Patents by Inventor Kazushi Yawata
Kazushi Yawata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8802268Abstract: Provide an electrochemical device offering a large capacity per current collector and a low internal resistance, which is also easy to assemble. Provided is a laminated sheet body 16S by inserting a negative-electrode continuous body 11BW between an adjacent pair of first current collectors 12a, 12a with their first current collector main units 12a1 connected together, and also between an adjacent pair of first current collectors 12a, 12a with their first tabs 12a2 connected together, with respect to a plurality of positive electrodes 11A arranged in the width direction apart from each other, after which the negative-electrode continuous body of the laminated sheet body is cut to the unit width dimension of an element to obtain a plurality of laminated bodies 16.Type: GrantFiled: March 16, 2010Date of Patent: August 12, 2014Assignee: Taiyo Yuden Co., Ltd.Inventors: Naoto Hagiwara, Katsuei Ishida, Kazushi Yawata
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Patent number: 8765277Abstract: Provided is an electrochemical device which is compatible with high-temperature reflow soldering using lead-free solder. An electric double-layer capacitor 10-1 has a structure in which a positive terminal 12 and a negative terminal 13 are led out of a package 14 where an electric storage element 11 is sealed. The entire package 14 and the bases of led-out portions of the positive terminal 12 and the negative terminal 13 are covered by a thermal insulation material layer 16 having a thermal conductivity lower than that of the package 14.Type: GrantFiled: May 7, 2009Date of Patent: July 1, 2014Assignee: Taiyo Yuden Co., Ltd.Inventors: Kazushi Yawata, Motoki Kobayashi, Katsuei Ishida, Naoto Hagiwara
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Patent number: 8619409Abstract: An electrochemical device, e.g., an electric double layer capacitor, is applicable to high-temperature reflow soldering wherein a lead-free solder is used, and is provided with an electric storage element, a package having the electric storage element sealed therein, and a positive electrode terminal and a negative electrode terminal, each of which is led out from the electric storage element and is provided with a part sealed in the package with the electric storage element and other part led out to the outside the package. On a part of the positive electrode terminal and on a part of the negative electrode terminal, increased thermal resistance sections for suppressing heat transfer to the electric storage element via the terminals from other parts of the positive electrode terminal and other parts of the negative electrode terminal are arranged, respectively.Type: GrantFiled: September 30, 2009Date of Patent: December 31, 2013Assignee: Taiyo Yuden Co., Ltd.Inventors: Kazushi Yawata, Naoto Hagiwara, Katsuei Ishida
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Patent number: 8536465Abstract: Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 10-1 includes a package 14 that is constructed with a film or films and has sealed parts 14a1 to 14a3 formed by sealing parts, in which films are superimposed on each other, by, for example, heat sealing. The entireties of the sealed parts 14a1 to 14a3 of the package 14 are covered in a close-contact state with a support 16 that has higher rigidity than the film(s) constructing the package 14.Type: GrantFiled: March 16, 2009Date of Patent: September 17, 2013Assignee: Taiyo Yuden Co., LtdInventors: Naoto Hagiwara, Katsuei Ishida, Kazushi Yawata, Motoki Kobayashi
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Patent number: 8455136Abstract: An electrochemical device capable of being mounted by soldering includes a film package made of a film; an electrodes part encapsulated together with an electrolyte in said film package; a pair of terminals, one end of each terminal being connected to said electrodes part and another end of each terminal being exposed to an exterior of said film package; and an armor in contact with a substantially entire surface of said film package and in contact with partial surfaces of the exposed ends of said pair of terminals, respectively, to encapsulate said film package, said armor exposing remaining portions of said pair of terminals to an exterior of the armor.Type: GrantFiled: August 10, 2009Date of Patent: June 4, 2013Assignee: Taiyo Yuden Co., Ltd.Inventors: Katsuei Ishida, Kazushi Yawata, Naoto Hagiwara, Motoki Kobayashi
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Publication number: 20120040231Abstract: Provide an electrochemical device offering a large capacity per current collector and a low internal resistance, which is also easy to assemble. Provided is a laminated sheet body 16S by inserting a negative-electrode continuous body 11BW between an adjacent pair of first current collectors 12a, 12a with their first current collector main units 12a1 connected together, and also between an adjacent pair of first current collectors 12a, 12a with their first tabs 12a2 connected together, with respect to a plurality of positive electrodes 11A arranged in the width direction apart from each other, after which the negative-electrode continuous body of the laminated sheet body is cut to the unit width dimension of an element to obtain a plurality of laminated bodies 16.Type: ApplicationFiled: March 16, 2010Publication date: February 16, 2012Applicant: TAIYO YUDEN CO., LTD.Inventors: Naoto Hagiwara, Katsuei Ishida, Kazushi Yawata
