Abstract: A projection exposure apparatus can correct focal point movement caused by an environmental change, such as a change in temperature or atmospheric pressure, during an operation, while minimizing occurrence of a new aberration such as a spherical aberration caused by focus correction. The projection exposure apparatus of this invention exposes a mask pattern on a photosensitive substrate via a projection optical system. The projection optical system includes a refraction or reflection type optical member, and a diffraction type correction optical member. The correction optical member has focal position movement with an environmental change during an operation in a direction opposite to the direction of focal position movement of the optical member with the environmental change during the operation.

Abstract: A projection exposure apparatus includes illuminating optical means for illuminating a projection negative, and projection optical means for projection-exposing the projection negative illuminated by the illuminating optical means onto a substrate, the illuminating optical means including light source means for supplying exposure light, annular light source forming means for forming an annular secondary light source by the light from the light source means, and condenser means for condensing the light beam from the annular light source forming means on the projection negative, and is designed to satisfy the following condition:1/3.ltoreq.d.sub.1 /d.sub.2 .ltoreq.2/3,where d.sub.1 is the inner diameter of the annular secondary light source, and d.sub.2 is the outer diameter of the annular secondary light source.

Abstract: A projection exposure apparatus includes illuminating optical means for illuminating a projection negative, and projection optical means for projection-exposing the projection negative illuminated by the illuminating optical means onto a substrate, the illuminating optical means including light source means for supplying exposure light, annular light source forming means for forming an annular secondary light source by the light from the light source means, and condenser means for condensing the light beam from the annular light source forming means on the projection negative, and is designed to satisfy the following condition:1/3.ltoreq.d.sub.1 /d.sub.2 .ltoreq.2/3,where d.sub.1 is the inner diameter of the annular secondary light source, and d.sub.2 is the outer diameter of the annular secondary light source.

Abstract: A projection exposure apparatus is provided with an illumination optical system for illuminating a reticle having a predetermined pattern and a projection optical system having a predetermined numerical aperture for projecting the predetermined pattern of the reticle illuminated by the illumination optical system onto a wafer surface. The projection optical system is arranged so that, with respect to the focusing of an image of the reticle onto the wafer surface, spherical aberration, which depends on the numerical aperture of the projection optical system, shows a positive tendency corresponding to overcorrection in third-order spherical aberration and a negative tendency corresponding to undercorrection in fifth-order spherical aberration.

Abstract: The present invention provides a projection exposure apparatus comprising: a reticle stage; an illumination optical system for illuminating a reticle on the reticle stage; a stage on which a substrate is supported; and a projection optical system having a predetermined numerical aperture to project a pattern formed on the reticle and illuminated by the illumination optical system onto the substrate, and in which a longitudinal spherial aberration thereof regarding the focusing of the pattern formed on the reticle onto the substrate are excessively corrected.

Abstract: A projection exposure apparatus is provided with an illuminating optical system for illuminating a reticle having a predetermined fine pattern, a projection optical system for projecting the pattern of the reticle onto a wafer, and diaphragm means so constructed as to vary the aperture of a diaphragm of the projection optical system, wherein means for receiving information on the pattern present on the reticle, and means for determining a diaphgram aperture capable of eliminating the high-order diffracted light generated by the pattern of the reticle according to information as stated above and controlling the aperture of variable diaphragm means of the projection optical system, are provided.

Abstract: An exposure method for photolithography comprises the steps of forming a pattern on a substrate by the use of a first exposure apparatus including a first imaging optical system having a reduction magnification 1/.beta.1 and an image circle of a diameter .phi.1, and forming a second pattern on the substrate on which the first pattern has been formed, by the use of a second exposure apparatus including a second imaging optical system having a reduction magnification 1/.beta.2 different from the reduction magnification 1/.beta.1 and an image circle of a diameter .phi.2, wherein when N is an integer, the conditions that .beta.1.times..phi.1=.beta.2.times..phi.2 and .phi.1=N.times..phi.2 are satisfied.

Abstract: An objective lens for microscope of low magnification is of a two-group structure and is composed, in the order from the object side, of a converging front lens group having a meniscus lens component convex toward the object and a converging rear lens group including a positive lens component having a stronger curvature at the image side and a biconvex lens component. The meniscus lens component in the front lens group is composed of a biconvex positive lens and a biconcave negative lens adhered together at an adhered interface convex toward the image side. The lens surface at the object side of the meniscus lens component of the front lens group is convex toward the object side and has a positive refractive power, while the lens surface at the image side of said meniscus lens component is concave toward the image side and has a negative refractive power.

Abstract: An objective lens for microscope includes, in succession from the object side, a first lens group having a cemented meniscus lens component having its concave surface facing the object side, a second lens group having a positive lens component movable in the direction of the optical axis, and a third lens group having a positive refractive power. Thus, by moving the second lens group a predetermined amount along the optical axis in accordance with the thickness of a parallel planar member disposed between the object surface and the objective lens, aberrations varied by the parallel planar member are corrected.