Patents by Inventor Kazutaka Nakao

Kazutaka Nakao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240107678
    Abstract: A method of manufacturing a bonded substrate includes: preparing one or plurality of products to be bonded, each including a brazing material layer and a copper plate laminated on both main surfaces of a ceramic substrate, laminating, one or a plurality of products bonded and a pair of clamping members that clamp them while providing a mold releasing layer between each thereof, heating the one or the plurality of products while pressing the one or the plurality of products in the pair of clamping members to obtain the one or the plurality of bonded substrates in which the ceramic substrate and the copper plate are bonded with a bonding layer, and removing the mold releasing layer from the bonded substrate by dissolving a portion in contact with the mold releasing layer of the copper plate included in the bonded substrate by wet etching.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 28, 2024
    Inventors: Kota KITAJIMA, Takahiko HONDA, Kazutaka NAKAO, Masayuki UETANI, Izumi MASUDA, Akihiro URANO
  • Patent number: 6904670
    Abstract: A frame jig for a connector is provided in order to be able to easily confirm the kinds of electric wires to be inserted in a connector and the installation locations. The frame jig for a connector includes a holder having a recess and apertures adjacent every location that confronts a respective cavity of the connector retained in the recess. Additionally, at the peripheral rim of the recess at the upper face of the holder, side recesses are provided on the side faces of the holder. First ends of sample electric wires are inserted in the apertures which confront the installation cavities of the corresponding kinds of electric wires to be installed in the connector. The other end of the sample wires inserted into recesses formed in sides of the holder, and locking members are inserted into the side recesses.
    Type: Grant
    Filed: May 22, 2001
    Date of Patent: June 14, 2005
    Assignee: Sumitomo Wiring System, Ltd.
    Inventors: Hiroshi Kawamura, Katsunari Tafuku, Kazutaka Nakao
  • Publication number: 20010047584
    Abstract: A frame jig for a connector is provided in order to be able to easily confirm the kinds of electric wires to be inserted in a connector and the installation locations. The frame jig for a connector includes a holder having a recess and apertures adjacent every location that confronts a respective cavity of the connector retained in the recess. Additionally, at the peripheral rim of the recess at the upper face of the holder, side recesses are provided on the side faces of the holder. First ends of sample electric wires are inserted in the apertures which confront the installation cavities of the corresponding kinds of electric wires to be installed in the connector. The other end of the sample wires inserted into recesses formed in sides of the holder, and locking members are inserted into the side recesses. A worker can thus confirm the kinds of electric wires and the installation locations by the sample electric wires in order to carry out the installation work of inserting the electric wires.
    Type: Application
    Filed: May 22, 2001
    Publication date: December 6, 2001
    Applicant: SUMITOMO WIRING SYSTEMS, Ltd.
    Inventors: Hiroshi Kawamura, Katsunari Tafuku, Kazutaka Nakao