Patents by Inventor Kazushi Nakamura

Kazushi Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240142519
    Abstract: In scan testing of semiconductor devices, instantaneous power consumption in both shift and capture modes is efficiently reduced. The scan chain is provided with circuit blocks 1 to 4. Each of the temporary storage flip-flops F1 to F3 is connected between one of the two circuit blocks. Clock generating circuit 10 outputs a clock signal CLK used for the scan test. The clock gating cells GC1 to GC4 takes the clock signal CLK and provides the clock signals CLK1 to CLK4 to circuit blocks 1 to 4 and the clock signals CLK1 to CLK3 to the temporary storage flip-flops F1 to F3. The control circuit 20 controls the clock gating cells GC1 to GC4 so as to operate the circuit blocks 1 to 4 at differing timings from the input-side one by one and simultaneously operate each circuit block and a temporary storage flip-flop connected to the output of each circuit block.
    Type: Application
    Filed: September 20, 2023
    Publication date: May 2, 2024
    Inventor: Kazushi NAKAMURA
  • Patent number: 11784117
    Abstract: A wiring board includes an insulating substrate including a first surface and a mounting portion for an electronic component on the first surface, the insulating substrate having a rectangular shape in a plan view of the first surface; a via conductor located inside the insulating substrate and at a corner portion of the insulating substrate in a plane perspective, and extending in a thickness direction of the insulating substrate; a wiring conductor located on the first surface and connecting the mounting portion and the via conductor to each other; and a heat dissipation portion located inside the insulating substrate at a position overlapping the mounting portion in a plane perspective view, wherein the first surface includes, between the heat dissipation portion and the via conductor in a plane perspective view, a first region surrounded by the wiring conductor in a plan view.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: October 10, 2023
    Assignee: KYOCERA CORPORATION
    Inventors: Kazushi Nakamura, Hidehisa Umino, Yousuke Moriyama
  • Patent number: 11742278
    Abstract: A wiring substrate includes: an insulating substrate being shaped in a quadrangle in a plan view, including a mounting portion where an electronic component is mounted on a side of a principal surface of the insulating substrate, and having a recess on a side surface thereof; an inner surface electrode which is located on an inner surface of the recess; a via conductor which is located on a corner side of the insulating substrate in a perspective plan view and has both ends located in a thickness direction of the insulating substrate; and a wiring conductor, on the side of the principal surface of the insulating substrate, connecting the mounting portion, the inner surface electrode, and the via conductor, wherein, in a perspective plan view, the wiring conductor has a wiring conductor absent region which surrounds a region located between the mounting portion and the via conductor.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: August 29, 2023
    Assignee: KYOCERA Corporation
    Inventors: Kazushi Nakamura, Hidehisa Umino
  • Publication number: 20220148956
    Abstract: A wiring board includes an insulating substrate including a first surface and a mounting portion for an electronic component on the first surface, the insulating substrate having a rectangular shape in a plan view of the first surface; a via conductor located inside the insulating substrate and at a corner portion of the insulating substrate in a plane perspective, and extending in a thickness direction of the insulating substrate; a wiring conductor located on the first surface and connecting the mounting portion and the via conductor to each other; and a heat dissipation portion located inside the insulating substrate at a position overlapping the mounting portion in a plane perspective view, wherein the first surface includes, between the heat dissipation portion and the via conductor in a plane perspective view, a first region surrounded by the wiring conductor in a plan view.
    Type: Application
    Filed: February 26, 2020
    Publication date: May 12, 2022
    Applicant: KYOCERA Corporation
    Inventors: Kazushi NAKAMURA, Hidehisa UMINO, Yousuke MORIYAMA
  • Publication number: 20220077049
    Abstract: A wiring substrate includes: an insulating substrate being shaped in a quadrangle in a plan view, including a mounting portion where an electronic component is mounted on a side of a principal surface of the insulating substrate, and having a recess on a side surface thereof; an inner surface electrode which is located on an inner surface of the recess; a via conductor which is located on a corner side of the insulating substrate in a perspective plan view and has both ends located in a thickness direction of the insulating substrate; and a wiring conductor, on the side of the principal surface of the insulating substrate, connecting the mounting portion, the inner surface electrode, and the via conductor, wherein, in a perspective plan view, the wiring conductor has a wiring conductor absent region which surrounds a region located between the mounting portion and the via conductor.
