Patents by Inventor Kazushi Yawata

Kazushi Yawata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8802268
    Abstract: Provide an electrochemical device offering a large capacity per current collector and a low internal resistance, which is also easy to assemble. Provided is a laminated sheet body 16S by inserting a negative-electrode continuous body 11BW between an adjacent pair of first current collectors 12a, 12a with their first current collector main units 12a1 connected together, and also between an adjacent pair of first current collectors 12a, 12a with their first tabs 12a2 connected together, with respect to a plurality of positive electrodes 11A arranged in the width direction apart from each other, after which the negative-electrode continuous body of the laminated sheet body is cut to the unit width dimension of an element to obtain a plurality of laminated bodies 16.
    Type: Grant
    Filed: March 16, 2010
    Date of Patent: August 12, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Naoto Hagiwara, Katsuei Ishida, Kazushi Yawata
  • Patent number: 8765277
    Abstract: Provided is an electrochemical device which is compatible with high-temperature reflow soldering using lead-free solder. An electric double-layer capacitor 10-1 has a structure in which a positive terminal 12 and a negative terminal 13 are led out of a package 14 where an electric storage element 11 is sealed. The entire package 14 and the bases of led-out portions of the positive terminal 12 and the negative terminal 13 are covered by a thermal insulation material layer 16 having a thermal conductivity lower than that of the package 14.
    Type: Grant
    Filed: May 7, 2009
    Date of Patent: July 1, 2014
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Kazushi Yawata, Motoki Kobayashi, Katsuei Ishida, Naoto Hagiwara
  • Patent number: 8619409
    Abstract: An electrochemical device, e.g., an electric double layer capacitor, is applicable to high-temperature reflow soldering wherein a lead-free solder is used, and is provided with an electric storage element, a package having the electric storage element sealed therein, and a positive electrode terminal and a negative electrode terminal, each of which is led out from the electric storage element and is provided with a part sealed in the package with the electric storage element and other part led out to the outside the package. On a part of the positive electrode terminal and on a part of the negative electrode terminal, increased thermal resistance sections for suppressing heat transfer to the electric storage element via the terminals from other parts of the positive electrode terminal and other parts of the negative electrode terminal are arranged, respectively.
    Type: Grant
    Filed: September 30, 2009
    Date of Patent: December 31, 2013
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Kazushi Yawata, Naoto Hagiwara, Katsuei Ishida
  • Patent number: 8536465
    Abstract: Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 10-1 includes a package 14 that is constructed with a film or films and has sealed parts 14a1 to 14a3 formed by sealing parts, in which films are superimposed on each other, by, for example, heat sealing. The entireties of the sealed parts 14a1 to 14a3 of the package 14 are covered in a close-contact state with a support 16 that has higher rigidity than the film(s) constructing the package 14.
    Type: Grant
    Filed: March 16, 2009
    Date of Patent: September 17, 2013
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Naoto Hagiwara, Katsuei Ishida, Kazushi Yawata, Motoki Kobayashi
  • Patent number: 8455136
    Abstract: An electrochemical device capable of being mounted by soldering includes a film package made of a film; an electrodes part encapsulated together with an electrolyte in said film package; a pair of terminals, one end of each terminal being connected to said electrodes part and another end of each terminal being exposed to an exterior of said film package; and an armor in contact with a substantially entire surface of said film package and in contact with partial surfaces of the exposed ends of said pair of terminals, respectively, to encapsulate said film package, said armor exposing remaining portions of said pair of terminals to an exterior of the armor.
    Type: Grant
    Filed: August 10, 2009
    Date of Patent: June 4, 2013
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Katsuei Ishida, Kazushi Yawata, Naoto Hagiwara, Motoki Kobayashi
  • Publication number: 20120040231
    Abstract: Provide an electrochemical device offering a large capacity per current collector and a low internal resistance, which is also easy to assemble. Provided is a laminated sheet body 16S by inserting a negative-electrode continuous body 11BW between an adjacent pair of first current collectors 12a, 12a with their first current collector main units 12a1 connected together, and also between an adjacent pair of first current collectors 12a, 12a with their first tabs 12a2 connected together, with respect to a plurality of positive electrodes 11A arranged in the width direction apart from each other, after which the negative-electrode continuous body of the laminated sheet body is cut to the unit width dimension of an element to obtain a plurality of laminated bodies 16.
    Type: Application
    Filed: March 16, 2010
    Publication date: February 16, 2012
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Naoto Hagiwara, Katsuei Ishida, Kazushi Yawata
  • Publication number: 20110252615
    Abstract: There are provided a porous plate dielectric substance, pillar-shaped electrodes respectively formed in pores belonging to a first group and pores belonging to a second group alternately arranged on the dielectric substance, insulator layers made of an organic insulator formed on tips of pillar-shaped electrodes in the pores of the first and second groups so as to fill the pores and hide electrodes respectively provided on one principal surface and another principal surface of the dielectric substance and connected to base ends of the pillar-shaped electrodes.
