Abstract: The present invention provides a manufacturing method of a semiconductor module which enables the joining at a low temperature within a short time and can obtain more reliable joining portions by performing the joining without using a solder joining medium.

Abstract: The present invention provides a manufacturing method of a semiconductor module which enables the joining at a low temperature within a short time and can obtain more reliable joining portions by performing the joining without using a solder joining medium.

Abstract: The present invention provides an electronic part mounting method which enables joining of electrodes at a low temperature and within a short time, can obtain the high reliability and, further, enables joining at a fine pitch. In an electronic part mounting method which joins circuit electrodes which are formed over a circuit board and die electrodes which are formed over the electronic parts thus mounting the electronic parts on the circuit board, a low-melting-point metal layer is preliminarily formed over the circuit electrode and/or the die electrode and, thereafter, the circuit electrode and the die electrode are arranged to face each other and are heated and pressurized for melting low-melting-point metal thus diffusing the low-melting-point metal into the circuit electrode and the die electrode by solid-liquid diffusion.