Abstract: By an offset amount being calculated based on a lateral position deviation from a target travel path at a forward point-of-gaze of a host vehicle at a time of a driver steering state, a series of vehicle control operations until switching back from the driver steering state to an automatic steering control, and traveling along an offset travel path, becomes smoother, whereby comfort when riding in a vehicle is increased.

Abstract: The purpose of the present invention is to: provide an agent that effectively suppresses inhibition of antigen-antibody reaction in an immunoassay using a sample containing a body fluid, in particular, a component derived from a biological mucosal membrane, such as saliva; and to suppress false positive and false negative results in the immunoassay. The present invention provides an agent for suppressing inhibition of immune reaction, characterized in that the agent comprises a compound of the following (1) or (2): (1) Sulfonic acid compound of the formula R1—SO3H or a salt thereof. (In the formula, R1 is selected from the group consisting of: a straight-chain C5-C30 alkyl group; a straight-chain C1-C30 alkyl group substituted with an aryl group having at least one straight-chain C5-C30 alkyl group; and an aryl group having at least one straight-chain C5-C30 alkyl group. These groups may include a substituent group); and (2) Quaternary ammonium ion of the formula N+—R2R3R4R5 or a salt thereof.

Abstract: A semiconductor device according to the present invention includes a mount substrate, an adhesive applied to the mount substrate, and a device having its lower surface bonded to the mount substrate with the adhesive. The surface roughness of a side surface upper portion of the device is lower than that of a side surface lower portion of the device.

Abstract: By using a needle having a flat part on a top surface and concave portions at four corners of the top surface, the semiconductor chip pasted on the adhesive tape is pushed up, and the adhesive tape at four corners of the semiconductor chip are uniformly peeled off. Then, the pickup is performed.

Abstract: By using a needle having a flat part on a top surface and concave portions at four corners of the top surface, the semiconductor chip pasted on the adhesive tape is pushed up, and the adhesive tape at four corners of the semiconductor chip are uniformly peeled off. Then, the pickup is performed.

Abstract: The purpose of the present invention is to: provide an agent that effectively suppresses inhibition of antigen-antibody reaction in an immunoassay using a sample containing a body fluid, in particular, a component derived from a biological mucosal membrane, such as saliva; and to suppress false positive and false negative results in the immunoassay. The present invention provides an agent for suppressing inhibition of immune reaction, characterized in that the agent comprises a compound of the following (1) or (2): (1) Sulfonic acid compound of the formula R1—SO3H or a salt thereof. (In the formula, R1 is selected from the group consisting of: a straight-chain C5-C30 alkyl group; a straight-chain C1-C30 alkyl group substituted with an aryl group having at least one straight-chain C5-C30 alkyl group; and an aryl group having at least one straight-chain C5-C30 alkyl group. These groups may include a substituent group.); and (2) Quaternary ammonium ion of the formula N+—R2R3R4R5 or a salt thereof.

Abstract: A rolled copper foil composed of crystal particles of copper or a copper alloy, wherein an average particle size of the crystal particles composing the outermost surface is not less than 0.2 ?m and not greater than 6 ?m; a ratio of the average particle size of the crystal particles composing the outermost surface to a thickness of the rolled copper foil is not less than 1% and not greater than 6%; and an intragranular distortion rate found by the following formula (1) when a cross-section perpendicular to a length direction of the rolled copper foil is analyzed by electron backscatter diffraction (EBSD) is not less than 0.

Abstract: A metallic material for an electrical electronic includes a CU—Sun alloy layer (2) provided on a conductive base (1). A Cu concentration of the Cu—Sn alloy layer gradually decreases from the base side to the surface (3) side.

Abstract: A semiconductor device according to the present invention includes a mount substrate, an adhesive applied to the mount substrate, and a device having its lower surface bonded to the mount substrate with the adhesive. The surface roughness of a side surface upper portion of the device is lower than that of a side surface lower portion of the device.

Abstract: A method of manufacturing a hydrogen separation membrane with a carrier is characterized by including a first step of providing, between the hydrogen separation membrane and the carrier that supports the hydrogen separation membrane, a low-hardness metal membrane having a hardness that is lower than the hardness of the hydrogen separation membrane, and a second step of joining the hydrogen separation membrane, the low-hardness metal membrane, and the carrier by a cold joining method. In this case, it is possible to suppress the deformation of the hydrogen separation membrane, the low-hardness metal membrane, and the carrier and, as a result, it is possible to prevent damaging of the hydrogen separation membrane. The adhesion of the contact between the hydrogen separation membrane and the carrier is also improved. The result is that it is not necessary to increase the severity of the cold joining conditions.

Abstract: A method and apparatus are provided for a secure interconnect between data modules, including a security apparatus within a secured data interconnect apparatus installed with a security chip. The interconnect apparatus may be authenticated prior to enabling a stacking feature. Authentication of a interconnect apparatus may be used to ensure the quality and performance of the interconnect apparatus and the data modules.

