-
Publication number: 20060219688Abstract: A substrate transfer apparatus transfers substrates stored in a first substrate storage case, which has support grooves in its inner wall, along the support grooves to substrate storage surfaces included in a second substrate storage case.Type: ApplicationFiled: March 6, 2006Publication date: October 5, 2006Applicant: Seiko Epson CorporationInventors: Kazuo Tasaka, Hirokazu Fujishima
-
Publication number: 20060221292Abstract: A substrate gap adjusting device adjusts a gap between first and second substrates in a composite substrate. In the substrate gap adjusting device, the composite substrate includes the first substrate; the second substrate that is oppositely bonded to the first substrate through a sealant, the second substrate having a smaller area than the first substrate; and liquid crystal that is injected into a space surrounded by the first substrate, the second substrate, and the sealant.Type: ApplicationFiled: March 28, 2006Publication date: October 5, 2006Applicant: Seiko Epson CorporationInventors: Kazuo Tasaka, Narumi Ishibashi, Masanori Akiyama
-
Patent number: 6897093Abstract: Upon the manufacture of a non-leaded type semiconductor device having an encapsulater, and a gate cured resin and air vent cured resins which remain as a result of the exposure of leads and tub-suspension leads to a mounting surface of the encapsulater and the formation of the encapsulater, a groove through which a resin flows, is not provided over the full circumference of a cavity defined in a mold die for forming the encapsulater. A gate and air vents are provided outside an area in which no groove is defined. The flow of the resin between the cavity and each of the gate and air vents is made through a gap or space defined between each of the adjacent leads and each tub-suspension lead. If the leads and the tub-suspension leads are cut at a groove-free place, then the occurrence of resin waste and a resin crack can be restrained because the gate cured resin and the air vent cured resins have their surfaces which are identical to the leads and the tub-suspension leads and flat.Type: GrantFiled: July 25, 2003Date of Patent: May 24, 2005Assignees: Renesas Technology Corp., Hitachi Hokkai Semiconductor, Ltd.Inventors: Takahiro Kasuga, Seiichi Tomihara, Kazuo Tasaka
-
Patent number: 6800507Abstract: Upon the manufacture of a non-leaded type semiconductor device having an encapsulater, and a gate cured resin and air vent cured resins which remain as a result of the exposure of leads and tub-suspension leads to a mounting surface of the encapsulater and the formation of the encapsulater, a groove through which a resin flows is not provided over the full circumference of a cavity defined in a mold die for forming the encapsulater. A gate and air vents are provided outside an area in which no groove is defined. The flow of the resin between the cavity and each of the gate and air vents is made through a gap or space defined between each of the adjacent leads and each tub-suspension lead. If the leads and the tub-suspension leads are cut at a groove-free place, then the occurrence of resin waste and a resin crack can be restrained because the gate cured resin and the air vent cured resins have their surfaces which are flat and level with the leads and the tub-suspension leads.Type: GrantFiled: December 23, 2002Date of Patent: October 5, 2004Assignees: Renesas Technology Corp., Hitachi Hokkai Semiconductor, Ltd.Inventors: Takahiro Kasuga, Seiichi Tomihara, Kazuo Tasaka
-
Publication number: 20040104490Abstract: Upon the manufacture of a non-leaded type semiconductor device having an encapsulater, and a gate cured resin and air vent cured resins which remain as a result of the exposure of leads and tub-suspension leads to a mounting surface of the encapsulater and the formation of the encapsulater, a groove through which a resin flows, is not provided over the full circumference of a cavity defined in a mold die for forming the encapsulater. A gate and air vents are provided outside an area in which no groove is defined. The flow of the resin between the cavity and each of the gate and air vents is made through a gap or space defined between each of the adjacent leads and each tub-suspension lead. If the leads and the tub-suspension leads are cut at a groove-free place, then the occurrence of resin waste and a resin crack can be restrained because the gate cured resin and the air vent cured resins have their surfaces which are identical to the leads and the tub-suspension leads and flat.Type: ApplicationFiled: July 25, 2003Publication date: June 3, 2004Applicants: Hitachi, Ltd., Hitachi Hokkai Semiconductor, Ltd.Inventors: Takahiro Kasuga, Seiichi Tomihara, Kazuo Tasaka
