Abstract: A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, and a control unit that determines a mounting state of another component mounted in advance around the mounting position based on height information of a region around the mounting position.

Abstract: A component mounting device includes a head unit including a mounting head configured to mount a component on a substrate, and an imaging unit provided on the head unit and configured to image at least one of a suction position of the component to be suctioned by the mounting head and a mounting position of the component mounted by the mounting head from a plurality of directions, such that the imaging unit is configured to capture a first image and a second image. The component mounting device is configured to expand or contract the first image captured by the imaging unit in accordance with an imaging direction of the second image, and acquire a height position of an imaged location based on the first image that has been expanded or contracted and the second image.

Abstract: A component mounting device for mounting a component on a substrate includes a head unit, a driver to move the head unit on a stage, and a controller. The head unit includes a mounting head to hold the component and a stereo camera to capture a three-dimensional image of an object. The controller performs image capturing, calculating and mounting processes. The image capturing captures an image of a relevant area including a mounting point on the substrate by the stereo cameras before the component reaches the mounting point. The calculating calculates a correction amount with respect to X, Y and Z axes directions based on three-dimensional information on the relevant area with respect to the directions obtained in the image capturing process to mount the component on lands corresponding to the mounting point. The mounting includes correcting the mounting point based on the correction amount and mounting the component.

Abstract: A component mounting device includes a head unit including a mounting head configured to mount a component on a substrate, a component feeder configured to feed the component to the mounting head, and an imager provided on the head unit and configured to be able to image a component feeding location of the component feeder from a plurality of directions. The component mounting device further includes a controller configured to acquire a horizontal position and a vertical height position of the component at the component feeding location based on images of the component feeding location captured from the plurality of directions by the imager.

Abstract: A component mounting device includes a mounting portion that mounts a component on a bonding material disposed on a substrate, and a measurement unit that measures a state of the bonding material at least after an operation of mounting the component performed by the mounting portion. The component mounting device further includes a control unit that verifies the state of the bonding material based on a measurement result obtained by the measurement unit when defective mounting of the component has occurred.

Abstract: A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, an imaging unit capable of imaging the mounting position from a plurality of fields of view, imaging directions of which are different from each other, and a controller that selects a success or failure determination field of view used for success or failure determination of whether or not the component has been mounted at the mounting position from the plurality of fields of view according to a state of a shield around the mounting position.

Abstract: A component mounting device for mounting a component on a substrate includes a head unit, a driver to move the head unit on a stage, and a controller. The head unit includes a mounting head to hold the component and a stereo camera to capture a three-dimensional image of an object. The controller performs image capturing, calculating and mounting processes. The image capturing captures an image of a relevant area including a mounting point on the substrate by the stereo cameras before the component reaches the mounting point. The calculating calculates a correction amount with respect to X, Y and Z axes directions based on three-dimensional information on the relevant area with respect to the directions obtained in the image capturing process to mount the component on lands corresponding to the mounting point. The mounting includes correcting the mounting point based on the correction amount and mounting the component.

Abstract: A substrate working system includes a component mounter that mounts a component on a substrate, and an inspection unit provided in the component mounter or a device downstream of the component mounter and that performs a substrate inspection different from a normal substrate inspection when an abnormality related to a mounting operation is detected in the component mounter.

Abstract: A component mounting device includes a control unit that at least controls an imaging portion to image a vicinity of a mounting position during movement of a mounting head, acquires height information in the vicinity of the mounting position based on an imaging result of the imaging portion, and corrects a target lowering position of the mounting head based on the acquired height information in the vicinity of the mounting position.

Abstract: A component mounting device includes a head unit including a mounting head configured to mount a component on a substrate, and an imaging unit provided on the head unit and configured to image at least one of a suction position of the component to be suctioned by the mounting head and a mounting position of the component mounted by the mounting head from a plurality of directions, such that the imaging unit is configured to capture a first image and a second image. The component mounting device is configured to expand or contract the first image captured by the imaging unit in accordance with an imaging direction of the second image, and acquire a height position of an imaged location based on the first image that has been expanded or contracted and the second image.

Abstract: A component mounting device includes a controller that controls an imaging unit to image a predetermined region during a period from a time point at which a head finishes mounting a component at a mounting position to a time point at which the head completes upward movement from the mounting position, and acquires information about a height of the mounting position based on an imaging result of the predetermined region imaged by the imaging unit. The controller further determines whether or not the component has been successfully mounted at the mounting position based on the acquired information about the height of the mounting position.

Abstract: A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, an imaging section capable of imaging the mounting position on the substrate, and a controller that determines a mounting state by comparing images of the mounting position before and after mounting of the component captured by the imaging section. The controller is configured to determine the mounting state by comparing the images before and after mounting of the component during operation from completion of mounting of the component to completion of mounting of a subsequent component.

Abstract: A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, an imaging section capable of imaging the mounting position on the substrate, and a controller that determines a mounting state by comparing images of the mounting position before and after mounting of the component captured by the imaging section. The controller is configured to determine the mounting state by comparing the images before and after mounting of the component during operation from completion of mounting of the component to completion of mounting of a subsequent component.

Abstract: A component mounting device includes a head unit including a mounting head configured to mount a component on a substrate, a component feeder configured to feed the component to the mounting head, and an imager provided on the head unit and configured to be able to image a component feeding location of the component feeder from a plurality of directions. The component mounting device further includes a controller configured to acquire a horizontal position and a vertical height position of the component at the component feeding location based on images of the component feeding location captured from the plurality of directions by the imager.

Abstract: A substrate working system includes a component mounter that mounts a component on a substrate, and an inspection unit provided in the component mounter or a device downstream of the component mounter and that performs a substrate inspection different from a normal substrate inspection when an abnormality related to a mounting operation is detected in the component mounter.

Abstract: A component mounting device includes a mounting portion that mounts a component on a bonding material disposed on a substrate, and a measurement unit that measures a state of the bonding material at least after an operation of mounting the component performed by the mounting portion. The component mounting device further includes a control unit that verifies the state of the bonding material based on a measurement result obtained by the measurement unit when defective mounting of the component has occurred.

Abstract: A component mounting device includes a control unit that at least controls an imaging portion to image a vicinity of a mounting position during movement of a mounting head, acquires height information in the vicinity of the mounting position based on an imaging result of the imaging portion, and corrects a target lowering position of the mounting head based on the acquired height information in the vicinity of the mounting position.

Abstract: A component mounting device includes a controller that controls an imaging unit to image a predetermined region during a period from a time point at which a head finishes mounting a component at a mounting position to a time point at which the head completes upward movement from the mounting position, and acquires information about a height of the mounting position based on an imaging result of the predetermined region imaged by the imaging unit. The controller further determines whether or not the component has been successfully mounted at the mounting position based on the acquired information about the height of the mounting position.

Abstract: A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, and a control unit that determines a mounting state of another component mounted in advance around the mounting position based on height information of a region around the mounting position.

Abstract: A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, an imaging section capable of imaging the mounting position on the substrate, and a controller that determines a mounting state by comparing images of the mounting position before and after mounting of the component captured by the imaging section. The controller is configured to determine the mounting state by comparing the images before and after mounting of the component during operation from completion of mounting of the component to completion of mounting of a subsequent component.