Abstract: Methods for preparing multi-layer optical laminates include placing an optical film that is free form an adhesive layer between first and second glass substrates that are free of an adhesive layer, placing this laminate under vacuum, and then heating the laminate under pressure to a temperature above the softening temperature of the optical film. The glass substrates are free of an adhesive layer but may include a silane surface treatment. The resulting multi-layer laminate is optically clear and does not show scattering of reflected light by the optical film.

Abstract: An optical assembly including a first optical substrate including a first major surface; a multilayer polymeric optical film disposed on the first major surface of the first optical substrate and including a plurality of polymeric layers numbering greater than about 50 in total; and a first optical bonding layer having an average thickness of less than about 0.5 microns and disposed between, and making physical contact to, the first major surface of the first optical substrate and the multilayer polymeric optical film, the first optical bonding layer bonding the first optical substrate to the multilayer polymeric optical film and including a silanated amine.

Abstract: Methods for preparing multi-layer optical laminates include placing an optical film that is free form an adhesive layer between first and second glass substrates that are free of an adhesive layer, placing this laminate under vacuum, and then heating the laminate under pressure to a temperature above the softening temperature of the optical film. The glass substrates are free of an adhesive layer but may include a silane surface treatment. The resulting multi-layer laminate is optically clear and does not show scattering of reflected light by the optical film.

Abstract: Methods for preparing multi-layer optical laminates include placing an optical film that is free form an adhesive layer between first and second glass substrates that are free of an adhesive layer, placing this laminate under vacuum, and then heating the laminate under pressure to a temperature above the softening temperature of the optical film. The glass substrates are free of an adhesive layer but may include a silane surface treatment. The resulting multi-layer laminate is optically clear and does not show scattering of reflected light by the optical film.

Abstract: Methods for preparing multi-layer optical laminates include placing an optical film that is free form an adhesive layer between first and second glass substrates that are free of an adhesive layer, placing this laminate under vacuum, and then heating the laminate under pressure to a temperature above the softening temperature of the optical film. The glass substrates are free of an adhesive layer but may include a silane surface treatment. The resulting multi-layer laminate is optically clear and does not show scattering of reflected light by the optical film.

Abstract: A member peeling method includes a step for preparing a first member having a first main face and an outer edge thereof and a second member having a second main face and an outer edge thereon, a step for disposing a photothermal conversion layer on at least one portion of the outer edge on the first main face, a step for mutually joining the first main face and the second main face via an adhesive layer, a step for irradiating a laser light to the photothermal conversion layer, and a step for at least partially peeling the first member from the second member by applying a force to an outer peripheral portion of either of the first member or the second member in a direction away from the other member.

Abstract: A member peeling method includes a step for preparing a first member having a first main face and an outer edge thereof and a second member having a second main face and an outer edge thereon, a step for disposing a photothermal conversion layer on at least one portion of the outer edge on the first main face, a step for mutually joining the first main face and the second main face via an adhesive layer, a step for irradiating a laser light to the photothermal conversion layer, and a step for at least partially peeling the first member from the second member by applying a force to an outer peripheral portion of either of the first member or the second member in a direction away from the other member.

Abstract: To reliably avoid inclusion of air bubbles into adhesive when bonding a member to another member with an adhesive held between them. A first member 10 and a second member 12 are disposed at a relative position with a first surface 10a and a second surface 12a opposed to and spaced apart from each other and with a plurality of first adhesive members 14 and single second adhesive member 18 extending in directions orthogonal to each other. The second member 12 is caused to approach to the first member 10, and the second adhesive member 18 is initially brought into contact with the plurality of first adhesive members 14 between the second member 12 and the first member 10. A local pressing force P is applied to the rear surface 12b of the second member 12 to spread the single second adhesive member 18 and the plurality of the first adhesive members 14.

Abstract: The present invention is a laminated body including a substrate, a joining layer positioned adjacent the substrate, a photothermal conversion layer positioned adjacent the joining layer, and a light transmitting support positioned adjacent the photothermal conversion layer. The photothermal conversion layer includes a metal absorbing layer.

