Patents by Inventor Kazushige Hakeda

Kazushige Hakeda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10059106
    Abstract: Provided is a liquid ejecting head including: a first board on which a driving element for ejecting liquid is installed; a second board which is installed on the surface of the first board and covers the driving element; a wiring board that includes a first surface on which a wiring, where a driving signal is supplied to the driving element, is formed and a second surface that is at the opposite side to the first surface, and where the first surface of a first end section is joined to the surface of the first board; and a filling material which covers the wiring by being formed at least between the first surface and a wall surface of the second board, in which the height of the filling material with respect to the surface of the first board is high at the first surface side in comparison to the second surface side.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: August 28, 2018
    Assignee: Seiko Epson Corporation
    Inventors: Hiroyuki Hagiwara, Toshinobu Yamazaki, Kentaro Murakami, Isao Takimoto, Hidekazu Todoroki, Tomoo Kinoshita, Takayuki Shimosaka, Kazushige Hakeda
  • Publication number: 20160114582
    Abstract: Provided is a liquid ejecting head including: a first board on which a driving element for ejecting liquid is installed; a second board which is installed on the surface of the first board and covers the driving element; a wiring board that includes a first surface on which a wiring, where a driving signal is supplied to the driving element, is formed and a second surface that is at the opposite side to the first surface, and where the first surface of a first end section is joined to the surface of the first board; and a filling material which covers the wiring by being formed at least between the first surface and a wall surface of the second board, in which the height of the filling material with respect to the surface of the first board is high at the first surface side in comparison to the second surface side.
    Type: Application
    Filed: October 22, 2015
    Publication date: April 28, 2016
    Inventors: Hiroyuki HAGIWARA, Toshinobu YAMAZAKI, Kentaro MURAKAMI, Isao TAKIMOTO, Hidekazu TODOROKI, Tomoo KINOSHITA, Takayuki SHIMOSAKA, Kazushige HAKEDA
  • Patent number: 9259928
    Abstract: A liquid ejecting head includes a pressure element that applies a pressure to a pressure chamber which communicates with a nozzle which ejects a liquid, and a lead electrode that is joined to a wiring substrate which supplies a driving signal which drives the piezoelectric element, and the pressure element, in which a surface of the lead electrode on the wiring substrate side in a connection region between the lead electrode and the wiring substrate becomes a concavo-convex surface, in which the lead electrode and the wiring substrate are fixed to each other at a periphery of the connection region and at least one portion of a concave portion of the concavo-convex surface of the lead electrode with a non-conductive paste, and in which the lead electrode and the wiring substrate are electrically connected to each other at a convex portion of the concavo-convex surface of the lead electrode on which the non-conductive paste is not present.
    Type: Grant
    Filed: March 19, 2015
    Date of Patent: February 16, 2016
    Assignee: Seiko Epson Corporation
    Inventors: Tatsuro Torimoto, Kazushige Hakeda, Tadao Furuta, Motoki Takabe
  • Publication number: 20150217567
    Abstract: A liquid ejecting head includes a pressure element that applies a pressure to a pressure chamber which communicates with a nozzle which ejects a liquid, and a lead electrode that is joined to a wiring substrate which supplies a driving signal which drives the piezoelectric element, and the pressure element, in which a surface of the lead electrode on the wiring substrate side in a connection region between the lead electrode and the wiring substrate becomes a concavo-convex surface, in which the lead electrode and the wiring substrate are fixed to each other at a periphery of the connection region and at least one portion of a concave portion of the concavo-convex surface of the lead electrode with a non-conductive paste, and in which the lead electrode and the wiring substrate are electrically connected to each other at a convex portion of the concavo-convex surface of the lead electrode on which the non-conductive paste is not present.
