Abstract: A vaporizer for generating a process gas from a liquid material includes a container defining a process space of the vaporizer, and an injector having a spray port configured to spray the liquid material in an atomized state downward in the container. A lower block is disposed below the spray port inside the container such that a run-up space for the atomized liquid material is defined between the spray port and the lower block, and an annular space continuous to the run-up space is defined between an inner surface of the container and the lower block. First and second heaters are respectively provided to the container and the lower block, and configured to heat the atomized liquid material flowing through the annular space to generate the process gas. A gas delivery passage is connected to the container to output the process gas from the annular space.

Abstract: A metal-organic vaporizing and feeding apparatus includes: a retention vessel for retaining a metal-organic material; a bubbling gas feeding path connected to the retention vessel, for feeding bubbling gas to the metal-organic material; a metal-organic gas feeding path connected to the retention vessel, for feeding metal-organic gas generated in the retention vessel and dilution gas to a deposition chamber; a dilution gas feeding path connected to the metal-organic gas feeding path, for feeding the dilution gas to the metal-organic gas feeding path; a flow rate regulator provided in the bubbling gas feeding path, for regulating flow rate of the bubbling gas; a pressure regulator for regulating pressure of the dilution gas; and a sonic nozzle disposed in the metal-organic gas feeding path on a downstream side of a connecting position between the metal-organic gas feeding path and the dilution gas feeding path.

Abstract: A vaporizer for generating a process gas from a liquid material includes a container defining a process space of the vaporizer, and an injector having a spray port configured to spray the liquid material in an atomized state downward in the container. A lower block is disposed below the spray port inside the container such that a run-up space for the atomized liquid material is defined between the spray port and the lower block, and an annular space continuous to the run-up space is defined between an inner surface of the container and the lower block. First and second heaters are respectively provided to the container and the lower block, and configured to heat the atomized liquid material flowing through the annular space to generate the process gas. A gas delivery passage is connected to the container to output the process gas from the annular space.

Abstract: An electronic-component holder comprises an image superimposing device comprising a semitransparent mirror 34 and a plane mirror 36 that, in combination, horizontally reflect the images of two objects, one placed over the other, to the same point, an image extracting device 50 that reflects the partial images in the diagonal fields of the image superimposing device in opposite and horizontal directions, and a solid image reproducing device 84 that converts the image from the image extracting device into a picture signal that are disposed between a semiconductor device D and a printed circuit board C that is placed below the semiconductor device D. The image superimposing device combines the image of the lead L.sub.1 on the back of the semiconductor device D and that of the conductor pattern on the front of the printed circuit board C into one composite image.

Abstract: A head case accommodates an axially movable suction nozzle that holds an electric component on a chip by suction at its center. At least four jaws, which are disposed around the center axis of the suction nozzle and adapted to move parallel to the bottom plate of the head case through guide slots radially extending with respect to the same axis, are attached to the bottom plate. Two each of the facing jaws on both sides of the axis are coupled together by means of links and always urged toward the suction nozzle by springs. While expanding rods actuated by pistons open the jaws, the suction nozzle picks up the electric component on a chip by suction. When released on completion of the pick-up, the jaws urged by the springs move an equal distance toward the axis of the suction nozzle parallel to the surface of the bottom plate to squarely hold the four sides of the electric component on a chip, with its center thus held in alignment with the axis of the suction nozzle.