Patents by Inventor Kazushi Nakamura
Kazushi Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240142519Abstract: In scan testing of semiconductor devices, instantaneous power consumption in both shift and capture modes is efficiently reduced. The scan chain is provided with circuit blocks 1 to 4. Each of the temporary storage flip-flops F1 to F3 is connected between one of the two circuit blocks. Clock generating circuit 10 outputs a clock signal CLK used for the scan test. The clock gating cells GC1 to GC4 takes the clock signal CLK and provides the clock signals CLK1 to CLK4 to circuit blocks 1 to 4 and the clock signals CLK1 to CLK3 to the temporary storage flip-flops F1 to F3. The control circuit 20 controls the clock gating cells GC1 to GC4 so as to operate the circuit blocks 1 to 4 at differing timings from the input-side one by one and simultaneously operate each circuit block and a temporary storage flip-flop connected to the output of each circuit block.Type: ApplicationFiled: September 20, 2023Publication date: May 2, 2024Inventor: Kazushi NAKAMURA
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Patent number: 11784117Abstract: A wiring board includes an insulating substrate including a first surface and a mounting portion for an electronic component on the first surface, the insulating substrate having a rectangular shape in a plan view of the first surface; a via conductor located inside the insulating substrate and at a corner portion of the insulating substrate in a plane perspective, and extending in a thickness direction of the insulating substrate; a wiring conductor located on the first surface and connecting the mounting portion and the via conductor to each other; and a heat dissipation portion located inside the insulating substrate at a position overlapping the mounting portion in a plane perspective view, wherein the first surface includes, between the heat dissipation portion and the via conductor in a plane perspective view, a first region surrounded by the wiring conductor in a plan view.Type: GrantFiled: February 26, 2020Date of Patent: October 10, 2023Assignee: KYOCERA CORPORATIONInventors: Kazushi Nakamura, Hidehisa Umino, Yousuke Moriyama
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Patent number: 11742278Abstract: A wiring substrate includes: an insulating substrate being shaped in a quadrangle in a plan view, including a mounting portion where an electronic component is mounted on a side of a principal surface of the insulating substrate, and having a recess on a side surface thereof; an inner surface electrode which is located on an inner surface of the recess; a via conductor which is located on a corner side of the insulating substrate in a perspective plan view and has both ends located in a thickness direction of the insulating substrate; and a wiring conductor, on the side of the principal surface of the insulating substrate, connecting the mounting portion, the inner surface electrode, and the via conductor, wherein, in a perspective plan view, the wiring conductor has a wiring conductor absent region which surrounds a region located between the mounting portion and the via conductor.Type: GrantFiled: October 31, 2019Date of Patent: August 29, 2023Assignee: KYOCERA CorporationInventors: Kazushi Nakamura, Hidehisa Umino
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Publication number: 20220148956Abstract: A wiring board includes an insulating substrate including a first surface and a mounting portion for an electronic component on the first surface, the insulating substrate having a rectangular shape in a plan view of the first surface; a via conductor located inside the insulating substrate and at a corner portion of the insulating substrate in a plane perspective, and extending in a thickness direction of the insulating substrate; a wiring conductor located on the first surface and connecting the mounting portion and the via conductor to each other; and a heat dissipation portion located inside the insulating substrate at a position overlapping the mounting portion in a plane perspective view, wherein the first surface includes, between the heat dissipation portion and the via conductor in a plane perspective view, a first region surrounded by the wiring conductor in a plan view.Type: ApplicationFiled: February 26, 2020Publication date: May 12, 2022Applicant: KYOCERA CorporationInventors: Kazushi NAKAMURA, Hidehisa UMINO, Yousuke MORIYAMA
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Publication number: 20220077049Abstract: A wiring substrate includes: an insulating substrate being shaped in a quadrangle in a plan view, including a mounting portion where an electronic component is mounted on a side of a principal surface of the insulating substrate, and having a recess on a side surface thereof; an inner surface electrode which is located on an inner surface of the recess; a via conductor which is located on a corner side of the insulating substrate in a perspective plan view and has both ends located in a thickness direction of the insulating substrate; and a wiring conductor, on the side of the principal surface of the insulating substrate, connecting the mounting portion, the inner surface electrode, and the via conductor, wherein, in a perspective plan view, the wiring conductor has a wiring conductor absent region which surrounds a region located between the mounting portion and the via conductor.Type: ApplicationFiled: October 31, 2019Publication date: March 10, 2022Applicant: KYOCERA CorporationInventors: Kazushi NAKAMURA, Hidehisa UMINO
