Abstract: A method of producing a conductive pattern includes a light-exposing step of exposing a layer or pattern including conductive particles A, an organic compound B having an unsaturated double bond and a photopolymerization initiator C, and positioned over a substrate to light rays having a broad spectrum, to thereby produce a conductive layer or a conductive pattern.

Abstract: A conductive paste can form a minute conductive pattern having markedly high adhesion and exhibiting conductivity at relatively low temperatures. The conductive paste contains: a compound (A) having a primary amino group, a secondary amino group, and a tertiary amino group; a compound (B) having a carboxyl group; and a conductive filler (C).

Abstract: A photosensitive conductive paste contains conductive particles (A), a photosensitive organic compound (B), an epoxy resin (C) and an ion adsorbent (D) that is selected from the group consisting of hydrotalcite, magnesium oxide, aluminum oxide, aluminum hydroxide, magnesium hydroxide, magnesium carbonate, zirconium oxide, magnesium silicate, silicon dioxide, zeolite and a carbon-based powder.

Abstract: An object of the present invention is to provide a photosensitive light-shielding paste for producing a fine laminated pattern comprising a light-shielding layer and an electroconductive layer which functions as a substitute for ITO, and this photosensitive light-shielding paste is free from the problems of visible sensing electrode and reflection of the light. Provided is a photosensitive light-shielding paste comprising a pigment, a photosensitive organic compound, and a thermosetting compound wherein proportion of the pigment in the entire solid content is 5 to 50% by mass.

Abstract: A photosensitive conductive paste provides a coating film having good storage stability, is capable of maintaining high adhesion under relatively low temperature curing conditions, and is also capable of exhibiting high conductivity. The photosensitive conductive paste contains (A) conductive particles, (B) a photosensitie component, (C) a photopolymerization initiator and (D) an epoxy resin, wherein the epoxy resin (D) has an epoxy equivalent weight of 200-500 g/equivalent.

Abstract: A conductive paste can form a minute conductive pattern having markedly high adhesion and exhibiting conductivity at relatively low temperatures. The conductive paste contains: a compound (A) having a primary amino group, a secondary amino group, and a tertiary amino group; a compound (B) having a carboxyl group; and a conductive filler (C).

Abstract: A method of producing a conductive pattern includes a light-exposing step of exposing a layer or pattern including conductive particles A, an organic compound B having an unsaturated double bond and a photopolymerization initiator C, and positioned over a substrate to light rays having a broad spectrum, to thereby produce a conductive layer or a conductive pattern.

Abstract: A photosensitive conductive paste contains conductive particles (A), a photosensitive organic compound (B), an epoxy resin (C) and an ion adsorbent (D) that is selected from the group consisting of hydrotalcite, magnesium oxide, aluminum oxide, aluminum hydroxide, magnesium hydroxide, magnesium carbonate, zirconium oxide, magnesium silicate, silicon dioxide, zeolite and a carbon-based powder.

Abstract: A photosensitive conductive paste includes an epoxy acrylate (A) including a urethane bond, a photopolymerization initiator (B), and a conductive filler (C), wherein an added amount of the conductive filler (C) is 70 to 95% by weight with respect to the total solids in the photosensitive conductive paste.

Abstract: A photosensitive conductive paste includes a dicarboxylic acid or an acid anhydride thereof (A); a compound (B) having an acid value of 40 to 200 mg KOH/g; an alicyclic compound (C); a photopolymerization initiator (D); and a conductive filler (E).

Abstract: A photosensitive conductive paste includes an epoxy acrylate (A) including a urethane bond, a photopolymerization initiator (B), and a conductive filler (C), wherein an added amount of the conductive filler (C) is 70 to 95% by weight with respect to the total solids in the photosensitive conductive paste.

Abstract: A photosensitive conductive paste includes a dicarboxylic acid or an acid anhydride thereof (A); a compound (B) having an acid value of 40 to 200 mg KOH/g; an alicyclic compound (C); a photopolymerization initiator (D); and a conductive filler (E).

Abstract: A photosensitive conductive paste provides a coating film having good storage stability, is capable of maintaining high adhesion under relatively low temperature curing conditions, and is also capable of exhibiting high conductivity. The photosensitive conductive paste contains (A) conductive particles, (B) a photosensitive component, (C) a photopolymerization initiator and (D) an epoxy resin, wherein the epoxy resin (D) has an epoxy equivalent weight of 200-500 g/equivalent.

Abstract: A conductive paste includes: composite particles (A) formed by coating a surface of a core material composed of an inorganic material with an antimony-containing compound; a compound (B) having an acid value of 30 to 250 mg KOH/g; and a conductive filler (C).

Abstract: A photosensitive paste is provided with which a member for a display panel having superior visibility can be manufactured with simple steps, and with the photosensitive paste including a soft magnetic powder, a glass powder, and a photosensitive organic component, in which the mass ratio of the soft magnetic powder (A) to the glass powder (B) is in the range of 20/80 to 70/30.

Abstract: A photosensitive paste is provided with which a member for a display panel having superior visibility can be manufactured with simple steps, and with the photosensitive paste including a soft magnetic powder, a glass powder, and a photosensitive organic component, in which the mass ratio of the soft magnetic powder (A) to the glass powder (B) is in the range of 20/80 to 70/30.

Abstract: The present invention relates to a method for producing a paste including an inorganic powder in which a paste including an inorganic powder is dispersed by a disperser having rollers provided in a cylindrical vessel. The present invention can provide a paste including an inorganic powder containing small amounts of foreign substances and having excellent dispersibility by a treatment for a short time.

Abstract: The present invention relates to a method of forming positive polyimide patterns which includes a process wherein a film of a composition of actinic radiation-sensitive polyimide precursor is formed on a substrate which is selectively exposed to an actinic radiation, then such a treatment is applied to the film that the film in unexposed portion attains higher degree of curing than the film in exposed portion after the exposure, and the film is removed from the exposed portion. According to the invention, such an unexpected effect can be achieved as a positive polyimide pattern can be formed by using a composition of actinic radiation-sensitive polyimide precursor which has only been used in forming negative patterns. According to the invention, the positive polyimide pattern can be formed easily and the pattern obtained has excellent performance.