    Type: Application
    Filed: October 31, 2019
    Publication date: March 10, 2022
    Applicant: KYOCERA Corporation
    Inventors: Kazushi NAKAMURA, Hidehisa UMINO
  • Patent number: 9347137
    Abstract: A method of manufacturing an electrode for electrical-discharge surface treatment includes increasing oxygen content in the powder; mixing the powder, in which the oxygen content is increased, with an organic binder and a solvent to prepare a liquid mixture; granulating the powder in the liquid mixture to form granulated powder; and forming the granulated powder to prepare a compact in which an oxygen concentration ranges from 4 weight % to 16 weight %.
    Type: Grant
    Filed: September 11, 2006
    Date of Patent: May 24, 2016
    Assignees: IHI CORPORATION, Mitsubishi Electric Corporation
    Inventors: Hiroyuki Teramoto, Yukio Sato, Akihiro Suzuki, Akihiro Goto, Kazushi Nakamura
  • Patent number: 9234284
    Abstract: An electrical discharge surface treatment method for forming a coating film by generating a pulsed electrical discharge between an electrode and a workpiece in working fluid or gas using a green compact obtained by molding metal powder or metal alloy powder or a molded body obtained by heating the green compact as the electrode, and by melting an electrode material by an energy of the pulsed electrical discharge, forming a coating of the electrode material or a coating of a material obtained by a reaction of the electrode material by the energy of the pulsed electrical discharge on a surface of the workpiece, the electrical discharge surface treatment method includes generating the pulsed electrical discharge by mixing together two or more types of pulsed electrical discharges having different energies.
    Type: Grant
    Filed: August 6, 2008
    Date of Patent: January 12, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Akihiro Goto, Kazushi Nakamura, Masahiro Okane, Hiroyuki Teramoto
  • Patent number: 8933361
    Abstract: A microhole electric discharge machining apparatus that forms a conical inverse-tapered hole on a workpiece by a thin wire electrode, includes, an electrode holder that holds an upper part of the thin wire electrode and feeds a lower part of the thin wire electrode downward to stretch the lower part to the workpiece by rotating the thin wire electrode; a first guide member that is arranged near the workpiece upper surface and is provided with a first guide hole through which the thin wire electrode is penetrated on a hole-machining axis; a second guide member that is arranged between the first guide member and the electrode holder and is provided with a second guide hole through which the thin wire electrode is penetrated at a position eccentric from the hole-machining axis; and a swivel driving unit that circularly swivels the second guide member around the hole-machining axis.
    Type: Grant
    Filed: July 29, 2008
    Date of Patent: January 13, 2015
    Assignee: Mitsubishi Electric Corporation
    Inventors: Satoshi Suzuki, Akihiro Goto, Kazushi Nakamura
  • Patent number: 8907243
    Abstract: The tension measuring unit that measures a physical amount corresponding to tension of a wire in a wire transport system, the fluctuation recording unit that records the physical amount measured by the tension measuring unit, the fluctuation analysis unit that obtains an average value, variation, and frequency analysis data of the recorded physical amount as an analysis result of the physical amount, the maintenance necessity determining unit that compares the analysis result with a reference value and determines whether maintenance is needed based on a comparison result and the display unit that displays a determination result are included, and it is made possible to accurately determine the time for maintenance for various components used in the wire transport system without using a measuring instrument.
    Type: Grant
    Filed: April 7, 2009
    Date of Patent: December 9, 2014
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kohtaroh Watanabe, Kazushi Nakamura
  • Patent number: 8287968
    Abstract: To form a coating film having an excellent wear-resistant property in a temperature range from low temperature to high temperature a coating-film forming method includes a metal-powder producing step of producing a metal powder containing an element exhibiting a lubricating property when oxidized; an oxidizing step of oxidizing the metal powder so that an amount of oxygen contained in the metal powder is within 6 weight % to 14 weight %; and a coating-film forming step of forming a coating film on a material subject to a treatment, the coating film having such a composition that an area where an oxygen content is 3 weight % or less and an area where an oxygen content is 8 weight % or more are distributed in a unit area of the coating film when the metal powder is in a melted state or a semi-melted state, and an oxygen content of the entire coating film after the metal powder is melted or semi-melted being within 5 weight % to 9 weight %.