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Publication number: 20110252615Abstract: There are provided a porous plate dielectric substance, pillar-shaped electrodes respectively formed in pores belonging to a first group and pores belonging to a second group alternately arranged on the dielectric substance, insulator layers made of an organic insulator formed on tips of pillar-shaped electrodes in the pores of the first and second groups so as to fill the pores and hide electrodes respectively provided on one principal surface and another principal surface of the dielectric substance and connected to base ends of the pillar-shaped electrodes.Type: ApplicationFiled: May 20, 2011Publication date: October 20, 2011Applicant: TAIYO YUDEN CO., LTD.Inventors: Kazushi YAWATA, Hidetoshi MASUDA, Masaru KUROSAWA, Kotaro MIZUNO
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Patent number: 8027145Abstract: There are provided a porous plate dielectric substance, pillar-shaped electrodes respectively formed in pores belonging to a first group and pores belonging to a second group alternately arranged on the dielectric substance, insulator layers made of an organic insulator formed on tips of pillar-shaped electrodes in the pores of the first and second groups so as to fill the pores and hide electrodes respectively provided on one principal surface and another principal surface of the dielectric substance and connected to base ends of the pillar-shaped electrodes.Type: GrantFiled: July 29, 2008Date of Patent: September 27, 2011Assignee: Taiyo Yuden Co., LtdInventors: Kazushi Yawata, Hidetoshi Masuda, Masaru Kurosawa, Kotaro Mizuno
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Publication number: 20110176254Abstract: Provided is an electrochemical device applicable to high-temperature reflow soldering wherein a lead-free solder is used. An electric double layer capacitor (10) is provided with a capacitor element (11), a package (14) having the capacitor element (11) sealed therein, and a positive electrode terminal (12) and a negative electrode terminal (13), each of which is led out from the capacitor element and is provided with a part sealed in the package (14) with the capacitor element and other part led out to the outside the package. On a part of the positive electrode terminal (12) and on a part of the negative electrode terminal (13), increased thermal resistance sections (HR1) for suppressing heat transfer to the capacitor element (11) via the terminals (12, 13) from other parts of the positive electrode terminal (12) and other parts of the negative electrode terminal (13) are arranged, respectively.Type: ApplicationFiled: September 30, 2009Publication date: July 21, 2011Applicant: Taiyo Yuden Co., Ltd.Inventors: Kazushi Yawata, Naoto Hagiwara, Katsuei Ishida
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Publication number: 20110056737Abstract: Provided is an electrochemical device compatible with high-temperature reflow soldering using a lead-free solder. An electrical double layer capacitor 10-1 includes a package 14 that is constructed with a film or films and has sealed parts 14a1 to 14a3 formed by sealing parts, in which films are superimposed on each other, by, for example, heat sealing. The entireties of the sealed parts 14a1 to 14a3 of the package 14 are covered in a close-contact state with a support 16 that has higher rigidity than the film(s) constructing the package 14.Type: ApplicationFiled: March 16, 2009Publication date: March 10, 2011Applicant: TAIYO YUDEN CO., LTD.Inventors: Naoto Hagiwara, Katsuei Ishida, Kazushi Yawata, Motoki Koyabashi
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Publication number: 20110045327Abstract: Provided is an electrochemical device which is compatible with high-temperature reflow soldering using lead-free solder. An electric double-layer capacitor 10-1 has a structure in which a positive terminal 12 and a negative terminal 13 are led out of a package 14 where an electric storage element 11 is sealed. The entire package 14 and the bases of led-out portions of the positive terminal 12 and the negative terminal 13 are covered by a thermal insulation material layer 16 having a thermal conductivity lower than that of the package 14.Type: ApplicationFiled: May 7, 2009Publication date: February 24, 2011Applicant: TAIYO YUDEN CO., LTD.Inventors: Kazushi Yawata, Motoki Kobayashi, Katsuei Ishida, Naoto Hagiwara
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Publication number: 20110033745Abstract: An electrochemical device capable of being mounted by soldering includes a film package made of a film; an electrodes part encapsulated together with an electrolyte in said film package; a pair of terminals, one end of each terminal being connected to said electrodes part and another end of each terminal being exposed to an exterior of said film package; and an armor in contact with a substantially entire surface of said film package and in contact with partial surfaces of the exposed ends of said pair of terminals, respectively, to encapsulate said film package, said armor exposing remaining portions of said pair of terminals to an exterior of the armor.Type: ApplicationFiled: August 10, 2009Publication date: February 10, 2011Applicant: TAIYO YUDEN CO., LTD.Inventors: Katsuei Ishida, Kazushi Yawata, Naoto Hagiwara, Motoki Kobayashi
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Publication number: 20090034162Abstract: There are provided a porous plate dielectric substance, pillar-shaped electrodes respectively formed in pores belonging to a first group and pores belonging to a second group alternately arranged on the dielectric substance, insulator layers made of an organic insulator formed on tips of pillar-shaped electrodes in the pores of the first and second groups so as to fill the pores and hide electrodes respectively provided on one principal surface and another principal surface of the dielectric substance and connected to base ends of the pillar-shaped electrodes.Type: ApplicationFiled: July 29, 2008Publication date: February 5, 2009Applicant: TAIYO YUDEN CO., LTD.Inventors: Kazushi YAWATA, Hidetoshi MASUDA, Masaru KUROSAWA, Kotaro MIZUNO