Abstract: An oscillator 10 includes temperature compensation circuits 30 and 40, a frequency adjusting circuit 50, and an initial deviation correcting circuit 60. Switches SW 1 to 4 are controlled based on control data DC stored in a memory 90 so that a temperature compensation voltage V1, a temperature compensation voltage V2, a frequency adjusting voltage V3, and an initial deviation correcting voltage V4, output from the above circuits, are selectively added, supplying a sum to a voltage-controlled oscillation circuit 20 as a control voltage VA.

Abstract: An oscillator 10 includes temperature compensation circuits 30 and 40, a frequency adjusting circuit 50, and an initial deviation correcting circuit 60. Switches SW 1 to 4 are controlled based on control data DC stored in a memory 90 so that a temperature compensation voltage V1, a temperature compensation voltage V2, a frequency adjusting voltage V3, and an initial deviation correcting voltage V4, output from the above circuits, are selectively added, supplying a sum to a voltage-controlled oscillation circuit 20 as a control voltage VA.

Abstract: An oscillator circuit having a first programmable divider for obtaining a reference signal by dividing the frequency of an oscillation signal of a piezoelectric resonator by a frequency dividing number, M. A PLL circuit using the reference signal as input thereto to obtain a multiplied signal, the multiplied signal being formed by multiplying the input signal by a second frequency dividing number N for a second programmable divider provided in a feedback circuit. A third programmable divider capable of dividing the frequency of the multiplied signal by a third frequency dividing number X and outputting the frequency-divided signal. The frequency dividing numbers M, N, and X can be set to values independent of each other. Therefore, innumerable combinations of the frequency dividing numbers M, N, and X can be used and the number of frequencies producible by one oscillator can be largely increased by enabling selection of any suitable one of such combinations.

Abstract: An oscillator circuit having a first programmable divider for obtaining a reference signal by dividing the frequency of an oscillation signal of a piezoelectric resonator by a frequency dividing number M. A PLL circuit using the reference signal as input thereto to obtain a multiplied signal, the multiplied signal being formed by multiplying the input signal by a second frequency dividing number N for a second programmable divider provided in a feedback circuit. A third programmable divider capable of dividing the frequency of the multiplied signal by a third frequency dividing number X and outputting the frequency-divided signal. The frequency dividing numbers M, N, and X can be set to values independent of each other. Therefore, innumerable combinations of the frequency dividing numbers M, N, and X can be used and the number of frequencies producible by one oscillator can be largely increased by enabling selection of any suitable one of such combinations.

Abstract: A flexible clock and reset signal generation and distribution system and method for distributing a relatively low frequency clock signal to various elements of a computer system that require higher frequency clock signals for operation and includes programmable frequency synthesizers containing phase locked loop (PLL) type frequency multipliers, which are located physically adjacent to the computer system elements for receiving the low frequency clock signal and generating the various required higher frequency clock signals. The source of the relatively low frequency clock signal is a real-time clock (RTC) module having a crystal oscillator, a reset signal generator, and a low voltage detector. The RTC module switches off the low frequency clock signal when the main system power supply falls below a prescribed voltage level, such as, a battery voltage, or a voltage reference, or a combination battery voltage and voltage reference.

Abstract: A resin mold type piezoelectric oscillator is provided comprising a piezoelectric oscillator having outer leads, a semiconductor integrated circuit for electrically oscillating the piezoelectric oscillator, and a lead frame formed substantially in a plane for mounting the piezoelectric oscillator and integrated circuit the lead frame having connection pads for connecting to the outer leads of the piezoelectric oscillator. The outer leads of the piezoelectric oscillator are bent at least twice in a plane substantially perpendicular to the lead frame so as to provide a clearance for crossing over inner leads of the lead frame.

Abstract: A piezoelectric resonator is formed with a case and a stem for housing the piezoelectric vibrating portion thereof. The case and stem are coupled by press-fitting and the interface is coated with a high temperature solder containing at least 90% lead. An inner lead of the resonator is also coated with the solder and a portion of the vibrator is fixed to the lead by melting the solder. Alternative constructions employ a resin case or a metallic plate case and a configuration in which an integrated circuit and a piezoelectric vibrator are integrally molded to achieve a highly desirable mounting configuration.

Abstract: A piezoelectric resonator is formed with a case and a stem for housing the piezoelectric vibrating portion thereof. The case and stem are coupled by press-fitting and the interface is coated with a high temperature solder containing at least 90% lead. An inner lead of the resonator is also coated with the solder and a portion of the vibrator is fixed to the lead by melting the solder. Alternative constructions employ a resin case or a metallic plate case and a configuration in which an integrated circuit and a piezoelectric vibrator are integrally molded to achieve a highly desirable mounting configuration.

Abstract: A piezoelectric resonator is formed with a case and a stem for housing the piezoelectric vibrating portion thereof. The case and stem are coupled by press-fitting and the interface is coated with a high temperature solder containing at least 90% lead. An inner lead of the resonator is also coated with the solder and a portion of the vibrator is fixed to the lead by melting the solder. Alternative constructions employ a resin case or a metallic plate case and a configuration in which an integrated circuit and a piezoelectric vibrator are integrally molded to achieve a highly desirable mounting configuration.

Abstract: The invention relates to a piezoelectric oscillator wherein a case and a stem are coated with a solder containing 90% and higher of lead, an inner lead is also coated with the solder thereby fixing a piece of piezoelectric oscillator by melting the solder. The invention further relates to a piezoelectric oscillator wherein the piezoelectric oscillator is performed casing by resin or metallic plate, and to a piezoelectric oscillating apparatus wherein IC and a piezoelectric oscillator are internally mold to achieve a molding of high efficiency without inferiority while surface mounting.

Abstract: A piezo-oscillator includes a semiconductor element having at least an oscillating circuit. A piezo-vibrator having leads extending therefrom is connected to the semiconductor element by a plurality of lead terminals. The semiconductor, vibrator and lead terminals are contained within a unitary resin package.

Abstract: A quartz crystal oscillator having a resonator leaf with electrode film for electrical conduction. The oscillator includes a semiconductor element which oscillates the resonator leaf. Lead terminals have a first end which are integrally molded to the semiconductor element by a resin and second ends which support the resonator leaf.