    Type: Grant
    Filed: April 5, 2006
    Date of Patent: October 16, 2012
    Assignees: Mitsubishi Electric Corporation, Ihi Corporation
    Inventors: Akihiro Goto, Masahiro Okane, Kazushi Nakamura, Hiroyuki Teramoto, Hiroyuki Ochiai, Mitsutoshi Watanabe
  • Patent number: 8168914
    Abstract: In an electric discharge machining, in order to reduce damage of an object to be machined and an electrode and to achieve machining velocity enhancement and reduction of electrode wear amount by appropriately controlling a short-circuit current that flows when the electrode and the object to be machined are short-circuited, an electric-discharge-machining power supply apparatus for machining an object to be machined by interrupting every predetermined time period pulse trains that are turned on and off at predetermined timing, to supply electric power to a machining gap between a machining electrode (2) and the object (3) to be machined includes: a short circuit detecting means (11) for detecting a short circuit at the machining gap between the machining electrode (2) and the object (3) to be machined; and a pulse halting means (12) for, when the short circuit detecting means (11) detects a short circuit occurrence at the machining gap, halting generation of particular pulses in the pulse train so as to halt
    Type: Grant
    Filed: October 27, 2005
    Date of Patent: May 1, 2012
    Assignee: Mitsubishi Electric Corporation
    Inventors: Satoshi Suzuki, Kiyohito Oda, Kazushi Nakamura, Akihiro Goto
  • Publication number: 20120056133
    Abstract: An electrode for electrical-discharge surface treatment is made of a compact obtained by forming metal powder, metal compound powder, or conductive ceramics powder. Pulsed discharges between the electrode and a work in a working fluid or in air cause a film to form at the surface of the work, the film being made of a material of the electrode or made of a substance with which the material of the electrode reacts. A resistance of a surface of the electrode measured using a four-terminal method ranges from 5×10?3 ? to 10×10?3 ?, and an oxygen concentration in the electrode ranges from 4 weight % to 10 weight %.
    Type: Application
    Filed: October 26, 2011
    Publication date: March 8, 2012
    Applicants: IHI CORPORATION, MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hiroyuki TERAMOTO, Yukio SATO, Akihiro SUZUKI, Akihiro GOTO, Kazushi NAKAMURA
  • Publication number: 20120037601
    Abstract: The tension measuring unit that measures a physical amount corresponding to tension of a wire in a wire transport system, the fluctuation recording unit that records the physical amount measured by the tension measuring unit, the fluctuation analysis unit that obtains an average value, variation, and frequency analysis data of the recorded physical amount as an analysis result of the physical amount, the maintenance necessity determining unit that compares the analysis result with a reference value and determines whether maintenance is needed based on a comparison result and the display unit that displays a determination result are included, and it is made possible to accurately determine the time for maintenance for various components used in the wire transport system without using a measuring instrument.
    Type: Application
    Filed: April 7, 2009
    Publication date: February 16, 2012
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kohtaroh Watanabe, Kazushi Nakamura
  • Publication number: 20110174783
    Abstract: A microhole electric discharge machining apparatus that forms a conical inverse-tapered hole on a workpiece by a thin wire electrode, includes, an electrode holder that holds an upper part of the thin wire electrode and feeds a lower part of the thin wire electrode downward to stretch the lower part to the workpiece by rotating the thin wire electrode; a first guide member that is arranged near the workpiece upper surface and is provided with a first guide hole through which the thin wire electrode is penetrated on a hole-machining axis; a second guide member that is arranged between the first guide member and the electrode holder and is provided with a second guide hole through which the thin wire electrode is penetrated at a position eccentric from the hole-machining axis; and a swivel driving unit that circularly swivels the second guide member around the hole-machining axis.