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Patent number: 9347137Abstract: A method of manufacturing an electrode for electrical-discharge surface treatment includes increasing oxygen content in the powder; mixing the powder, in which the oxygen content is increased, with an organic binder and a solvent to prepare a liquid mixture; granulating the powder in the liquid mixture to form granulated powder; and forming the granulated powder to prepare a compact in which an oxygen concentration ranges from 4 weight % to 16 weight %.Type: GrantFiled: September 11, 2006Date of Patent: May 24, 2016Assignees: IHI CORPORATION, Mitsubishi Electric CorporationInventors: Hiroyuki Teramoto, Yukio Sato, Akihiro Suzuki, Akihiro Goto, Kazushi Nakamura
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Patent number: 9234284Abstract: An electrical discharge surface treatment method for forming a coating film by generating a pulsed electrical discharge between an electrode and a workpiece in working fluid or gas using a green compact obtained by molding metal powder or metal alloy powder or a molded body obtained by heating the green compact as the electrode, and by melting an electrode material by an energy of the pulsed electrical discharge, forming a coating of the electrode material or a coating of a material obtained by a reaction of the electrode material by the energy of the pulsed electrical discharge on a surface of the workpiece, the electrical discharge surface treatment method includes generating the pulsed electrical discharge by mixing together two or more types of pulsed electrical discharges having different energies.Type: GrantFiled: August 6, 2008Date of Patent: January 12, 2016Assignee: Mitsubishi Electric CorporationInventors: Akihiro Goto, Kazushi Nakamura, Masahiro Okane, Hiroyuki Teramoto
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Patent number: 8933361Abstract: A microhole electric discharge machining apparatus that forms a conical inverse-tapered hole on a workpiece by a thin wire electrode, includes, an electrode holder that holds an upper part of the thin wire electrode and feeds a lower part of the thin wire electrode downward to stretch the lower part to the workpiece by rotating the thin wire electrode; a first guide member that is arranged near the workpiece upper surface and is provided with a first guide hole through which the thin wire electrode is penetrated on a hole-machining axis; a second guide member that is arranged between the first guide member and the electrode holder and is provided with a second guide hole through which the thin wire electrode is penetrated at a position eccentric from the hole-machining axis; and a swivel driving unit that circularly swivels the second guide member around the hole-machining axis.Type: GrantFiled: July 29, 2008Date of Patent: January 13, 2015Assignee: Mitsubishi Electric CorporationInventors: Satoshi Suzuki, Akihiro Goto, Kazushi Nakamura
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Patent number: 8907243Abstract: The tension measuring unit that measures a physical amount corresponding to tension of a wire in a wire transport system, the fluctuation recording unit that records the physical amount measured by the tension measuring unit, the fluctuation analysis unit that obtains an average value, variation, and frequency analysis data of the recorded physical amount as an analysis result of the physical amount, the maintenance necessity determining unit that compares the analysis result with a reference value and determines whether maintenance is needed based on a comparison result and the display unit that displays a determination result are included, and it is made possible to accurately determine the time for maintenance for various components used in the wire transport system without using a measuring instrument.Type: GrantFiled: April 7, 2009Date of Patent: December 9, 2014Assignee: Mitsubishi Electric CorporationInventors: Kohtaroh Watanabe, Kazushi Nakamura