-
Patent number: 6664647Abstract: Upon the manufacture of a non-leaded type semiconductor device having an encapsulater, and a gate cured resin and air vent cured resins which remain as a result of the exposure of leads and tub-suspension leads to a mounting surface of the encapsulater and the formation of the encapsulater, a groove through which a resin flows is not provided over the full circumference of a cavity defined in a mold die for forming the encapsulater. A gate and air vents are provided outside an area in which no groove is defined. The flow of the resin between the cavity and each of the gate and air vents is made through a gap or space defined between each of the adjacent leads and each tub-suspension lead. If the leads and the tub-suspension leads are cut at a groove-free place, then the occurrence of resin waste and a resin crack can be restrained because the gate cured resin and the air vent cured resins have their surfaces which are flat and level with the leads and the tub-suspension leads.Type: GrantFiled: April 17, 2002Date of Patent: December 16, 2003Inventors: Takahiro Kasuga, Seiichi Tomihara, Kazuo Tasaka
-
Publication number: 20030087478Abstract: Upon the manufacture of a non-leaded type semiconductor device having an encapsulater, and a gate cured resin and air vent cured resins which remain as a result of the exposure of leads and tub-suspension leads to a mounting surface of the encapsulater and the formation of the encapsulater, a groove through which a resin flows is not provided over the full circumference of a cavity defined in a mold die for forming the encapsulater. A gate and air vents are provided outside an area in which no groove is defined. The flow of the resin between the cavity and each of the gate and air vents is made through a gap or space defined between each of the adjacent leads and each tub-suspension lead. If the leads and the tub-suspension leads are cut at a groove-free place, then the occurrence of resin waste and a resin crack can be restrained because the gate cured resin and the air vent cured resins have their surfaces which are flat and level with the leads and the tub-suspension leads.Type: ApplicationFiled: December 23, 2002Publication date: May 8, 2003Applicant: Hitachi, Ltd.Inventors: Takahiro Kasuga, Seiichi Tomihara, Kazuo Tasaka
-
Publication number: 20020109242Abstract: Upon the manufacture of a non-leaded type semiconductor device having an encapsulater, and a gate cured resin and air vent cured resins which remain as a result of the exposure of leads and tub-suspension leads to a mounting surface of the encapsulater and the formation of the encapsulater, a groove through which a resin flows, is not provided over the full circumference of a cavity defined in a mold die for forming the encapsulater. A gate and air vents are provided outside an area in which no groove is defined. The flow of the resin between the cavity and each of the gate and air vents is made through a gap or space defined between each of the adjacent leads and each tub-suspension lead. If the leads and the tub-suspension leads are cut at a groove-free place, then the occurrence of resin waste and a resin crack can be restrained because the gate cured resin and the air vent cured resins have their surfaces which are identical to the leads and the tub-suspension leads and flat.Type: ApplicationFiled: April 17, 2002Publication date: August 15, 2002Applicant: Hitachi, Ltd.Inventors: Takahiro Kasuga, Seiichi Tomihara, Kazuo Tasaka
-
Publication number: 20020020929Abstract: Upon the manufacture of a non-leaded type semiconductor device having an encapsulater, and a gate cured resin and air vent cured resins which remain as a result of the exposure of leads and tub-suspension leads to a mounting surface of the encapsulater and the formation of the encapsulater, a groove through which a resin flows, is not provided over the full circumference of a cavity defined in a mold die for forming the encapsulater. A gate and air vents are provided outside an area in which no groove is defined. The flow of the resin between the cavity and each of the gate and air vents is made through a gap or space defined between each of the adjacent leads and each tub-suspension lead. If the leads and the tub-suspension leads are cut at a groove-free place, then the occurrence of resin waste and a resin crack can be restrained because the gate cured resin and the air vent cured resins have their surfaces which are identical to the leads and the tub-suspension leads and flat.Type: ApplicationFiled: August 3, 2001Publication date: February 21, 2002Applicant: Hitachi, Ltd.Inventors: Takahiro Kasuga, Seiichi Tomihara, Kazuo Tasaka