Abstract: An exposure apparatus includes a projection optical system configured to project a pattern of a mask onto a substrate, a substrate stage configured to hold and move the substrate, and a controller configured to control exposure of the substrate held by the substrate stage, wherein the controller obtains an amount of deviation of an image of the pattern projected onto the substrate with respect to the pattern of the mask based on telecentricity information, which is information on telecentricity for respective image heights of the projection optical system, and height information, which is information on the height of a surface of the substrate, and corrects deviation of the image based on the obtained amount of deviation to expose the substrate.

Abstract: An exposure apparatus includes a projection optical system configured to project a pattern of a mask onto a substrate, a substrate stage configured to hold and move the substrate, and a controller configured to control exposure of the substrate held by the substrate stage, wherein the controller obtains an amount of deviation of an image of the pattern projected onto the substrate with respect to the pattern of the mask based on telecentricity information, which is information on telecentricity for respective image heights of the projection optical system, and height information, which is information on the height of a surface of the substrate, and corrects deviation of the image based on the obtained amount of deviation to expose the substrate.

Abstract: The present invention provides a method of forming a first layer including a layout of first shot regions each having a first size and a second layer including a layout of second shot regions each having a second size corresponding to a size including at least two first shot regions to be overlaid on each other, by first processing of forming the first layer in a process including scanning exposure and second processing of forming the second layer, the method including determining, for each of the first shot regions, a scanning direction when performing scanning exposure for the first shot region in the first processing so that combinations each including the scanning directions and the at least two first shot regions included in the second shot region in the first processing are identical in at least some of the second shot regions.

Abstract: A lithography apparatus includes: a stage configured to hold the substrate; a scope configured to measure a position of a mark formed on a surface of the substrate; and a controller configured to control movement of the stage to form the pattern based on the position of the mark. When there is a rotation shift of the surface of the substrate about a first axis of one of X-, Y-, and Z-axes with respect to the stage, the controller estimates the position of the mark in a direction of a second axis perpendicular to the first axis based on an amount of the rotation shift, moves the stage in the direction of the second axis based on the estimated position of the mark, and then measures the position of the mark by the scope.

Abstract: The present invention provides a method of forming a first layer including a layout of first shot regions each having a first size and a second layer including a layout of second shot regions each having a second size corresponding to a size including at least two first shot regions to be overlaid on each other, by first processing of forming the first layer in a process including scanning exposure and second processing of forming the second layer, the method including determining, for each of the first shot regions, a scanning direction when performing scanning exposure for the first shot region in the first processing so that combinations each including the scanning directions and the at least two first shot regions included in the second shot region in the first processing are identical in at least some of the second shot regions.

Abstract: The present invention provides a lithography apparatus which forms a pattern on a substrate, the apparatus comprising a stage holding the substrate and being movable; a measurement unit configured to irradiate a side surface of the stage with light and measure a position of the stage, a generation unit configured to generate a flow of gas in a space where the stage moves, a detection unit configured to detect respective positions of sample shot regions formed on the substrate, and a control unit configured to determine an order of detecting the sample shot regions by the detection unit such that detection by the detection unit is performed sequentially from a sample shot region closer to the measurement unit with respect to sample shot regions located on a downstream side of the flow of the gas from a center of the substrate.

Abstract: The present invention provides a lithography apparatus which forms a pattern on a substrate, including a stage configured to hold the substrate, a substrate transport system configured to transfer the substrate to the stage, an obtaining unit configured to obtain information about a holding state of the substrate on the stage, and a processor configured to perform processing of determining a transport position on the stage when the substrate transport system transfers the substrate to the stage, wherein based on information obtained by the obtaining unit when the stage holds the substrate at each of a plurality of positions on the stage, the processor determines the transport position at which the substrate transport system transfers the substrate to the stage.

Abstract: A lithography apparatus includes: a stage configured to hold the substrate; a scope configured to measure a position of a mark formed on a surface of the substrate; and a controller configured to control movement of the stage to form the pattern based on the position of the mark. When there is a rotation shift of the surface of the substrate about a first axis of one of X-, Y-, and Z-axes with respect to the stage, the controller estimates the position of the mark in a direction of a second axis perpendicular to the first axis based on an amount of the rotation shift, moves the stage in the direction of the second axis based on the estimated position of the mark, and then measures the position of the mark by the scope.

Abstract: The present invention provides a lithography apparatus which forms a pattern on a substrate, the apparatus comprising a stage holding the substrate and being movable; a measurement unit configured to irradiate a side surface of the stage with light and measure a position of the stage, a generation unit configured to generate a flow of gas in a space where the stage moves, a detection unit configured to detect respective positions of sample shot regions formed on the substrate, and a control unit configured to determine an order of detecting the sample shot regions by the detection unit such that detection by the detection unit is performed sequentially from a sample shot region closer to the measurement unit with respect to sample shot regions located on a downstream side of the flow of the gas from a center of the substrate.

Abstract: The present invention provides a lithography apparatus which forms a pattern on a substrate, including a stage configured to hold the substrate, a substrate transport system configured to transfer the substrate to the stage, an obtaining unit configured to obtain information about a holding state of the substrate on the stage, and a processor configured to perform processing of determining a transport position on the stage when the substrate transport system transfers the substrate to the stage, wherein based on information obtained by the obtaining unit when the stage holds the substrate at each of a plurality of positions on the stage, the processor determines the transport position at which the substrate transport system transfers the substrate to the stage.