Abstract: The present invention relates to a polyamide resin composition comprising: 100 parts by weight of a polyamide resin mixture comprising (A) 20 to 90% by weight of a polyamide 6 resin, a polyamide 66 resin or mixture thereof and (B) 10 to 80% by weight of an aromatic polyamide resin; and (C) 0 to 300 parts by weight of an inorganic filler, said aromatic polyamide resin being having diamine units comprising 10 to 50 mol % of paraxylylenediamine units and 50 to 90 mol % of methaxylylenediamine units, and aliphatic dicarboxylic acid units.

Abstract: A resin composition comprising predetermined amounts of a specific polyamide resin (A), a modified polyphenylene ether resin (B), a fibrous inorganic filler (C) having an average fiber-diameter of 10 .mu.m or less, a powdery inorganic filler (D) having an average particle diameter of 10 .mu.m or less, an epoxy resin (E) and a copper compound (F-1) and/or a powdery phenolic resin (F-2); a molded article formed from the resin composition; and a lamp reflector formed from the molded article. The molded article formed from the above resin composition can give an automotive lamp reflector excellent in resistance to heat generated when a lamp is on, rigidity at high temperatures, clear reflection performance on a mold article surface, adhesion to deposited aluminum and adhesion to a primer coating composition.

Abstract: A molding polyamide resin composition comprising(A) 50 to 99 parts by weight of a polyamide resin derived from xylylenediamine as a main diamine component and an alpha,omega-straight chain aliphatic dicarboxylic acid as a main dicarboxylic acid component,(B) 1 to 50 parts by weight of polyhexamethyleneadipamide resin,(C) 5 to 85 parts by weight, per 100 parts by weight of components (A) and (B) combined, of a thermosetting resin power having an average particle diameter of 1 to 800 micrometers, and(D) 5 to 200 parts by weight, per 100 parts by weight of components (A) and (B) combined, of glass fibers,the total amount of the polyamide resin components (A) and (B) being 100 parts by weight.

Abstract: A polyphenylene ether resin composition comprising(A) a polyphenylene ether resin modified with a 1,2-substituted olefin compound having an acid anhydride group, the polyphenylene either resin before modification having structural units represented by the following ##STR1## wherein R.sup.1 represents a lower alkyl group having 1 to 3 carbon atoms, and R.sup.2 and R.sup.3, independently from each other, represent a hydrogen atom or a lower alkyl group having 1 to 3 carbon atoms, in the main chain, and(B) a polyamide resin having recurring units represented by the following formula (II)--R.sup.4 --NHCO--R.sup.5 --CONH-- (II)wherein R.sup.4 represents a xylylene group, and R.sup.5 represents a linear alkylene group having 4 to 10 carbon atoms.

Abstract: A resin composition for molding materials, said composition comprising(I) 100 parts by weight of a resin composition composed of(A) 5 to 95 parts by weight of a polyamide resin composed of 1 to 99% by weight of a polyamide resin obtained from xylylenediamine and an alpha, omega-linear aliphatic dibasic acid and 99 to 1% by weight of nylon 66, and(B) 95 to 5 parts by weight of a styrene-acrylonitrile copolymer containing 5 to 50 mole % of acrylonitrile as a copolymer component, and(II) 5 to 150 parts by weight of an inorganic filler.

Abstract: A process for preparing a polyamide is provided. The polyamide is prepared by effecting direct polycondensation reaction of a dicarboxylic acid component containing at least 80 mole % of adipic acid and a diamine component containing at least 70 mole % of m-xylylene diamine under an atmosphere of an inert gas and at atmospheric pressure at a controlled temperature which is higher than the melting point of the dicarboxylic acid component and which can maintain the reaction mixture in a uniformly-fluidized state throughout the reaction.