Patents by Inventor Kazutaka Nakanami

Kazutaka Nakanami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Water-based organic solderability preservative, and electronic board and surface treatment method using the same
    Patent number: 10149395
    Abstract: A water-based organic solderability preservative includes (A) an imidazole compound, (B) an organic acid, (C) a complex coating formation aid, (D) an organic solvent and (E) water. The component (D) (organic solvent) has a solubility to water of 10 g/100 g or more at 20 degrees C. and a boiling temperature in a range from 100 degrees C. to 300 degrees C.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: December 4, 2018
    Assignee: TAMURA CORPORATION
    Inventors: Yasutaka Ogawa, Kazutaka Nakanami
  • WATER-BASED ORGANIC SOLDERABILITY PRESERVATIVE, AND ELECTRONIC BOARD AND SURFACE TREATMENT METHOD USING THE SAME
    Publication number: 20170327702
    Abstract: A water-based organic solderability preservative includes (A) an imidazole compound, (B) an organic acid, (C) a complex coating formation aid, (D) an organic solvent and (E) water. The component (D) (organic solvent) has a solubility to water of 10 g/100 g or more at 20 degrees C. and a boiling temperature in a range from 100 degrees C. to 300 degrees C.
    Type: Application
    Filed: May 10, 2017
    Publication date: November 16, 2017
    Inventors: Yasutaka Ogawa, Kazutaka Nakanami
  • Surface treatment agents for metal films of printed circuit boards
    Publication number: 20050173678
    Abstract: A surface treatment agent is applied onto a metal film of a printed circuit board to form a rust preventive film. The surface treatment agent for metal comprises an aqueous solution comprising an organic acid having a boiling point of 170° C. or higher and one or more compound selected from the group consisting of an imidazole based compound and a benzimidazole based compound.
    Type: Application
    Filed: January 18, 2005
    Publication date: August 11, 2005
    Applicant: TAMURA KAKEN CORPORATION
    Inventors: Ichiro Miura, Kazutaka Nakanami, Yoshitou Hayashida, Takao Ohno
  • Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board
    Patent number: 6712262
    Abstract: The invention provides a water-soluble preflux that can solve problems with a soldering land array having a narrow spacing in that fused solder is likely to cause soldering bridges with defective soldering, a printed circuit board with its film formed thereon, and a surface treatment process for a metal in that circuit. The water-soluble preflux comprises given two different benzimidazoles compound and an iodine-based compound optionally with an amino acid, etc. The invention provides a printed circuit board with a film of that preflux formed thereon, and a surface treatment process for the metal in that circuit.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: March 30, 2004
    Assignee: Tamurakaken Corporation
    Inventors: Shinichi Akaike, Kazutaka Nakanami, Yoshiyuki Takahashi, Takao Ono
  • Water-soluble preflux, printed circuit board, and process for treating the surface of a metal in a printed circuit board
    Publication number: 20030141351
    Abstract: The invention provides a water-soluble prefluxe that can solve problems with a soldering land array having a narrow spacing in that fused solder is likely to cause soldering bridges with defective soldering, a printed circuit board with its film formed thereon, and a surface treatment process for a metal in that circuit. The water-soluble preflus comprises given two different benzimidazoles compound and an iodine-based compound optionally with an amino acid, etc. The invention provides a printed circuit board with a film of that preflux formed thereon, and a surface treatment process for the metal in that circuit.
    Type: Application
    Filed: July 18, 2002
    Publication date: July 31, 2003
    Inventors: Shinichi Akaike, Kazutaka Nakanami, Yoshiyuki Takahashi, Takao Ono