    Type: Application
    Filed: March 19, 2015
    Publication date: August 6, 2015
    Inventors: Tatsuro TORIMOTO, Kazushige HAKEDA, Tadao FURUTA, Motoki TAKABE
  • Patent number: 9022527
    Abstract: A liquid ejecting head includes a pressure element and a lead electrode that is joined to a wiring substrate which supplies a driving signal, and the pressure element, in which a surface of the lead electrode on the wiring substrate side in a connection region between the lead electrode and the wiring substrate becomes a concavo-convex surface, in which the lead electrode and the wiring substrate are fixed to each other at a periphery of the connection region and at least one portion of a concave portion of the concavo-convex surface of the lead electrode with a non-conductive paste, and in which the lead electrode and the wiring substrate are electrically connected to each other at a convex portion of the concavo-convex surface of the lead electrode on which the non-conductive paste is not present.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: May 5, 2015
    Assignee: Seiko Epson Corporation
    Inventors: Tatsuro Torimoto, Kazushige Hakeda, Tadao Furuta, Motoki Takabe
  • Publication number: 20140292942
    Abstract: A liquid ejecting head includes a pressure element and a lead electrode that is joined to a wiring substrate which supplies a driving signal, and the pressure element, in which a surface of the lead electrode on the wiring substrate side in a connection region between the lead electrode and the wiring substrate becomes a concavo-convex surface, in which the lead electrode and the wiring substrate are fixed to each other at a periphery of the connection region and at least one portion of a concave portion of the concavo-convex surface of the lead electrode with a non-conductive paste, and in which the lead electrode and the wiring substrate are electrically connected to each other at a convex portion of the concavo-convex surface of the lead electrode on which the non-conductive paste is not present.
    Type: Application
    Filed: March 24, 2014
    Publication date: October 2, 2014
    Applicant: Seiko Epson Corporation
    Inventors: Tatsuro TORIMOTO, Kazushige HAKEDA, Tadao FURUTA, Motoki TAKABE
  • Patent number: 7992972
    Abstract: A method of manufacturing a piezoelectric element includes a piezoelectric layer forming step of sequentially and repeatedly performing a heat treatment step of applying a piezoelectric material containing lead to a lower electrode film at a relative humidity in the range of 30% to 50% Rh and then performing a heat treatment to form a piezoelectric precursor film and a crystallization step of firing the piezoelectric precursor film to form a piezoelectric film on the lower electrode film, thereby forming a piezoelectric layer.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: August 9, 2011
    Assignee: Seiko Epson Corporation
    Inventors: Toshinao Shinbo, Kazushige Hakeda, Koji Sumi, Tsutomu Nishiwaki
  • Patent number: 7905431
    Abstract: A male die for forming a member incorporated in a liquid ejection head is disclosed. Each of a plurality of first forging punches is operable to form a first recess on a metal plate. The first forging punches are arranged at a fixed pitch to form a punch row in a first direction. Each of a plurality of second forging punches is operable to form a second recess on the metal plate. The second forging punches are arranged adjacently to first forging punches located at both ends of the punch row. The first recess is to be a first part of the member which is used to eject liquid from the liquid ejection head, and the second recess is to be a second part of the member which is not used to eject liquid.
    Type: Grant
    Filed: January 19, 2006
    Date of Patent: March 15, 2011
    Assignee: Seiko Epson Corporation
    Inventors: Fujio Akahane, Nagamitsu Takashima, Kazushige Hakeda, Ryoji Uesugi, Akiharu Kurebayashi
  • Publication number: 20090262169
    Abstract: A method of manufacturing a piezoelectric element includes a piezoelectric layer forming step of sequentially and repeatedly performing a heat treatment step of applying a piezoelectric material containing lead to a lower electrode film at a relative humidity in the range of 30% to 50% Rh and then performing a heat treatment to form a piezoelectric precursor film and a crystallization step of firing the piezoelectric precursor film to form a piezoelectric film on the lower electrode film, thereby forming a piezoelectric layer.
    Type: Application
    Filed: March 17, 2009
    Publication date: October 22, 2009
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Toshinao Shinbo, Kazushige Hakeda, Koji Sumi, Tsutomu Nishiwaki
  • Publication number: 20090213188
    Abstract: A method of manufacturing an actuator apparatus includes forming, on the base plate, a test pattern that is electrically discontinuous with the electrodes of the piezoelectric element and has the same layer as the lower electrode, the test pattern having the lower electrode with the upper electrode and the piezoelectric material layer removed by etching, and measuring electric resistance of the lower electrode of the test pattern to acquire the etch amount of the lower electrode when the piezoelectric element is formed.
