Patents by Inventor Kazushi Sano

Kazushi Sano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7235119
    Abstract: Copper particle clusters constituting a powder suitable for making a conductive paste are provided that are individually composed of not fewer than two and not more than 20 unit particles joined through neck portions. A conductive paste made from the powder is excellent in conductivity. A conductive filler for conductive paste is provided that consists essentially of a mixture of copper particle clusters A individually composed of two or more unit particles joined through neck portions and spherical metallic particles B of smaller diameter than the particles A. A conductive paste made from the filler is low in viscosity and excellent in conductivity.
    Type: Grant
    Filed: March 21, 2005
    Date of Patent: June 26, 2007
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Kazushi Sano, Yoshihiro Okada, Hiromasa Miyoshi, Yoshiomi Takada
  • Patent number: 6923924
    Abstract: Copper particle clusters constituting a powder suitable for making a conductive paste are provided that are individually composed of not fewer than two and not more than 20 unit particles joined through neck portions. A conductive paste made from the powder is excellent in conductivity. A conductive filler for conductive paste is provided that consists essentially of a mixture of copper particle clusters A individually composed of two or more unit particles joined through neck portions and spherical metallic particles B of smaller diameter than the particles A. A conductive paste made from the filler is low in viscosity and excellent in conductivity.
    Type: Grant
    Filed: August 5, 2003
    Date of Patent: August 2, 2005
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Kazushi Sano, Yoshihiro Okada, Hiromasa Miyoshi, Yoshiomi Takada
  • Publication number: 20050161643
    Abstract: Copper particle clusters constituting a powder suitable for making a conductive paste are provided that are individually composed of not fewer than two and not more than 20 unit particles joined through neck portions. A conductive paste made from the powder is excellent in conductivity. A conductive filler for conductive paste is provided that consists essentially of a mixture of copper particle clusters A individually composed of two or more unit particles joined through neck portions and spherical metallic particles B of smaller diameter than the particles A. A conductive paste made from the filler is low in viscosity and excellent in conductivity.
    Type: Application
    Filed: March 21, 2005
    Publication date: July 28, 2005
    Applicant: DOWA MINING CO., LTD.
    Inventors: Kazushi Sano, Yoshihiro Okada, Hiromasa Miyoshi, Yoshiomi Takada
  • Patent number: 6881240
    Abstract: When copper powder manufactured by a wet reduction method is kneaded with resin in a high filling rate, it is difficult to maintain a low viscosity. The invention is to solve the problem of high viscosity without changing the characteristics such as particle size and specific surface area of the copper powder obtained by a wet reduction method. This invention relates to copper powder for an electrically conductive paste wherein copper powder manufactured by a wet reduction method is subjected to a surface-flattening treatment in which the particles are mechanically collided each other.
    Type: Grant
    Filed: December 16, 2002
    Date of Patent: April 19, 2005
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Kazushi Sano, Yoshihiro Okada, Hiromasa Miyoshi
  • Patent number: 6875252
    Abstract: A copper powder is provided that has an average particle diameter in the range of from not less than 0.1 ?m to less than 1.5 ?m, that has a narrow particle size distribution width whose value A defined by Equation (1) below in terms of X25, X50 and X75 defined below is not greater than 1.2, and that forms a pseudo-fused sintered product when held at a temperature of 800° C. under an atmosphere of inert gas at one atmosphere pressure: A=(X75?X25)/X50??(1), where X25, X50 and X75 are values of particle diameter X corresponding to Q %=25%, 50% and 75% on a cumulative particle-size curve plotted in an orthogonal coordinate system whose abcissa represents particle diameter X (?m) and ordinate represents Q % (ratio of particles present of a diameter not greater than the corresponding value of X; expressed in units of vol % of particles). The copper powder is produced by conducting wet reduction of cuprous oxide into metallic copper powder in the presence of ammonia or an ammonium salt.
    Type: Grant
    Filed: August 13, 2002
    Date of Patent: April 5, 2005
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Kazushi Sano, Yoshihiro Okada, Hiromasa Miyoshi, Yoshiomi Takada
  • Publication number: 20040026669
    Abstract: Copper particle clusters constituting a powder suitable for making a conductive paste are provided that are individually composed of not fewer than two and not more than 20 unit particles joined through neck portions. A conductive paste made from the powder is excellent in conductivity. A conductive filler for conductive paste is provided that consists essentially of a mixture of copper particle clusters A individually composed of two or more unit particles joined through neck portions and spherical metallic particles B of smaller diameter than the particles A. A conductive paste made from the filler is low in viscosity and excellent in conductivity.
    Type: Application
    Filed: August 5, 2003
    Publication date: February 12, 2004
    Applicant: DOWA MINING CO., LTD.
    Inventors: Kazushi Sano, Yoshihiro Okada, Hiromasa Miyoshi, Yoshiomi Takada
  • Patent number: 6620344
    Abstract: Copper particle clusters constituting a powder suitable for making a conductive paste are provided that are individually composed of not fewer than two and not more than 20 unit particles joined through neck portions. A conductive paste made from the powder is excellent in conductivity. A conductive filler for conductive paste is provided that consists essentially of a mixture of copper particle clusters A individually composed of two or more unit particles joined through neck portions and spherical metallic particles B of smaller diameter than the particles A. A conductive paste made from the filler is low in viscosity and excellent in conductivity.
