Patents by Inventor Kazutaka Ono

Kazutaka Ono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210032155
    Abstract: A supporting glass substrate has a ratio of a Young's modulus (GPa) to a density (g/cm3) that is 37.0 (GPa·cm3/g) or more and the ratio has a value larger than a ratio calculation value, the ratio calculation value being a ratio of a Young's modulus (GPa) calculated from a composition to a density (g/cm3). The ratio calculation value is represented by the following expression: ?=2·?{(Vi·Gi)/Mi·Xi}, where, in the expression, Vi is a filling parameter of a metal oxide contained in the supporting glass substrate, Gi is a dissociation energy of a metal oxide contained in the supporting glass substrate. Mi is a molecular weight of a metal oxide contained in the supporting glass substrate, and Xi is a molar ratio of a metal oxide contained in the supporting glass substrate.
    Type: Application
    Filed: July 29, 2020
    Publication date: February 4, 2021
    Applicant: AGC Inc.
    Inventors: Seiji INABA, Yasunari SAITO, Kiyoshi TAMAI, Kazutaka ONO, Yuha KOBAYASHI
  • Publication number: 20210024403
    Abstract: An alkali-free glass has a strain point of 650° C. or more, an average coefficient of thermal expansion at 50 to 350° C. of from 30×10?7 to 45×10?7/° C., and a temperature T2 at which a glass viscosity reaches 102 dPa·s of from 1,500 to 1,800° C. The alkali-free glass contains, as represented by mol % based on oxides, SiO2: from 62 to 70%, Al2O3: from 9 to 16% B2O3: from 0 to 12%, MgO: from 3 to 10%, CaO: from 4 to 12%, SrO: from 0 to 6%, and Fe2O3: from 0.001 to 0.04%, provided that MgO+CaO+SrO+BaO is from 12 to 25%. The alkali-free glass has a ?-OH value of from 0.35 to 0.85/mm.
    Type: Application
    Filed: October 14, 2020
    Publication date: January 28, 2021
    Applicant: AGC Inc.
    Inventors: Hirofumi TOKUNAGA, Kazutaka ONO, Motoyuki HIROSE
  • Publication number: 20210024402
    Abstract: To provide a glass plate having a high Young's modulus and a high devitrification viscosity. A glass includes, in mol % based on oxides: SiO2 of 30.0 to 50.0%; B2O3 of 10.0 to 30.0%; Al2O3of 10.0 to 30.0%; Y2O3 of 3.0 to 17.0%; and Gd2O3 of 3.5 to 17.0%, in which (Gd2O3+Y2O3) is from 16.0 to 22.0%, and (Gd2O3/Y2O3) is from 0.15 to 7.0.
    Type: Application
    Filed: August 28, 2020
    Publication date: January 28, 2021
    Applicant: AGC Inc.
    Inventors: Seiji INABA, Kazutaka ONO
  • Publication number: 20210013598
    Abstract: Provided is a glass substrate with which it is possible to reduce dielectric loss in high-frequency signals, and which also has excellent thermal shock resistance. This invention satisfies the relation {Young's modulus (GPa)×average thermal expansion coefficient (ppm/° C.) at 50-350° C}?300 (GPa·ppm/° C.), wherein the relative dielectric constant at 20° C. and 35 GHz does not exceed 10, and the dielectric dissipation factor at 20° C. and 35 GHz does not exceed 0.006.
    Type: Application
    Filed: September 16, 2020
    Publication date: January 14, 2021
    Applicant: AGC Inc.
    Inventors: Shuhei NOMURA, Kazutaka ONO
  • Patent number: 10882778
    Abstract: A glass substrate includes, as a glass matrix composition as represented by mole percentage based on oxides, SiO2: 55%-75%, Al2O3: 2%-15%, MgO: 0%-10%, CaO: 0%-10%, SrO: 0%-10%, BaO: 0%-15%, ZrO2: 0%-5%, Na2O: 0%-20%, K2O: 5%-30%, and Li2O: 0%-5.0%. The glass substrate has a total content of alkali metal oxides, as represented by mole percentage based on oxides, of 10%-30%, a value obtained by dividing the total content of alkali metal oxides by the content of SiO2 of 0.50 or smaller, a value obtained by dividing the content of Na2O by a value obtained by subtracting the content of Al2O3 from a total content of Na2O and K2O of 0.90 or smaller, and an average coefficient of thermal expansion ?1 at 50° C.-350° C. of 11 ppm/° C.-16 ppm/° C.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: January 5, 2021
    Assignee: AGC Inc.
