Patents by Inventor Kazutaka Ono

Kazutaka Ono has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11897812
    Abstract: An alkali free glass has an average coefficient of thermal expansion at 50 to 350° C. of 30×10?7 to 43×10?7/° C., a Young's modulus of 88 GPa or more, a strain point of 650 to 725° C., a temperature T4 at which a viscosity reaches 104 dPa·s of 1,290° C. or lower, a glass surface devitrification temperature (Tc) of T4+20° C. or lower, and a temperature T2 at which the viscosity reaches 102 dPa·s of 1,680° C. or lower. The alkali free glass contains, as represented by mol % based on oxides, 62 to 67% of SiO2, 12.5 to 16.5% of Al2O3, 0 to 3% of B2O3, 8 to 13% of MgO, 6 to 12% of CaO, 0.5 to 4% of SrO, and 0 to 0.5% of BaO. MgO+CaO+SrO+BaO is 18 to 22%, and MgO/CaO is 0.8 to 1.33.
    Type: Grant
    Filed: July 8, 2022
    Date of Patent: February 13, 2024
    Assignee: AGC Inc.
    Inventors: Hirofumi Tokunaga, Kazutaka Ono
  • Patent number: 11753330
    Abstract: A glass substrate contains, as a glass matrix composition as represented by mole percentage based on oxides, SiO2: 58-75%, Al2O3: 4.5-16%, B2O3: 0-6%, MgO: 0-6%, CaO: 0-6%, SrO: 5-20%, BaO: 5-20%, and MgO+CaO+SrO+BaO:15-40%. The glass substrate has an alkali metal oxide content of 0-0.1% as represented by mole percentage based on oxides. The glass substrate has an average coefficient of thermal expansion ? of 56-90 (×10?7/° C.) at 50° C.-350° C.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: September 12, 2023
    Assignee: AGC INC.
    Inventors: Yu Hanawa, Kazutaka Ono, Shigeki Sawamura
  • Patent number: 11715673
    Abstract: The present invention provides a glass substrate in which in a step of sticking a glass substrate and a silicon-containing substrate to each other, bubbles hardly intrude therebetween. The present invention relates to a glass substrate for forming a laminated substrate by lamination with a silicon-containing substrate, having a warpage of 2 ?m to 300 ?m, and an inclination angle due to the warpage of 0.0004° to 0.12°.
    Type: Grant
    Filed: July 6, 2021
    Date of Patent: August 1, 2023
    Assignee: AGC Inc.
    Inventors: Yu Hanawa, Shigeki Sawamura, Shuhei Nomura, Kazutaka Ono, Nobuhiko Takeshita, Keisuke Hanashima
  • Patent number: 11708294
    Abstract: A glass substrate for a high-frequency device, which contains SiO2 as a main component, the glass substrate having a total content of alkali metal oxides in the range of 0.001-5% in terms of mole percent on the basis of oxides, the alkali metal oxides having a molar ratio represented by Na2O/(Na2O+K2O) in the range of 0.01-0.99, and the glass substrate having a total content of alkaline earth metal oxides in the range of 0.1-13% in terms of mole percent on the basis of oxides, wherein at least one main surface of the glass substrate has a surface roughness of 1.5 nm or less in terms of arithmetic average roughness Ra, and the glass substrate has a dielectric dissipation factor at 35 GHz of 0.007 or less.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: July 25, 2023
    Assignee: AGC Inc.
    Inventors: Kazutaka Ono, Shuhei Nomura, Nobutaka Kidera, Nobuhiko Takeshita
  • Publication number: 20230223493
    Abstract: The present invention relates to an LED element substrate on which an LED element is to be provided and which includes a glass, in which at least one main surface of the substrate is black, and one or more LED elements are to be provided on the black main surface, and relates to an LED element substrate on which an LED element is to be provided and which includes a glass, in which at least one main surface of the substrate is black, the substrate comprises a plurality of holes, and one or more LED elements are to be provided on an inside of each of the holes.