    Type: Grant
    Filed: December 21, 2000
    Date of Patent: September 16, 2003
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Kazushi Sano, Yoshihiro Okada, Hiromasa Miyoshi, Yoshiomi Takada
  • Publication number: 20030089199
    Abstract: When copper powder manufactured by a wet reduction method is kneaded with resin in a high filling rate, it is difficult to maintain a low viscosity. The invention is to solve the problem of high viscosity without changing the characteristics such as particle size and specific surface area of the copper powder obtained by a wet reduction method. This invention relates to copper powder for an electrically conductive paste wherein copper powder manufactured by a wet reduction method is subjected to a surface-flattening treatment in which the particles are mechanically collided each other.
    Type: Application
    Filed: December 16, 2002
    Publication date: May 15, 2003
    Inventors: Kazushi Sano, Yoshihiro Okada, Hiromasa Miyoshi
  • Publication number: 20030015062
    Abstract: A copper powder is provided that has an average particle diameter in the range of from not less than 0.1 &mgr;m to less than 1.5 &mgr;m, that has a narrow particle size distribution width whose value A defined by Equation (1) below in terms of X25, X50 and X75 defined below is not greater than 1.2, and that forms a pseudo-fused sintered product when held at a temperature of 800° C.
    Type: Application
    Filed: August 13, 2002
    Publication date: January 23, 2003
    Applicant: Dowa Mining Co., LTD
    Inventors: Kazushi Sano, Yoshihiro Okada, Hiromasa Miyoshi, Yoshiomi Takada
  • Patent number: 6506264
    Abstract: A ferromagnetic powder containing iron as the principal component and containing more than 5 to 50 at. % Co, 0.1 to 30 at. % Al, 0.1 to 10 at. % of a rare earth element inclusive of Y, 0.05% by weight or less of an element belonging to Group 1a of the Periodic Table, and 0.1% by weight or less (inclusive of 0% by weight) of an element belonging to Group 2a of the Periodic Table, the powder comprising flat acicular particles having a mean major axis length of 0.01 to 0.40 &mgr;m and a crystallite diameter as determined by X-ray diffraction (Dx) of 50 to 250 angstrom, provided that the cross section diameter in the minor axis direction cut perpendicular to the major axis has a larger width and a smaller width, and that this cross section ratio in the minor axis direction, which is a larger width to smaller width ratio, uniformly yields a value of greater than 1, preferably 1.5 or higher, and the powder yielding a &sgr;s/Dx ratio of 0.
    Type: Grant
    Filed: August 10, 2000
    Date of Patent: January 14, 2003
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Seiichi Hisano, Kazuhisa Saito, Kazushi Sano, Akio Sawabe, Akito Inoue, Kenichi Inoue
  • Publication number: 20020117652
    Abstract: Silver-dispersed copper powder whose particles have substantially no discrete metallic silver on their surfaces is produced by subjecting a silver-adhered copper powder composed of copper particles having silver adhered to the surfaces thereof to heat treatment in a non-oxidizing atmosphere at a temperature of 150-600° C. A conductive paste using the powder as filler resists migration.
    Type: Application
    Filed: December 21, 2000
    Publication date: August 29, 2002
    Applicant: DOWA MINING CO., LTD.
    Inventors: Kazushi Sano, Yoshihiro Okada, Hiromasa Miyoshi, Yoshiomi Takada
  • Patent number: 6440545
    Abstract: A powder for use in the lower layer of a coating magnetic recording medium, comprising acicular particles with a mean major axis length in a range of from 0.01 to 0.5 &mgr;m and a mean minor axis length in a range of from 0.01 to 0.05 &mgr;m, provided that the acicular particles are flat acicular particles which, when cut in a direction perpendicular to the major axis, uniformly exhibit a cross section having a larger width to smaller width ratio of greater than 1, and that the quantity of discharged H2O at 100° C. is in a range of from 0.1 to 2.0% by weight.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: August 27, 2002
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Seiichi Hisano, Kazuhisa Saito, Kazushi Sano, Yoshichika Horikawa
  • Publication number: 20010003362
    Abstract: Copper particle clusters constituting a powder suitable for making a conductive paste are provided that are individually composed of not fewer than two and not more than 20 unit particles joined through neck portions. A conductive paste made from the powder is excellent in conductivity. A conductive filler for conductive paste is provided that consists essentially of a mixture of copper particle clusters A individually composed of two or more unit particles joined through neck portions and spherical metallic particles B of smaller diameter than the particles A. A conductive paste made from the filler is low in viscosity and excellent in conductivity.
    Type: Application
    Filed: December 21, 2000
    Publication date: June 14, 2001
    Applicant: DOW A MINING CO., LTD.
