Abstract: A semiconductor-device manufacturing method includes forming an element separating insulating film on a semiconductor substrate; forming a gate multilayer film for forming a gate electrode thereon; removing the gate multilayer film in an alignment mark forming area positioned on the element separating insulating film; forming a pattern of a first conductive film in the element forming area; forming an alignment mark of the first conductive film, used in photolithography, in the alignment mark forming area surrounded by the gate multilayer film; forming an inter-layer insulating film thereon; removing the inter-layer insulating film in the alignment mark forming area, so that it remains on the gate multilayer film around the alignment mark forming area; removing or thinning the element separating insulating film around the alignment mark; and forming a pattern of a second conductive film on the inter-layer insulating film by performing alignment of the photolithography by using the alignment mark.

Abstract: In a pressure sensor which has a metal housing 12 containing a sensor chip 11 and a joint housing 14 and in which an insulating member 15 is arranged to electrically insulate both of the metal housing 12 and the joint housing 14 from each other, the metal housing 12 is connected to a stable potential such as, for example, a sensor power supply or a sensor ground. Thus, there can be solved a problem that the detection signal is liable to be influenced by electric noise from outside where a signal line of the pressure sensor and the sensor housing are electrically suspended or unfixed.

Abstract: An object of the present inventions is to overcome a problem that the presence of a metal film, which is opaque to a visible light, between a lower layer alignment mark and a photoresist prevents the detection of the lower layer alignment mark, to make the pattern formation difficult. In the present inventions, an insulating film is placed beneath the alignment mark in structure; an alignment mark consisting of said multi-layered film comprising an alignment mark layer and the insulating film, which constitutes a stepped part with an increased difference in level, is first formed, inside a mark hole, in a manner of self-alignment; and then the metal film which is the very cause of the above problem is formed thereon. Since the metal film itself has a stepped shape corresponding to the alignment mark, alignment can be made with great accuracy.

Abstract: A pressure sensor is provided with a semiconductor device that is capable of detecting a pressure, a terminal that is connected to the semiconductor device by a bonding wire, a housing having an accommodation space for the semiconductor device, the bonding wire, and the terminal, a diaphragm for sealing the accommodation space, and working fluid that is sealed in the accommodation space and transmits a pressure applied to the diaphragm to the semiconductor device. The working fluid is silicone-based oil, and the terminal and the housing are sealed by fluorine-based adhesive.

Abstract: A pressure sensor is composed of a pressure housing having a pressure chamber inside and a pressure sensitive element arranged in the pressure chamber, and a joint housing having a fluid passage for leading fluid into the pressure housing, wherein the pressure housing and the joint housing are jointed by brazing with an insulating member interposed at a joint section therebetween. A stress relieving member is interposed at least either between the metal housing and the insulating member or between the joint housing and the insulating member, so that the insulating member can be relieved of a stress which is caused by the braze jointing to act on the insulating member.

Abstract: In a pressure sensor which has a metal housing 12 containing a sensor chip 11 and a joint housing 14 and in which an insulating member 15 is arranged to electrically insulate both of the metal housing 12 and the joint housing 14 from each other, the metal housing 12 is connected to a stable potential such as, for example, a sensor power supply or a sensor ground. Thus, there can be solved a problem that the detection signal is liable to be influenced by electric noise from outside where a signal line of the pressure sensor and the sensor housing are electrically suspended or unfixed.

Abstract: A core having a coil wound thereon is fixed to a base at the bottom. The base is fixed to a case made of synthetic resin by insert molding. A diaphragm is fixed to the case in circumference, and also a magnetic flux guide member is fixed to the case in circumference. Since the diaphragm and the magnetic flux guide member is commonly fixed to the case, no variation in the distance between the diaphragm and the magnetic flux guide member would occur for every product. Further, a gap L is formed between the magnet and the magnetic flux guide member, and an air hole is formed in the magnetic flux guide member. This improves the passage of air and reduces air dumper effect without modifying the magnet in shape.

Abstract: A pressure sensor is provided with a semiconductor device that is capable of detecting a pressure, a terminal that is connected to the semiconductor device by a bonding wire, a housing having an accommodation space for the semiconductor device, the bonding wire, and the terminal, a diaphragm for sealing the accommodation space, and working fluid that is sealed in the accommodation space and transmits a pressure applied to the diaphragm to the semiconductor device. The working fluid is silicone-based oil, and the terminal and the housing are sealed by fluorine-based adhesive.

Abstract: There is provided a method of reducing biofilm formation by biofilm-forming bacterial strains such as E. coli, Salmonella, Klebsiella, or a related gamma proteobacteria. CsrA activity levels in the cell may be modulated to impact biofilm formation and glycogen metabolism. CsrA levels may be modulated by modulating the expression of csrB RNA and UvrY and BarA gene products. By increasing levels of CsrB, BarA or SdiA in a bacterial cell or increasing the rate of UvrY phosphorylation, one can increase the levels of active UvrY in the strain. There is also provided a modulator of CsrA activity in a bacteria comprising a nucleotide sequence containing the sequence element CAGGAUG.