    Type: Application
    Filed: March 13, 2023
    Publication date: July 13, 2023
    Applicant: AGC Inc.
    Inventors: Hirofumi TOKUNAGA, Kazutaka ONO, Takefumi ABE, Naoya WADA
  • Publication number: 20230154938
    Abstract: A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.
    Type: Application
    Filed: December 15, 2022
    Publication date: May 18, 2023
    Applicant: AGC INC.
    Inventors: Kazutaka ONO, Takatoshi YAOITA, Reo USUI, Kenichi EBATA, Jun AKIYAMA
  • Publication number: 20230142463
    Abstract: The present invention relates to a liquid crystal display panel having a predetermined size, containing a wiring film formed of a metal, an insulating film containing an inorganic substance and a substrate formed of a non-alkali glass, in which the metal has the product of a Young's modulus (E) and a thermal expansion coefficient (?) at room temperature falling within a predetermined range, ? of the inorganic substance is smaller than that of the non-alkali glass, the non-alkali glass has E of from 70 GPa to 95 GPa and ? of from 32×10?7 to 45×10?7 (1/° C.) in which E and ? satisfies a predetermined formula, and has a predetermined composition.
    Type: Application
    Filed: December 29, 2022
    Publication date: May 11, 2023
    Applicant: AGC Inc.
    Inventors: Kazutaka ONO, Yasumasa KATO, Masaya KUNIGITA
  • Publication number: 20230140716
    Abstract: The present invention relates to a liquid crystal display panel having a predetermined size, containing a wiring film formed of a metal, an insulating film containing an inorganic substance and a substrate formed of a non-alkali glass, in which the metal has the product of a Young's modulus (E) and a thermal expansion coefficient (?) at room temperature falling within a predetermined range, ? of the inorganic substance is smaller than that of the non-alkali glass, the non-alkali glass has E of from 70 GPa to 95 GPa and a of from 32×10?7 to 45×10?7 (1/° C.) in which E and ? satisfies a predetermined formula, and has a predetermined composition.
    Type: Application
    Filed: December 29, 2022
    Publication date: May 4, 2023
    Applicant: AGC Inc.
    Inventors: Kazutaka ONO, Yasumasa KATO, Masaya KUNIGITA
  • Publication number: 20230118345
    Abstract: A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.
    Type: Application
    Filed: December 15, 2022
    Publication date: April 20, 2023
    Applicant: AGC INC.
    Inventors: Kazutaka ONO, Takatoshi YAOITA, Reo USUI, Kenichi EBATA, Jun AKIYAMA
  • Publication number: 20230079562
    Abstract: A glass substrate has a compaction of 0.1 to 100 ppm. An absolute value |??50/100| of a difference between an average coefficient of thermal expansion ?50/100 of the glass substrate and an average coefficient of thermal expansion of single-crystal silicon at 50° C. to 100° C., an absolute value |??100/200| of a difference between an average coefficient of thermal expansion ?100/200 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 100° C. to 200° C., and an absolute value |??200/300| of a difference between an average coefficient of thermal expansion ?200/300 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 200° C. to 300° C. are 0.16 ppm/° C. or less.
    Type: Application
    Filed: November 11, 2022
    Publication date: March 16, 2023
    Applicant: AGC INC.
    Inventors: Shuhei NOMURA, Kazutaka ONO
  • Patent number: 11594811
    Abstract: Provided is a glass substrate with which it is possible to reduce dielectric loss in high-frequency signals, and which also has excellent thermal shock resistance. This invention satisfies the relation {Young's modulus (GPa)×average thermal expansion coefficient (ppm/° C.) at 50-350° C.}?300 (GPa·ppm/° C.), wherein the relative dielectric constant at 20° C. and 35 GHz does not exceed 10, and the dielectric dissipation factor at 20° C. and 35 GHz does not exceed 0.006.
    Type: Grant
    Filed: December 14, 2021
    Date of Patent: February 28, 2023
    Assignee: AGC Inc.