    Inventors: Kazushi Sano, Yoshihiro Okada, Hiromasa Miyoshi, Yoshiomi Takada
  • Publication number: 20010002558
    Abstract: A copper powder is provided that has an average particle diameter in the range of from not less than 0.1 &mgr;m to less than 1.5 &mgr;m, that has a narrow particle size distribution width whose value A defined by Equation (1) below in terms of X25, X50 and X75 defined below is not greater than 1.2, and that forms a pseudo-fused sintered product when held at a temperature of 800° C.
    Type: Application
    Filed: December 1, 2000
    Publication date: June 7, 2001
    Applicant: DOWA MINING CO., LTD.
    Inventors: Kazushi Sano, Yoshihiro Okada, Hiromasa Miyoshi, Yoshiomi Takada
  • Patent number: 6171692
    Abstract: Iron oxyhydroxide particles that are composed of acicular particles having an average major axis of 0.01 to 0.5 &mgr;m and containing not less than 0.1 wt. % and not more than 30 wt. % of Al in the iron oxyhydroxide and that release not less than 0.1 wt. % and not more than 2 wt. % of H2O at 100° C. are used as particles of a lower layer of a coating type magnetic recording medium having a multi-layer structure. The acicular particles include ones having two or more branches whose branching direction is skewed toward a two-dimensional orientation.
    Type: Grant
    Filed: February 11, 2000
    Date of Patent: January 9, 2001
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Seiichi Hisano, Kazuhisa Saito, Kazushi Sano, Shinichi Konno, Yoshichika Horikawa, Yasuhiko Aihara
  • Patent number: 6040043
    Abstract: Iron oxyhydroxide particles that are composed of acicular particles having an average major axis of 0.01 to 0.5 .mu.m and containing not less than 0.1 wt. % and not more than 30 wt. % of Al in the iron oxyhydroxide and that release not less than 0.1 wt. % and not more than 2 wt. % of H.sub.2 O at 100.degree. C. are used as particles of a lower layer of a coating type magnetic recording medium having a multi-layer structure. The acicular particles include ones having two or more branches whose branching direction is skewed toward a two-dimensional orientation.
    Type: Grant
    Filed: November 20, 1997
    Date of Patent: March 21, 2000
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Seiichi Hisano, Kazuhisa Saito, Kazushi Sano, Shinichi Konno, Yoshichika Horikawa, Yasuhiko Aihara
  • Patent number: 5902676
    Abstract: A coating type magnetic recording medium having a multilayer structure exhibits excellent strength, surface smoothness, and weather resistance is formed on a substrate, and comprises a magnetic layer of magnetic particles dispersed in a resinous binder, and a non-magnetic layer of non-magnetic particles dispersed in a resinous binder. The magnetic particles are composed of acicular ferromagnetic metal particles of Fe containing Co, Al, rare earth elements, periodic table group 1a and 2a elements. The non-magnetic particles are composed of acicular particles of .alpha.-FeOOH.
    Type: Grant
    Filed: August 27, 1997
    Date of Patent: May 11, 1999
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Seiichi Hisano, Kazuhisa Saito, Kazushi Sano, Shinichi Konno, Yoshichika Horikawa, Yasuhiko Aihara
  • Patent number: 5591535
    Abstract: There is provided an accicular ferromagnetic metal powder with which one can produce magnetic media for high-density recording that are improved in storage stability and magnetic characteristics.The improved ferromagnetic metal powder essentially consists of iron and 50 atm % based on the amount of iron of cobalt and at least one of aluminum and yttrium or any other rare earth element and contains no more than 0.05 wt % of an element of Group Ia of the periodic table (Li, Na, K). The amount of aluminum is in the range of 0.1-30 atm %, the amount of yttrium or any other rare earth element is in the range of and 0.1-10 atm %, each being based on the total quantity of the metal elements present. In either of these cases, the residue of an element of Group IIa of the periodic table (Mg, Ca, Sr, Ba) is preferably 0.1 wt % or less.
    Type: Grant
    Filed: May 1, 1995
    Date of Patent: January 7, 1997
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Seiichi Hisano, Kazuhisa Saito, Satoshi Aizawa, Kazushi Sano, Kazuyuki Matsumoto, Kenji Murata
  • Patent number: 5534361
    Abstract: There is provided a metallic magnetic powder with which one can produce magnetic media for high-density recording that are improved in storage stability and magnetic characteristics.The improved ferromagnetic metal powder contains no more than 0.05 wt % of an element of Group Ia of the periodic table. The powder may optionally contain 0.1-30 atm % of aluminum and/or 0.1-10 atm % of Y or any other rare earth element based on the total quantity of the metal elements present. In either of these cases, the residue of an element of Group IIa of the periodic table is preferably 0.1 wt % or less.
    Type: Grant
    Filed: June 27, 1994
    Date of Patent: July 9, 1996
    Assignee: Dowa Mining Co., Ltd.
    Inventors: Seiichi Hisano, Kazuhisa Saito, Satoshi Aizawa, Kazushi Sano, Kazuyuki Matsumoto, Kenji Murata