    Inventors: Shigeki Sawamura, Kazutaka Ono, Yu Hanawa
  • Publication number: 20200407267
    Abstract: The present invention relates to a substrate having a dielectric loss tangent (A) as measured at 20° C. and 10 GHz of 0.1 or less, a dielectric loss tangent (B) as measured at 20° C. and 35 GHz of 0.1 or less, and a ratio [a dielectric loss tangent (C) as measured at an arbitrary temperature in a range of ?40 to 150° C. and at 10 GHz]/[the dielectric loss tangent (A)] of 0.90-1.10, or a substrate having a relative permittivity (a) as measured at 20° C. and 10 GHz of 4 or more and 10 or less, a relative permittivity (b) as measured at 20° C. and 35 GHz of 4 or more and 10 or less, and a ratio [a relative permittivity (c) as measured at an arbitrary temperature in a range of ?40 to 150° C. and at 10 GHz]/[the relative permittivity (a)] of 0.993-1.007.
    Type: Application
    Filed: September 16, 2020
    Publication date: December 31, 2020
    Applicant: AGC Inc.
    Inventors: Shuhei NOMURA, Kazutaka ONO
  • Publication number: 20200407264
    Abstract: A glass has a density of 2.60 g/cm3 or lower, a Young's modulus of 88 GPa or more, a strain point of 650 to 720° C., a temperature T4 at which a glass viscosity reaches 104 dPa·s of 1,320° C. or lower, a glass surface devitrification temperature (Tc) of T4+20° C. or lower, and an average coefficient of thermal expansion of 30×10?7 to 43×10?7/° C. at 50 to 350° C. The glass contains, as represented by mol % based on oxides, 50 to 80% of SiO2, 8 to 20% of Al2O3, 0 to 0.5% in total of at least one kind of alkali metal oxide selected from the group consisting of Li2O, Na2O and K2O, and 0 to 1% of P2O5.
    Type: Application
    Filed: September 10, 2020
    Publication date: December 31, 2020
    Applicant: AGC INC.
    Inventors: Hirofumi TOKUNAGA, Kazutaka ONO
  • Publication number: 20200407265
    Abstract: An alkali free glass has an average coefficient of thermal expansion at 50 to 350° C. of 30×10?7 to 43×10?7/° C., a Young's modulus of 88 GPa or more, a strain point of 650 to 725° C., a temperature T4 at which a viscosity reaches 104 dPa·s of 1,290° C. or lower, a glass surface devitrification temperature (Tc) of T4+20° C. or lower, and a temperature T2 at which the viscosity reaches 102 dPa·s of 1,680° C. or lower. The alkali free glass contains, as represented by mol % based on oxides, 62 to 67% of SiO2, 12.5 to 16.5% of Al2O3, 0 to 3% of B2O3, 8 to 13% of MgO, 6 to 12% of CaO, 0.5 to 4% of SrO, and 0 to 0.5% of BaO. MgO+CaO+SrO+BaO is 18 to 22%, and MgO/CaO is 0.8 to 1.33.
    Type: Application
    Filed: September 11, 2020
    Publication date: December 31, 2020
    Applicant: AGC Inc.
    Inventors: Hirofumi TOKUNAGA, Kazutaka ONO
  • Patent number: 10822264
    Abstract: The present invention relates to an alkali-free glass substrate, in which when two arbitrary sites in one main surface thereof are selected, an absolute value of a difference between a thermal shrinkage ratio in an arbitrary direction at one site and a thermal shrinkage ratio in a direction orthogonal to the arbitrary direction at another site is 2 ppm or less, provided that the thermal shrinkage ratio is calculated by measuring a deformation amount in a measuring direction of the glass substrate between before and after a heat treatment of raising a temperature from normal temperature to 600° C. at 100° C./hour, holding the glass substrate at 600° C. for 80 minutes, and lowering the temperature from 600° C. to normal temperature at 100° C./hour.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: November 3, 2020
    Assignee: AGC INC.