Abstract: An electroacoustic transducer (1) includes a diaphragm (20) made of magnetic material and spaced from the forward end of the magnetic core; a magnet (25); a coil (23) wound around the magnetic core (22) and supplying an oscillating magnetic field to the diaphragm; a support ring (26) which supports the diaphragm (20); a lower housing (30) which accommodates members; an upper housing (10) attached to the upper housing (10). Coil spring-like terminals (52) are attached to terminal accommodating portions (5 Ga) which are opened in the bottom face of the lower housing (30). Lead wires (23a) and (23b) of the coil (23) are directly connected to the terminals (52), respectively. The terminal accommodating portions (50a) are sealed by a soldering process.

Abstract: A core having a coil wound thereon is fixed to a base at the bottom. The base is fixed to a case made of synthetic resin by insert molding. A diaphragm is fixed to the case in circumference, and also a magnetic flux guide member is fixed to the case in circumference. Since the diaphragm and the magnetic flux guide member is commonly fixed to the case, no variation in the distance between the diaphragm and the magnetic flux guide member would occur for every product. Further, a gap L is formed between the magnet and the magnetic flux guide member, and an air hole is formed in the magnetic flux guide member. This improves the passage of air and reduces air dumper effect without modifying the magnet in shape.

Abstract: The method for preparation of sintered permanent magnets according to the present invention comprises the steps of: mixing fully fine powder of a crystalline mother alloy for permanent magnet containing a rare-earth element, Fe and B as the essential components with fine powder of zinc oxide, compaction molding the resulted mixture in the presence of a magnetic field, sintering the compacted mixture in vacuum to cause generation of oxygen and metallic zinc by thermal decomposition of the zinc oxide; segregation of a part of metallic component in the mother alloy at the boundary and inside of the mother alloy crystal; formation of amorphous metallic oxide by forced oxidation of the segregated metal with the generated oxygen; crystallization of the amorphous metallic oxide; formation of an epitaxial junction between the crystallized metallic oxide and the mother alloy crystal; and evaporation of the metallic zinc into the vacuum, and quenching the sintered compact.

Abstract: An electroacoustic transducer 1 includes a diaphragm 20 made of magnetic material and spaced from the forward end of the magnetic core; a magnet 25; a coil 23 wound around the magnetic core 22 and supplying an oscillating magnetic field to the diaphragm; a support ring 26 which supports the diaphragm 20; a lower housing 30 which accommodates members; an upper housing 10 attached to the upper housing 10. Coil spring-like terminals 52 are attached to terminal accommodating portions 50a which are opened in the bottom face of the lower housing 30. Lead wires 23a and 23b of the coil 23 are directly connected to the terminals 52, respectively. The terminal accommodating portions 50a are sealed by a soldering process.

Abstract: An electroacoustic transducer 1 comprises a base 24 made of a magnetic material, a magnetic core 22 erected on the base 24, a diaphragm 20 made of a magnetic material and spaced from the magnetic core 22, a magnet 25 constituting a magnetic circuit together with the base 24, the magnetic core 22, and the diaphragm 20 and supplying a static magnetic field, a coil 23 placed around the magnetic core 22 for supplying an oscillating magnetic field to the magnetic circuit, a support ring 26 for supporting the diaphragm 20, a lower housing 30 for accommodating such members, and an upper housing member 10 press-fitted over the entire periphery of the support ring 26.

Abstract: In an electroacoustic transducer having an outer case integral with lead terminals and a drive section including a coil disposed in the outer case with both coil terminals of the coil being led out on and connected to lands of the lead terminals, the lands are formed in approximately circular shapes.

Abstract: The invention provides a miniaturized and low-profile electroacoustic transducer. In the electroacoustic transducer, a space is formed underneath a magnet by diminishing a vertical thickness of the magnet in comparison with the height of a magnetic core, and also by disposing the magnet at a position trensversely aligned to an upper portion of the magnetic core, so that the space is utilized as a part of a back space at the back of a diaphragm, and for connection of terminals of a coil with external terminals, thereby realizing miniaturization and flattening in the shape of the electroacoustic transducer.

Abstract: An electroacoustic transducer has lead terminals formed of an alloy consisting of 32 to 55% by weight of Ni and a remainder essentially of Fe, and having a crystal grain size of 7.0 or greater. In an electroacoustic transducer, both coil terminals of the coil are connected to the associated lands of the lead terminals, and thermal conduction suppressing sections are provided at proximal end sides of lands of the lead terminals for suppressing thermal conduction.

Abstract: A method of ultrasonic welding for a resin case in which an ultrasonic vibration is applied to the resin case in a direction parallel to the welding surface.

Abstract: A terminal connection method of a coil comprises the steps of arranging coil terminals of a coil on lead terminals; removing insulating coats of the coil terminals to expose core wires; and applying an electric conductivity adhesive to connected portions of the coil terminals and the lead terminals. A terminal connection structure of a coil comprises coil terminals arranged on lead terminals, with insulating coats removed from the coil terminals; and an electric conductivity adhesive applied to connected portions of the coil terminals and the lead terminals.