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Patent number: 8287968Abstract: To form a coating film having an excellent wear-resistant property in a temperature range from low temperature to high temperature a coating-film forming method includes a metal-powder producing step of producing a metal powder containing an element exhibiting a lubricating property when oxidized; an oxidizing step of oxidizing the metal powder so that an amount of oxygen contained in the metal powder is within 6 weight % to 14 weight %; and a coating-film forming step of forming a coating film on a material subject to a treatment, the coating film having such a composition that an area where an oxygen content is 3 weight % or less and an area where an oxygen content is 8 weight % or more are distributed in a unit area of the coating film when the metal powder is in a melted state or a semi-melted state, and an oxygen content of the entire coating film after the metal powder is melted or semi-melted being within 5 weight % to 9 weight %.Type: GrantFiled: April 5, 2006Date of Patent: October 16, 2012Assignees: Mitsubishi Electric Corporation, Ihi CorporationInventors: Akihiro Goto, Masahiro Okane, Kazushi Nakamura, Hiroyuki Teramoto, Hiroyuki Ochiai, Mitsutoshi Watanabe
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Patent number: 8168914Abstract: In an electric discharge machining, in order to reduce damage of an object to be machined and an electrode and to achieve machining velocity enhancement and reduction of electrode wear amount by appropriately controlling a short-circuit current that flows when the electrode and the object to be machined are short-circuited, an electric-discharge-machining power supply apparatus for machining an object to be machined by interrupting every predetermined time period pulse trains that are turned on and off at predetermined timing, to supply electric power to a machining gap between a machining electrode (2) and the object (3) to be machined includes: a short circuit detecting means (11) for detecting a short circuit at the machining gap between the machining electrode (2) and the object (3) to be machined; and a pulse halting means (12) for, when the short circuit detecting means (11) detects a short circuit occurrence at the machining gap, halting generation of particular pulses in the pulse train so as to haltType: GrantFiled: October 27, 2005Date of Patent: May 1, 2012Assignee: Mitsubishi Electric CorporationInventors: Satoshi Suzuki, Kiyohito Oda, Kazushi Nakamura, Akihiro Goto
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Publication number: 20120056133Abstract: An electrode for electrical-discharge surface treatment is made of a compact obtained by forming metal powder, metal compound powder, or conductive ceramics powder. Pulsed discharges between the electrode and a work in a working fluid or in air cause a film to form at the surface of the work, the film being made of a material of the electrode or made of a substance with which the material of the electrode reacts. A resistance of a surface of the electrode measured using a four-terminal method ranges from 5×10?3 ? to 10×10?3 ?, and an oxygen concentration in the electrode ranges from 4 weight % to 10 weight %.Type: ApplicationFiled: October 26, 2011Publication date: March 8, 2012Applicants: IHI CORPORATION, MITSUBISHI ELECTRIC CORPORATIONInventors: Hiroyuki TERAMOTO, Yukio SATO, Akihiro SUZUKI, Akihiro GOTO, Kazushi NAKAMURA
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Publication number: 20120037601Abstract: The tension measuring unit that measures a physical amount corresponding to tension of a wire in a wire transport system, the fluctuation recording unit that records the physical amount measured by the tension measuring unit, the fluctuation analysis unit that obtains an average value, variation, and frequency analysis data of the recorded physical amount as an analysis result of the physical amount, the maintenance necessity determining unit that compares the analysis result with a reference value and determines whether maintenance is needed based on a comparison result and the display unit that displays a determination result are included, and it is made possible to accurately determine the time for maintenance for various components used in the wire transport system without using a measuring instrument.Type: ApplicationFiled: April 7, 2009Publication date: February 16, 2012Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Kohtaroh Watanabe, Kazushi Nakamura
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Publication number: 20110174783Abstract: A microhole electric discharge machining apparatus that forms a conical inverse-tapered hole on a workpiece by a thin wire electrode, includes, an electrode holder that holds an upper part of the thin wire electrode and feeds a lower part of the thin wire electrode downward to stretch the lower part to the workpiece by rotating the thin wire electrode; a first guide member that is arranged near the workpiece upper surface and is provided with a first guide hole through which the thin wire electrode is penetrated on a hole-machining axis; a second guide member that is arranged between the first guide member and the electrode holder and is provided with a second guide hole through which the thin wire electrode is penetrated at a position eccentric from the hole-machining axis; and a swivel driving unit that circularly swivels the second guide member around the hole-machining axis.Type: ApplicationFiled: July 29, 2008Publication date: July 21, 2011Applicant: Mitsubishi Electric CorporationInventors: Satoshi Suzuki, Akihiro Goto, Kazushi Nakamura