    Inventors: Tetsushi Takiguchi, Shunji Inoue, Kazutaka Ono, Hirofumi Tokunaga, Jun Akiyama, Yasumasa Kato, Taketoshi Taniguchi
  • Patent number: 10759691
    Abstract: The present invention provides a glass substrate in which in a heat treatment step of sticking a silicon substrate and a glass substrate to each other, an alkali ion is hardly diffused into the silicon substrate, and a residual strain generated in the silicon substrate is small. A glass substrate of the present invention has: an average thermal expansion coefficient ?50/100 at 50° C. to 100° C. of 2.70 ppm/° C. to 3.20 ppm/° C.; an average thermal expansion coefficient ?200/300 at 200° C. to 300° C. of 3.45 ppm/° C. to 3.95 ppm/° C.; a value ?200/300/?50/100 obtained by dividing the average thermal expansion coefficient ?200/300 at 200° C. to 300° C. by the average thermal expansion coefficient ?50/100 at 50° C. to 100° C. of 1.20 to 1.30; and a content of an alkali metal oxide being 0% to 0.1% as expressed in terms of a molar percentage based on oxides.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: September 1, 2020
    Assignee: AGC Inc.
    Inventors: Shuhei Nomura, Kazutaka Ono
  • Patent number: 10730786
    Abstract: The present invention relates to an alkali-free glass and a method for producing the same. More specifically, the present invention relates to an alkali-free glass suitable as a glass for substrates of various displays such as liquid crystal display, and a method for producing the same. According to the present invention, an alkali-free glass suitable as a glass for display substrates, in which inclusion of bubbles is greatly reduced by virtue of containing a refining agent and suppressing the stirring reboil, is obtained.
    Type: Grant
    Filed: April 24, 2019
    Date of Patent: August 4, 2020
    Assignee: AGC INC.
    Inventors: Hirofumi Tokunaga, Kazutaka Ono, Motoyuki Hirose
  • Patent number: 10683233
    Abstract: A light selective transmission type glass 10 according to the present invention includes: a glass substrate 12; and a light selective transmission layer 11 provided on at least one main surface of the glass substrate 12. The glass substrate 12 has an average thermal expansion coefficient ?50/100 at 50° C. to 100° C. of 2.70 ppm/° C. to 3.20 ppm/° C., an average thermal expansion coefficient ?200/300 at 200° C. to 300° C. of 3.45 ppm/° C. to 3.95 ppm/° C., a value ?200/300/?50/100 obtained by dividing the average thermal expansion coefficient ?200/300 at 200° C. to 300° C. by the average thermal expansion coefficient ?50/100 at 50° C. to 100° C. of 1.20 to 1.30, and a content of an alkali metal oxide being 0% to 0.1%.
    Type: Grant
    Filed: August 2, 2017
    Date of Patent: June 16, 2020
    Assignee: AGC Inc.
    Inventors: Shuhei Nomura, Kazutaka Ono, Yoshiharu Ooi, Hiroki Hotaka
  • Patent number: 10669454
    Abstract: Disclosed is a method for manufacturing a semiconductor device which includes: a semiconductor chip; a substrate and/or another semiconductor chip; and an adhesive layer interposed therebetween. This method comprises the steps of: heating and pressuring a laminate having: the semiconductor chip; the substrate; the another semiconductor chip or a semiconductor wafer; and the adhesive layer by interposing the laminate with pressing members for temporary press-bonding to thereby temporarily press-bond the substrate and the another semiconductor chip or the semiconductor wafer to the semiconductor chip; and heating and pressuring the laminate by interposing the laminate with pressing members for main press-bonding, which are separately prepared from the pressing members for temporary press-bonding, to thereby electrically connect a connection portion of the semiconductor chip and a connection portion of the substrate or the another semiconductor chip.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: June 2, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kazutaka Honda, Koichi Chabana, Keishi Ono, Akira Nagai
  • Publication number: 20200123043
    Abstract: A glass substrate for a high-frequency device, which contains SiO2 as a main component, the glass substrate having a total content of alkali metal oxides in the range of 0.001-5% in terms of mole percent on the basis of oxides, the alkali metal oxides having a molar ratio represented by Na2O/(Na2O+K2O) in the range of 0.01-0.99, and the glass substrate having a total content of alkaline earth metal oxides in the range of 0.1-13% in terms of mole percent on the basis of oxides, wherein at least one main surface of the glass substrate has a surface roughness of 1.5 nm or less in terms of arithmetic average roughness Ra, and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.
