Patents by Inventor Kazutaka NODA

Kazutaka NODA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEPARATING METHOD, SEPARATING APPARATUS, AND SEPARATING SYSTEM
    Publication number: 20230055853
    Abstract: A separating method includes holding a combined substrate and separating a first substrate. In the holding of the combined substrate, the combined substrate in which the first substrate and a second substrate are bonded is held. In the separating of the first substrate, the first substrate is separated from the combined substrate, starting from a side surface of the combined substrate. The separating of the first substrate includes brining a fluid containing water into contact with the side surface.
    Type: Application
    Filed: August 17, 2022
    Publication date: February 23, 2023
    Inventors: Takashi Terada, Yuji Mimura, Hiroshi Maeda, Kazutaka Noda, Masaru Honda, Ryoichi Sakamoto, Yutaka Yamasaki, Tatsuya Kitayama, Akira Fukutomi
  • Separation apparatus, separation system, and separation method
    Patent number: 10071544
    Abstract: A separation apparatus for separating a superposed substrate in which a processing target substrate and a supporting substrate are joined together with an adhesive, into the processing target substrate and the supporting substrate, includes: a first holding unit which holds the processing target substrate; a second holding unit which holds the supporting substrate; a moving mechanism which relatively moves the first holding unit or the second holding unit in a horizontal direction; a load measurement unit which measures a load acting on the processing target substrate and the supporting substrate when the processing target substrate and the supporting substrate are separated; and a control unit which controls the moving mechanism based on the load measured by the load measurement unit.
    Type: Grant
    Filed: December 4, 2012
    Date of Patent: September 11, 2018
    Assignees: Tokyo Electron Limited, INTEL CORPORATION
    Inventors: Osamu Hirakawa, Masaru Honda, Akira Fukutomi, Takeshi Tamura, Jiro Harada, Kazutaka Noda, Xavier Francois Brun
  • Substrate conveyance apparatus and substrate peeling system
    Patent number: 9679798
    Abstract: Disclosed is a substrate conveyance apparatus capable of suppressing a substrate from being damaged. The substrate conveyance apparatus includes a plurality of nozzles, and a main body unit. The plurality of nozzles are configured to jet a gas toward a surface of a substrate to hold the substrate in a non-contact manner. The main body unit is provided with the plurality of nozzles. At least surfaces of the plurality of nozzles are formed of a resin.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: June 13, 2017
    Assignees: Tokyo Electron Limited, Intel Corporation
    Inventors: Yasuharu Iwashita, Osamu Hirakawa, Yasutaka Soma, Takeshi Tamura, Kazutaka Noda, Xavier Francois Brun, Charles Wayne Singleton, Jr.
  • SUBSTRATE CONVEYANCE APPARATUS AND SUBSTRATE PEELING SYSTEM
    Publication number: 20140234033
    Abstract: Disclosed is a substrate conveyance apparatus capable of suppressing a substrate from being damaged. The substrate conveyance apparatus includes a plurality of nozzles, and a main body unit. The plurality of nozzles are configured to jet a gas toward a surface of a substrate to hold the substrate in a non-contact manner. The main body unit is provided with the plurality of nozzles. At least surfaces of the plurality of nozzles are formed of a resin.
    Type: Application
    Filed: February 18, 2014
    Publication date: August 21, 2014
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Yasuharu IWASHITA, Osamu HIRAKAWA, Yasutaka SOMA, Takeshi TAMURA, Kazutaka NODA