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Publication number: 20110135845Abstract: An electrical discharge surface treatment method for forming a coating film by generating a pulsed electrical discharge between an electrode and a workpiece in working fluid or gas using a green compact obtained by molding metal powder or metal alloy powder or a molded body obtained by heating the green compact as the electrode, and by melting an electrode material by an energy of the pulsed electrical discharge, forming a coating of the electrode material or a coating of a material obtained by a reaction of the electrode material by the energy of the pulsed electrical discharge on a surface of the workpiece, the electrical discharge surface treatment method includes generating the pulsed electrical discharge by mixing together two or more types of pulsed electrical discharges having different energies.Type: ApplicationFiled: August 6, 2008Publication date: June 9, 2011Inventors: Akihiro Goto, Kazushi Nakamura, Masahiro Okane, Hiroyuki Teramoto
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Publication number: 20100016185Abstract: To form a coating film having an excellent wear-resistant property in a temperature range from low temperature to high temperature a coating-film forming method includes a metal-powder producing step of producing a metal powder containing an element exhibiting a lubricating property when oxidized; an oxidizing step of oxidizing the metal powder so that an amount of oxygen contained in the metal powder is within 6 weight % to 14 weight %; and a coating-film forming step of forming a coating film on a material subject to a treatment, the coating film having such a composition that an area where an oxygen content is 3 weight % or less and an area where an oxygen content is 8 weight % or more are distributed in a unit area of the coating film when the metal powder is in a melted state or a semi-melted state, and an oxygen content of the entire coating film after the metal powder is melted or semi-melted being within 5 weight % to 9 weight %.Type: ApplicationFiled: April 5, 2006Publication date: January 21, 2010Applicant: Mitsubishi Electric CorporationInventors: Akihiro Goto, Masahiro Okane, Kazushi Nakamura, Hiroyuki Teramoto, Hiroyuki Ochiai, Mitsutoshi Watanabe
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Patent number: 7645958Abstract: In order to obtain an electric-discharge-machining power supply apparatus that can flow discharge current pulses through the machining gap uniformly and efficiently, and can realize reduction of the amount of electrode wear in machining in the alternate current pulse system, in an electric-discharge-machining power supply apparatus (2) for applying electric-discharge-machining pulse voltage to a machining gap between a machining electrode (8) and an object (9) to be machined, wherein a circuit (22) composed of a parallel connection of a rectifying element (24) and a resistive element (23) is inserted in series along a wiring path extending from an electric-discharge pulse generating unit (6) to the machining gap, and the rectifying element (23) is so connected as to cause machining pulse currents to flow in an intended direction during the electric discharge generation.Type: GrantFiled: October 26, 2005Date of Patent: January 12, 2010Assignee: Mitsubishi Electric CorporationInventors: Kiyohito Oda, Satoshi Suzuki, Kazushi Nakamura, Akihiro Goto
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Publication number: 20090127110Abstract: A method of manufacturing an electrode for electrical-discharge surface treatment includes increasing oxygen content in the powder; mixing the powder, in which the oxygen content is increased, with an organic binder and a solvent to prepare a liquid mixture; granulating the powder in the liquid mixture to form granulated powder; and forming the granulated powder to prepare a compact in which an oxygen concentration ranges from 4 weight % to 16 weight %.Type: ApplicationFiled: September 11, 2006Publication date: May 21, 2009Applicants: Mitsubishi Electric Corporation, IHI CorporationInventors: Hiroyuki Teramoto, Yukio Sato, Akihiro Suzuki, Akihiro Goto, Kazushi Nakamura
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Publication number: 20080118664Abstract: In a discharge surface-treatment apparatus a discharge pulse current of a high current value and a short pulse width at least having rising speed equal to or higher than 40 A/?s is applied between an electrode and a workpiece.Type: ApplicationFiled: November 25, 2005Publication date: May 22, 2008Applicants: Mitsubishi Electric Corporation, c/o Ishikawajima-Harima Heavy Industries Co., Ltd.Inventors: Akihiro Goto, Masao Akiyoshi, Kazushi Nakamura, Takashi Furukawa, Hiroyuki Ochiai, Mitsutoshi Watanabe
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Patent number: D604681Type: GrantFiled: March 2, 2009Date of Patent: November 24, 2009Assignee: Honda Motor Co., Ltd.Inventor: Kazushi Nakamura