Abstract: To provide a method of producing segmented chips preventing the chips from being damaged by the chip jumping or by the contact of the neighboring chips while the back surfaces thereof are being ground.

Abstract: The present disclosure is to provide a method of manufacturing a wafer laminated body, a device for manufacturing a wafer laminated body, a wafer laminated body, a method of peeling a support body, and a method for manufacturing a wafer, all of which are capable of improving the grinding characteristic of the reverse surface of a wafer.

Abstract: To provide a method of producing segmented chips preventing the chips from being damaged by the chip jumping or by the contact of the neighboring chips while the back surfaces thereof are being ground.

Abstract: To provide a shatter prevention film of a protective glass of a liquid crystal display device capable of being formed easily and excellent in properties such as shatter prevention performance. A shatter prevention film arranged on protective glass of a liquid crystal display device, wherein the shatter prevention film is formed of a cured body of a photo curable resin and has a bonding strength of at least 0.3 N/25 mm wide and an elongation of at least 20% when measured in accordance with JIS A 5759.

Abstract: An optical recording medium (10) comprising a substrate (1) and an information recording layer (2) formed thereon. The information recording layer (2) has a protective film (3) made of a light transmitting resin provided on its surface. The protective film (3) has a substantially even thickness in a range from 50 to 200 &mgr;m, and has a surface which reproduces the smoothness of the surface of a surface treatment medium which has been covering the surface of the protective layer (3) during the formation thereof.

Abstract: The invention provides a two-part adhesive composition making it possible to mutually bond disk substrates within a relatively short time and to produce an optical disk, and an optical disk having a metal film, corrosion of which is restricted under a high-temperature high-humidity condition, and which is produced by using the two-part adhesive composition. A two-part adhesive composition of the invention comprises first and second parts each containing urethane acrylate having a polytetramethylene glycol skeleton and an acrylate having a hydroxyl group in its molecule, wherein the first part further contains a diacyl peroxide and the second part further contains a tertiary amine. Organic peroxide is preferably diacyl peroxide and a setting promoter is preferably a tertiary amine. Either one, or both, of the first and second parts may further contain a photo-polymerization initiator.

Abstract: The invention provides a two-part adhesive composition making it possible to mutually bond disk substrates within a relatively short time and to produce an optical disk, and an optical disk having a metal film, corrosion of which is restricted under a high-temperature high-humidity condition, and which is produced by using the two-part adhesive composition. A two-part adhesive composition of the invention comprises first and second parts each containing urethane acrylate having a polytetramethylene glycol skeleton and an acrylate having a hydroxyl group in its molecule, wherein the first part further contains a diacyl peroxide and the second part further contains a tertiary amine. Organic peroxide is preferably diacyl peroxide and a setting promoter is preferably a tertiary amine. Either one, or both, of the first and second parts may further contain a photo-polymerization initiator.

Abstract: A bonded optical disk comprising first and second transparent substrates bonded with a light-permeable, pressure sensitive adhesive layer and at least one information recording layer wherein the pressure sensitive adhesive layer has been formed from a pressure sensitive adhesive precursor, having a viscosity of 10 to 5000 cps and being applied onto at least one of the first substrate and the second substrate by radiation curing and has a gel fraction of not less than 50% and a storage modulus of 1.0×104 to 1.0×107 dyn/cm2 at 25° C., or in place of the pressure sensitive adhesive layer, an adhesive layer derived from a radiation curable adhesive precursor having a viscosity of 500 to 10000 cps, and the adhesive precursor is subjected to a higher pressure than an atmospheric pressure, prior to being irradiated, as well as a method and an apparatus for producing a bonded optical disk.

Abstract: A coating composition for use to produce heat-sensitive record material is produced by admixing and heating at least one colorless chromogenic material or acceptor and at least one heat fusible material having a melting point within the range of 60.degree. C. to 200.degree. C. to form a co-melt, atomizing the co-melt with a spray nozzle to form finely divided particles comprising the colorless chromogenic material or acceptor and the heat fusible material, and preparing a coating composition including said finely divided particles dispersed therein.