    Type: Application
    Filed: December 19, 2019
    Publication date: April 23, 2020
    Applicant: AGC Inc.
    Inventors: Kazutaka ONO, Shuhei NOMURA, Nobutaka KIDERA, Nobuhiko TAKESHITA
  • Publication number: 20200095481
    Abstract: Disclosed is a method for manufacturing a semiconductor device which includes: a semiconductor chip; a substrate and/or another semiconductor chip; and an adhesive layer interposed therebetween. This method comprises the steps of: heating and pressuring a laminate having: the semiconductor chip; the substrate; the another semiconductor chip or a semiconductor wafer; and the adhesive layer by interposing the laminate with pressing members for temporary press-bonding to thereby temporarily press-bond the substrate and the another semiconductor chip or the semiconductor wafer to the semiconductor chip; and heating and pressuring the laminate by interposing the laminate with pressing members for main press-bonding, which are separately prepared from the pressing members for temporary press-bonding, to thereby electrically connect a connection portion of the semiconductor chip and a connection portion of the substrate or the another semiconductor chip.
    Type: Application
    Filed: November 12, 2019
    Publication date: March 26, 2020
    Inventors: Kazutaka HONDA, Koichi CHABANA, Keishi ONO, Akira NAGAI
  • Patent number: 10515864
    Abstract: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 ?m to 300 ?m, and an inclination angle due to the warpage of 0.0004° to 0.12°.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: December 24, 2019
    Assignee: AGC Inc.
    Inventors: Yu Hanawa, Shigeki Sawamura, Shuhei Nomura, Kazutaka Ono, Nobuhiko Takeshita, Keisuke Hanashima
  • Publication number: 20190385920
    Abstract: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 ?m to 300 ?m, and an inclination angle due to the warpage of 0.0004° to 0.12°.
    Type: Application
    Filed: August 29, 2019
    Publication date: December 19, 2019
    Applicant: AGC Inc.
    Inventors: Yu Hanawa, Shigeki Sawamura, Shuhei Nomura, Kazutaka Ono, Nobuhiko Takeshita, Keisuke Hanashima
  • Publication number: 20190317376
    Abstract: The present invention relates to a liquid crystal display panel having a predetermined size, containing a wiring film formed of a metal, an insulating film containing an inorganic substance and a substrate formed of a non-alkali glass, in which the metal has the product of a Young's modulus (E) and a thermal expansion coefficient (?) at room temperature falling within a predetermined range, ? of the inorganic substance is smaller than that of the non-alkali glass, the non-alkali glass has E of from 70 GPa to 95 GPa and ? of from 32×10?7 to 45×10?7 (1/° C.) in which E and ? satisfies a predetermined formula, and has a predetermined composition.
    Type: Application
    Filed: June 27, 2019
    Publication date: October 17, 2019
    Applicant: AGC Inc.
    Inventors: Kazutaka ONO, Yasumasa KATO, Masaya KUNIGITA
  • Patent number: 10386686
    Abstract: The present invention relates to a liquid crystal display panel having a predetermined size, containing a wiring film formed of a metal, an insulating film containing an inorganic substance and a substrate formed of a non-alkali glass, in which the metal has the product of a Young's modulus (E) and a thermal expansion coefficient (?) at room temperature falling within a predetermined range, ? of the inorganic substance is smaller than that of the non-alkali glass, the non-alkali glass has E of from 70 GPa to 95 GPa and ? of from 32×10?7 to 45×10?7 (1/° C.) in which E and ? satisfies a predetermined formula, and has a predetermined composition.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: August 20, 2019
    Assignee: AGC Inc.
    Inventors: Kazutaka Ono, Yasumasa Kato, Masaya Kunigita
  • Publication number: 20190248697
    Abstract: The present invention relates to an alkali-free glass and a method for producing the same. More specifically, the present invention relates to an alkali-free glass suitable as a glass for substrates of various displays such as liquid crystal display, and a method for producing the same. According to the present invention, an alkali-free glass suitable as a glass for display substrates, in which inclusion of bubbles is greatly reduced by virtue of containing a refining agent and suppressing the stirring reboil, is obtained.
    Type: Application
    Filed: April 24, 2019
    Publication date: August 15, 2019
    Applicant: AGC Inc.
    Inventors: Hirofumi TOKUNAGA, Kazutaka Ono, Motoyuki Hirose