Patents by Inventor Kazushige Osumi

Kazushige Osumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hybrid integrated circuit device
    Patent number: 7491894
    Abstract: A hybrid integrated circuit device of the present invention includes: a circuit board having a front surface subjected to an insulation process; a conductive pattern formed on the front surface of the circuit board; a circuit element placed at a desired position on the conductive pattern and electrically connected to the conductive pattern; and a plurality of leads fixed to the conductive pattern and led to the outside. End portions of the leads which are led to the outside extend approximately parallel to the circuit board in a plane different from that of the front surface of the circuit board.
    Type: Grant
    Filed: March 21, 2005
    Date of Patent: February 17, 2009
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Takeshi Suzuki, Toshiyuki Ilmura, Kazushige Osumi, Shinichi Tsuyuki
  • Hybrid integrated circuit device
    Patent number: 7078797
    Abstract: Provided is a hybrid integrated circuit device which can more effectively stabilize a circuit configured to operate at a high speed. A hybrid integrated circuit device of the embodiment includes a metal substrate provided with an insulating layer on a surface thereof, a conductive pattern formed on a surface of the insulating layer, a semiconductor element fixed onto the conductive pattern, a lead as external connecting means fixed to the conductive pattern in the periphery of the metal substrate, and a contact portion for electrically connecting the conductive pattern electrically connected to the semiconductor element to the metal substrate in the vicinity of the semiconductor element.
    Type: Grant
    Filed: March 29, 2004
    Date of Patent: July 18, 2006
    Inventors: Takeshi Suzuki, Kazushige Osumi, Junichi Ichihashi, Toshiyuki Iimura, Shinichi Tsuyuki
  • Hybrid integrated circuit device
    Publication number: 20050213308
    Abstract: A hybrid integrated circuit device of the present invention includes: a circuit board having a front surface subjected to an insulation process; a conductive pattern formed on the front surface of the circuit board; a circuit element placed at a desired position on the conductive pattern and electrically connected to the conductive pattern; and a plurality of leads fixed to the conductive pattern and led to the outside. End portions of the leads which are led to the outside extend approximately parallel to the circuit board in a plane different from that of the front surface of the circuit board.
    Type: Application
    Filed: March 21, 2005
    Publication date: September 29, 2005
    Inventors: Takeshi Suzuki, Toshiyuki Ilmura, Kazushige Osumi, Shinichi Tsuyuki
  • Hybrid integrated circuit device
    Publication number: 20040251533
    Abstract: Provided is a hybrid integrated circuit device which can more effectively stabilize a circuit configured to operate at a high speed. A hybrid integrated circuit device of the embodiment includes a metal substrate provided with an insulating layer on a surface thereof, a conductive pattern formed on a surface of the insulating layer, a semiconductor element fixed onto the conductive pattern, a lead as external connecting means fixed to the conductive pattern in the periphery of the metal substrate, and a contact portion for electrically connecting the conductive pattern electrically connected to the semiconductor element to the metal substrate in the vicinity of the semiconductor element.
    Type: Application
    Filed: March 29, 2004
    Publication date: December 16, 2004
    Inventors: Takeshi Suzuki, Kazushige Osumi, Junichi Ichihashi, Toshiyuki Iimura, Shinichi Tsuyuki