    Type: Application
    Filed: February 13, 2009
    Publication date: August 27, 2009
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Masato Shimada, Kazushige Hakeda, Tsutomu Nishiwaki, Eiju Hirai
  • Patent number: 7575305
    Abstract: An object is to provide a fine forging method for forming partitions of recesses precisely and forming recess shapes for pressure generation chambers etc. with high accuracy as well as a liquid ejection head that is produced by using the fine forming method. A fine forging method for forming groove-shaped recesses that are arranged at a prescribed pitch. After groove-shaped recesses are formed tentatively in a material plate by a first punch in which tentative forming punches are arranged, finish forming is performed on the tentatively formed groove-shaped recesses by using a second punch in which finish forming punches are arranged. An end portion of a projection strip is formed with slant faces or a slant face, whereby an end portion of each groove-shaped recess is formed precisely. A liquid ejection head produced by the above method exhibits stable liquid ejection characteristics and its manufacturing cost can be reduced by virtue of simplified working of forging.
    Type: Grant
    Filed: May 21, 2007
    Date of Patent: August 18, 2009
    Assignee: Seiko Epson Corporation
    Inventors: Fujio Akahane, Nagamitsu Takashima, Kazushige Hakeda, Ryoji Uesugi, Yasunori Koike
  • Patent number: 7524432
    Abstract: A method of forming a metal pattern comprising forming a metal film having a lower layer made of a metal and an upper layer made of a metal different from the metal of the lower layer, forming a resist film having a predetermined pattern on the upper layer, and patterning the metal film by etching the metal film using the resist film as a mask. Here, patterning the metal film comprises etching the upper layer, immersing the resist film and the upper layer in a pretreatment liquid containing a nonionic surfactant after the first etching process, and etching the lower layer after the immersing process.
    Type: Grant
    Filed: March 15, 2007
    Date of Patent: April 28, 2009
    Assignee: Seiko Epson Corporation
    Inventors: Shinya Momose, Kazushige Hakeda
  • Patent number: 7363795
    Abstract: A male die is adapted to be opposed to a first face of a metallic plate member. The male die includes a plurality of punches which are provided on the male die and arranged side by side in a first direction with a fixed pitch. A guide member is formed with a guide face which supports a side portion of the male die, at least when the punches are pressed into the plate member in a second direction, to form through holes therein.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: April 29, 2008
    Assignee: Seiko Epson Corporation
    Inventors: Fujio Akahane, Nagamitsu Takashima, Kazushige Hakeda, Ryoji Uesugi, Akiharu Kurebayashi
  • Publication number: 20070218695
    Abstract: A method of forming a metal pattern comprising forming a metal film having a lower layer made of a metal and an upper layer made of a metal different from the metal of the lower layer, forming a resist film having a predetermined pattern on the upper layer, and patterning the metal film by etching the metal film using the resist film as a mask. Here, patterning the metal film comprises etching the upper layer, immersing the resist film and the upper layer in a pretreatment liquid containing a nonionic surfactant after the first etching process, and etching the lower layer after the immersing process.
    Type: Application
    Filed: March 15, 2007
    Publication date: September 20, 2007
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Shinya Momose, Kazushige Hakeda
  • Publication number: 20070216736
    Abstract: An object is to provide a fine forging method for forming partitions of recesses precisely and forming recess shapes for pressure generation chambers etc. with high accuracy as well as a liquid ejection head that is produced by using the fine forming method. A fine forging method for forming groove-shaped recesses that are arranged at a prescribed pitch. After groove-shaped recesses are formed tentatively in a material plate by a first punch in which tentative forming punches are arranged, finish forming is performed on the tentatively formed groove-shaped recesses by using a second punch in which finish forming punches are arranged. An end portion of a projection strip is formed with slant faces or a slant face, whereby an end portion of each groove-shaped recess is formed precisely. A liquid ejection head produced by the above method exhibits stable liquid ejection characteristics and its manufacturing cost can be reduced by virtue of simplified working of forging.