    Type: Application
    Filed: July 29, 2008
    Publication date: July 21, 2011
    Applicant: Mitsubishi Electric Corporation
    Inventors: Satoshi Suzuki, Akihiro Goto, Kazushi Nakamura
  • Publication number: 20110135845
    Abstract: An electrical discharge surface treatment method for forming a coating film by generating a pulsed electrical discharge between an electrode and a workpiece in working fluid or gas using a green compact obtained by molding metal powder or metal alloy powder or a molded body obtained by heating the green compact as the electrode, and by melting an electrode material by an energy of the pulsed electrical discharge, forming a coating of the electrode material or a coating of a material obtained by a reaction of the electrode material by the energy of the pulsed electrical discharge on a surface of the workpiece, the electrical discharge surface treatment method includes generating the pulsed electrical discharge by mixing together two or more types of pulsed electrical discharges having different energies.
    Type: Application
    Filed: August 6, 2008
    Publication date: June 9, 2011
    Inventors: Akihiro Goto, Kazushi Nakamura, Masahiro Okane, Hiroyuki Teramoto
  • Publication number: 20100016185
    Abstract: To form a coating film having an excellent wear-resistant property in a temperature range from low temperature to high temperature a coating-film forming method includes a metal-powder producing step of producing a metal powder containing an element exhibiting a lubricating property when oxidized; an oxidizing step of oxidizing the metal powder so that an amount of oxygen contained in the metal powder is within 6 weight % to 14 weight %; and a coating-film forming step of forming a coating film on a material subject to a treatment, the coating film having such a composition that an area where an oxygen content is 3 weight % or less and an area where an oxygen content is 8 weight % or more are distributed in a unit area of the coating film when the metal powder is in a melted state or a semi-melted state, and an oxygen content of the entire coating film after the metal powder is melted or semi-melted being within 5 weight % to 9 weight %.
    Type: Application
    Filed: April 5, 2006
    Publication date: January 21, 2010
    Applicant: Mitsubishi Electric Corporation
    Inventors: Akihiro Goto, Masahiro Okane, Kazushi Nakamura, Hiroyuki Teramoto, Hiroyuki Ochiai, Mitsutoshi Watanabe
  • Patent number: 7645958
    Abstract: In order to obtain an electric-discharge-machining power supply apparatus that can flow discharge current pulses through the machining gap uniformly and efficiently, and can realize reduction of the amount of electrode wear in machining in the alternate current pulse system, in an electric-discharge-machining power supply apparatus (2) for applying electric-discharge-machining pulse voltage to a machining gap between a machining electrode (8) and an object (9) to be machined, wherein a circuit (22) composed of a parallel connection of a rectifying element (24) and a resistive element (23) is inserted in series along a wiring path extending from an electric-discharge pulse generating unit (6) to the machining gap, and the rectifying element (23) is so connected as to cause machining pulse currents to flow in an intended direction during the electric discharge generation.
    Type: Grant
    Filed: October 26, 2005
    Date of Patent: January 12, 2010
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kiyohito Oda, Satoshi Suzuki, Kazushi Nakamura, Akihiro Goto
  • Publication number: 20090127110
    Abstract: A method of manufacturing an electrode for electrical-discharge surface treatment includes increasing oxygen content in the powder; mixing the powder, in which the oxygen content is increased, with an organic binder and a solvent to prepare a liquid mixture; granulating the powder in the liquid mixture to form granulated powder; and forming the granulated powder to prepare a compact in which an oxygen concentration ranges from 4 weight % to 16 weight %.
    Type: Application
    Filed: September 11, 2006
    Publication date: May 21, 2009
    Applicants: Mitsubishi Electric Corporation, IHI Corporation
    Inventors: Hiroyuki Teramoto, Yukio Sato, Akihiro Suzuki, Akihiro Goto, Kazushi Nakamura
  • Publication number: 20080118664
    Abstract: In a discharge surface-treatment apparatus a discharge pulse current of a high current value and a short pulse width at least having rising speed equal to or higher than 40 A/?s is applied between an electrode and a workpiece.
    Type: Application
    Filed: November 25, 2005
    Publication date: May 22, 2008
    Applicants: Mitsubishi Electric Corporation, c/o Ishikawajima-Harima Heavy Industries Co., Ltd.
    Inventors: Akihiro Goto, Masao Akiyoshi, Kazushi Nakamura, Takashi Furukawa, Hiroyuki Ochiai, Mitsutoshi Watanabe
  • Patent number: D604681
    Type: Grant
    Filed: March 2, 2009
    Date of Patent: November 24, 2009
    Assignee: Honda Motor Co., Ltd.
    Inventor: Kazushi Nakamura