    Type: Application
    Filed: May 20, 2011
    Publication date: October 20, 2011
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kazushi YAWATA, Hidetoshi MASUDA, Masaru KUROSAWA, Kotaro MIZUNO
  • Patent number: 8027145
    Abstract: There are provided a porous plate dielectric substance, pillar-shaped electrodes respectively formed in pores belonging to a first group and pores belonging to a second group alternately arranged on the dielectric substance, insulator layers made of an organic insulator formed on tips of pillar-shaped electrodes in the pores of the first and second groups so as to fill the pores and hide electrodes respectively provided on one principal surface and another principal surface of the dielectric substance and connected to base ends of the pillar-shaped electrodes.
    Type: Grant
    Filed: July 29, 2008
    Date of Patent: September 27, 2011
    Assignee: Taiyo Yuden Co., Ltd
    Inventors: Kazushi Yawata, Hidetoshi Masuda, Masaru Kurosawa, Kotaro Mizuno
  • Publication number: 20110176254
    Abstract: Provided is an electrochemical device applicable to high-temperature reflow soldering wherein a lead-free solder is used. An electric double layer capacitor (10) is provided with a capacitor element (11), a package (14) having the capacitor element (11) sealed therein, and a positive electrode terminal (12) and a negative electrode terminal (13), each of which is led out from the capacitor element and is provided with a part sealed in the package (14) with the capacitor element and other part led out to the outside the package. On a part of the positive electrode terminal (12) and on a part of the negative electrode terminal (13), increased thermal resistance sections (HR1) for suppressing heat transfer to the capacitor element (11) via the terminals (12, 13) from other parts of the positive electrode terminal (12) and other parts of the negative electrode terminal (13) are arranged, respectively.
    Type: Application
    Filed: September 30, 2009
    Publication date: July 21, 2011
    Applicant: Taiyo Yuden Co., Ltd.
    Inventors: Kazushi Yawata, Naoto Hagiwara, Katsuei Ishida
  • Publication number: 20110056737
    Abstract: Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 10-1 includes a package 14 that is constructed with a film or films and has sealed parts 14a1 to 14a3 formed by sealing parts, in which films are superimposed on each other, by, for example, heat sealing. The entireties of the sealed parts 14a1 to 14a3 of the package 14 are covered in a close-contact state with a support 16 that has higher rigidity than the film(s) constructing the package 14.
    Type: Application
    Filed: March 16, 2009
    Publication date: March 10, 2011
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Naoto Hagiwara, Katsuei Ishida, Kazushi Yawata, Motoki Koyabashi
  • Publication number: 20110045327
    Abstract: Provided is an electrochemical device which is compatible with high-temperature reflow soldering using lead-free solder. An electric double-layer capacitor 10-1 has a structure in which a positive terminal 12 and a negative terminal 13 are led out of a package 14 where an electric storage element 11 is sealed. The entire package 14 and the bases of led-out portions of the positive terminal 12 and the negative terminal 13 are covered by a thermal insulation material layer 16 having a thermal conductivity lower than that of the package 14.
    Type: Application
    Filed: May 7, 2009
    Publication date: February 24, 2011
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kazushi Yawata, Motoki Kobayashi, Katsuei Ishida, Naoto Hagiwara
  • Publication number: 20110033745
    Abstract: An electrochemical device capable of being mounted by soldering includes a film package made of a film; an electrodes part encapsulated together with an electrolyte in said film package; a pair of terminals, one end of each terminal being connected to said electrodes part and another end of each terminal being exposed to an exterior of said film package; and an armor in contact with a substantially entire surface of said film package and in contact with partial surfaces of the exposed ends of said pair of terminals, respectively, to encapsulate said film package, said armor exposing remaining portions of said pair of terminals to an exterior of the armor.
    Type: Application
    Filed: August 10, 2009
    Publication date: February 10, 2011
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Katsuei Ishida, Kazushi Yawata, Naoto Hagiwara, Motoki Kobayashi
  • Publication number: 20090034162
    Abstract: There are provided a porous plate dielectric substance, pillar-shaped electrodes respectively formed in pores belonging to a first group and pores belonging to a second group alternately arranged on the dielectric substance, insulator layers made of an organic insulator formed on tips of pillar-shaped electrodes in the pores of the first and second groups so as to fill the pores and hide electrodes respectively provided on one principal surface and another principal surface of the dielectric substance and connected to base ends of the pillar-shaped electrodes.
    Type: Application
    Filed: July 29, 2008
    Publication date: February 5, 2009
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kazushi YAWATA, Hidetoshi MASUDA, Masaru KUROSAWA, Kotaro MIZUNO