Abstract: A rolled copper foil composed of crystal particles of copper or a copper alloy, wherein an average particle size of the crystal particles composing the outermost surface is not less than 0.2 ?m and not greater than 6 ?m; a ratio of the average particle size of the crystal particles composing the outermost surface to a thickness of the rolled copper foil is not less than 1% and not greater than 6%; and an intragranular distortion rate found by the following formula (1) when a cross-section perpendicular to a length direction of the rolled copper foil is analyzed by electron backscatter diffraction (EBSD) is not less than 0.5% and not greater than 10%.

Abstract: There is provided a novel method for producing a nitride single crystal with both a rapid crystal growth rate and high crystal quality, as well as a novel autoclave that can be used in the method. The invention provides a method for producing a Ga-containing nitride single crystal by an ammonothermal method, comprising introducing at least a starting material, an acidic mineralizer and ammonia into an autoclave, and then growing a Ga-containing nitride single crystal under conditions wherein the temperature (T1) at the single crystal growth site is 600° C. to 850° C., the temperature (T1) at the single crystal growth site and the temperature (T2) at the starting material feeder site are in the relationship T1>T2, and the pressure in the autoclave is 40 MPa to 250 MPa, as well as an autoclave that can be used in the method.

Abstract: A method and apparatus are provided for a secure interconnect between data modules, including a security apparatus within a secured data interconnect apparatus installed with a security chip. The interconnect apparatus may be authenticated prior to enabling a stacking feature. Authentication of a interconnect apparatus may be used to ensure the quality and performance of the interconnect apparatus and the data modules.

Abstract: A connector includes a male terminal and a female terminal. At least one of the male terminal and the female terminal has an outermost surface layer formed of a metallic material as an alloy layer of Cu—Sn. The alloy layer of Cu—Sn has a concentration of Cu decreasing gradually toward a surface thereof. The metallic material for the connector includes the outermost surface layer formed of the alloy layer of Cu—Sn. The alloy layer of Cu—Sn has the concentration of Cu decreasing gradually toward the surface thereof.

Abstract: An operating device for a manual transmission apparatus includes: a plurality of operation shafts, supported at a housing to move in an axial direction thereof and selectively engaging one of a plurality of shift gear sets by one of the plurality of the operation shafts being moved in the axial direction thereof; a shift-and-select shaft, supported at the housing, selecting one of the plurality of the operation shafts by rotating in a circumferential direction of the shift-and-select shaft and moving the selected operation shaft in the axial direction of the selected operation shaft by moving in the axial direction of the shift-and-select shaft; an operating portion for manually operating the shift-and-select shaft; and an inertia unit, including an engagement portion, which is engageable with the shift-and-select shaft, pivotably supported at the housing, and pivoting in response to a movement of the shift-and-select shaft in the axial direction thereof.

Abstract: An operating device for a manual transmission apparatus, comprising a plurality of operation shafts, a shift-and-select shaft having an engagement groove extending in a circumferential direction thereof, selecting one of a plurality of operation shafts by rotating and moving the selected operation shaft in an axial direction thereof by moving in an axial direction of the shift-and-select shaft, an operating portion for manually operating the shift-and-select shaft, an inertia unit including an engagement pin, positioned within the engagement groove and pivoting in response to a movement of the shift-and-select shaft in the axial direction thereof, and a swing-and-contact member provided at the engagement pin of the inertia unit so as to swing when being pressed by one of first and second inner surfaces of the engagement groove in accordance with the movement of the shift-and-select shaft and contacting the first and second inner surfaces of the engagement groove.

Abstract: A printed wiring board and a method for manufacturing the printed wiring board in which widths of a first and a second circuit are close to each other and substantial miniaturization can be achieved. In order to achieve this object, a first circuit and a second circuit having different thicknesses are formed in the same reference plane by etching a metal-clad laminate including a conductive layer and an insulating layer. The thicker of the circuits has a clad-like configuration in which three layers, a first copper layer/a different kind of metal layer/a second copper layer, are sequentially stacked. The manufacture of the printed wiring board includes a clad composite material in which three layers of a first copper layer/a different kind of metal layer/a second copper layer are sequentially stacked as a start material, and selective etching characteristics between the layers are utilized.

Abstract: An execution environment software application allows a computer to function as an identification information storage means for storing identification information about applications, identification information searching means for searching the identification information storage means for the identification information specified by a first application being executed, and an application execution instructing means for delivering predetermined delivery information created depending on the result of the execution of the first application of when the identification information is specified to a second application corresponding to the identification information and giving an instruction to execute the second application using the delivery information.

Abstract: A metal material (10), having an electrical conductive substrate 1; a surface layer 2 having tin or tin alloy formed on the electrical conductive substrate 1; and an organic coating 3 formed on the surface layer 2, organic coating 3 being formed with an organic compound including an ether linking group.