Abstract: A coil component includes a coil configured of a winding, an exterior body provided to cover the coil, and a terminal part configured to be continuous with the winding. A proximal end portion of the terminal part is buried in the exterior body. A distal end portion ahead of the proximal end portion is bent from the proximal end portion and located outside a mounting surface of the exterior body along the mounting surface.

Abstract: An audio reproduction device and method are provided. The audio reproduction device is connected to an external memory storing audio data series respectively corresponding to audio phrases and storing management information indicating an address at which each of the plurality of audio data series is stored, and perform reproduction of audio by reading the audio data series from the external memory for each audio phrase. The audio reproduction device includes a serial interface performing serial communication, registers storing the management information corresponding to the audio data series of at least two audio phrases transmitted from the external memory via the serial interface, and a reproduction control circuit reading the audio data series from the external memory via the serial interface for each audio phrase based on the management information stored in the registers and reproducing audio in the order of reading the audio data series for each audio phrase.

Abstract: A die includes a stationary die, a movable die, which is opposed to the stationary die and reciprocatable in a first direction to change a distance between the stationary and movable dies, and a transfer mechanism, which transfers a workpiece, upon which plastic deformation work is performed between the stationary and movable dies, in a second direction crossing the first direction.

Abstract: There is provided an input circuit with reduced electrical power consumption, which processes an input signal given thereto for removing the noise components contained therein and regulating the voltage level thereof as well, and then supplies an output signal therefrom to a subsequent semiconductor integrated circuit. The input circuit 101 is made up of the Schmitt buffer 111, a pull-down resistance 113, an N-transistor 115, a P-transistor 121, an N-transistor 122, a P-transistor 131, an N-transistor 132, an exclusive OR gate 141, and a bus driver 151. The Schmitt buffer 111 is a buffer which has two threshold levels i.e. upper and lower thresholds, and changes the level of the output signal OUT depending on whether the voltage of an input signal IN is higher or lower than these two threshold levels.

Abstract: The present invention provides a hot-melt resin composition which comprises 1 to 30% by weight of a compound represented by the general formula (1)Q-(X-A)n (1)(wherein X is a urethane or urea group, Q is a group with a valence of n, A is a univalent group, one of Q and A being an isocyanate residue and the other being an amine or alcohol residue, and n is an integer of 1 to 3) and 70 to 99% by weight of a thermoplastic polyurethane resin (B); a method of producing a powder form of said hot-melt resin composition; and a hot-melt resin powder composition which comprises said powder-form hot-melt resin composition.