    Type: Application
    Filed: May 21, 2007
    Publication date: September 20, 2007
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Fujio AKAHANE, Nagamitsu TAKASHIMA, Kazushige HAKEDA, Ryoji UESUGI, Yasunori KOIKE
  • Patent number: 7219983
    Abstract: An object is to provide a fine forging method for forming partitions of recesses precisely and forming recess shapes for pressure generation chambers etc. with high accuracy as well as a liquid ejection head that is produced by using the fine forming method. A fine forging method for forming groove-shaped recesses that are arranged at a prescribed pitch. After groove-shaped recesses are formed tentatively in a material plate by a first punch in which tentative forming punches are arranged, finish forming is performed on the tentatively formed groove-shaped recesses by using a second punch in which finish forming punches are arranged. An end portion of a projection strip is formed with slant faces or a slant face, whereby an end portion of each groove-shaped recess is formed precisely. A liquid ejection head produced by the above method exhibits stable liquid ejection characteristics and its manufacturing cost can be reduced by virtue of simplified working of forging.
    Type: Grant
    Filed: January 10, 2005
    Date of Patent: May 22, 2007
    Assignee: Seiko Epson Corporation
    Inventors: Fujio Akahane, Nagamitsu Takashima, Kazushige Hakeda, Ryoji Uesugi, Yasunori Koike
  • Patent number: 7194886
    Abstract: There is disclosed a punch for forging a metallic plate member. A first die is adapted to be opposed to a first face of the plate member. A second die is adapted to be opposed to a second face of the plate member. A plurality of first projections are provided on the first die and arranged in a first direction with a fixed pitch. Each of the first projections is elongated in a second direction perpendicular to the first direction. A plurality of second projections are provided on the second die and arranged in the first direction with the fixed pitch. Each of the second projections is elongated in the second direction and provided with a concave portion extending in the second direction at a distal end portion thereof. The plate member is sandwiched between the first die and the second die so that the first projections and the second projections are cut into the plate member in a third direction orthogonal to the first direction and the second direction, to perform a first forging work.
    Type: Grant
    Filed: November 28, 2005
    Date of Patent: March 27, 2007
    Assignee: Seiko Epson Corporation
    Inventors: Fujio Akahane, Nagamitsu Takashima, Akiharu Kurebayashi, Kazushige Hakeda, Ryoji Uesugi
  • Patent number: 7165433
    Abstract: There is disclosed a method of manufacturing a chamber formation plate of a liquid ejection head. The chamber formation plate includes a first region formed with at least recess portions to be pressure generating chambers communicated with nozzles from which liquid droplets are ejected by pressure generated in the pressure generating chambers. A metal plate and a forging die are provided. A reference part is provided on the metal plate. The reference part defines a relative position between the first region and the forging die. At least one deformation absorber is provided at a second region of the metal plate where is between the first region and the reference part. At least one plastic working is performed by the forging die, with respect to the first region to form at least the recess portions, while plastic deformation of the metal plate caused by the plastic working is absorbed by the deformation absorber.
    Type: Grant
    Filed: August 20, 2003
    Date of Patent: January 23, 2007
    Assignee: Seiko Epson Corporation
    Inventors: Fujio Akahane, Nagamitsu Takashima, Akiharu Kurebayashi, Kazushige Hakeda, Ryoji Uesugi
  • Patent number: 7127929
    Abstract: A metallic plate member is provided. A first punch is operable to perform a first forging work to mold a first member in the plate member. The first member has a first function. A second punch is operable to perform a second forging work to mold a second member in the plate member. The second member including at least one kind of positioning member. The first forging work and the second forging work are performed at a single stage.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: October 31, 2006
    Assignee: Seiko Epson Corporation
    Inventors: Fujio Akahane, Nagamitsu Takashima, Kazushige Hakeda, Ryoji Uesugi, Akiharu Kurebayashi
  • Publication number: 20060117829
    Abstract: A male die for forming a member incorporated in a liquid ejection head is disclosed. Each of a plurality of first forging punches is operable to form a first recess on a metal plate. The first forging punches are arranged at a fixed pitch to form a punch row in a first direction. Each of a plurality of second forging punches is operable to form a second recess on the metal plate. The second forging punches are arranged adjacently to first forging punches located at both ends of the punch row. The first recess is to be a first part of the member which is used to eject liquid from the liquid ejection head, and the second recess is to be a second part of the member which is not used to eject liquid.
    Type: Application
    Filed: January 19, 2006
    Publication date: June 8, 2006
    Inventors: Fujio Akahane, Nagamitsu Takashima, Kazushige Hakeda, Ryoji Uesugi, Akiharu Kurebayashi