    Inventors: Shuhei Nomura, Kazutaka Ono
  • Patent number: 11586084
    Abstract: The present invention relates to a liquid crystal display panel having a predetermined size, containing a wiring film formed of a metal, an insulating film containing an inorganic substance and a substrate formed of a non-alkali glass, in which the metal has the product of a Young's modulus (E) and a thermal expansion coefficient (?) at room temperature falling within a predetermined range, ? of the inorganic substance is smaller than that of the non-alkali glass, the non-alkali glass has E of from 70 GPa to 95 GPa and ? of from 32×10?7 to 45×10?7 (1/° C.) in which E and ? satisfies a predetermined formula, and has a predetermined composition.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: February 21, 2023
    Assignee: AGC Inc.
    Inventors: Kazutaka Ono, Yasumasa Kato, Masaya Kunigita
  • Patent number: 11587958
    Abstract: A carrier substrate to be used, when manufacturing a member for an electronic device on a surface of a substrate, by being bonded to the substrate, includes at least a first glass substrate. The first glass substrate has a compaction described below of 80 ppm or less. Compaction is a shrinkage in a case of subjecting the first glass substrate to a temperature raising from a room temperature at 100° C./hour and to a heat treatment at 600° C. for 80 minutes, and then to a cooling to the room temperature at 100° C./hour.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: February 21, 2023
    Assignee: AGC Inc.
    Inventors: Kazutaka Ono, Takatoshi Yaoita, Reo Usui, Kenichi Ebata, Jun Akiyama
  • Patent number: 11554983
    Abstract: A glass substrate has a compaction of 0.1 to 100 ppm. An absolute value |??50/100| of a difference between an average coefficient of thermal expansion ?50/100 of the glass substrate and an average coefficient of thermal expansion of single-crystal silicon at 50° C. to 100° C., an absolute value |??100/200| of a difference between an average coefficient of thermal expansion ?100/200 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 100° C. to 200° C., and an absolute value |??200/300| of a difference between an average coefficient of thermal expansion ?200/300 of the glass substrate and an average coefficient of thermal expansion of the single-crystal silicon at 200° C. to 300° C. are 0.16 ppm/° C. or less.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: January 17, 2023
    Assignee: AGC INC.
    Inventors: Shuhei Nomura, Kazutaka Ono
  • Publication number: 20220340477
    Abstract: An alkali free glass has an average coefficient of thermal expansion at 50 to 350° C. of 30×10?7 to 43×10?7/° C., a Young's modulus of 88 GPa or more, a strain point of 650 to 725° C., a temperature T4 at which a viscosity reaches 104 dPa·s of 1,290° C. or lower, a glass surface devitrification temperature (Tc) of T4+20° C. or lower, and a temperature T2 at which the viscosity reaches 102 dPa·s of 1,680° C. or lower. The alkali free glass contains, as represented by mol % based on oxides, 62 to 67% of SiO2, 12.5 to 16.5% of Al2O3, 0 to 3% of B2O3, 8 to 13% of MgO, 6 to 12% of CaO, 0.5 to 4% of SrO, and 0 to 0.5% of BaO. MgO+CaO+SrO+BaO is 18 to 22%, and MgO/CaO is 0.8 to 1.33.
    Type: Application
    Filed: July 8, 2022
    Publication date: October 27, 2022
    Applicant: AGC Inc.
    Inventors: Hirofumi TOKUNAGA, Kazutaka ONO
  • Patent number: 11414339
    Abstract: An alkali free glass has an average coefficient of thermal expansion at 50 to 350° C. of 30×10?7 to 43×10?7/° C., a Young's modulus of 88 GPa or more, a strain point of 650 to 725° C., a temperature T4 at which a viscosity reaches 104 dPa·s of 1,290° C. or lower, a glass surface devitrification temperature (Tc) of T4+20° C. or lower, and a temperature T2 at which the viscosity reaches 102 dPa·s of 1,680° C. or lower. The alkali free glass contains, as represented by mol % based on oxides, 62 to 67% of SiO2, 12.5 to 16.5% of Al2O3, 0 to 3% of B2O3, 8 to 13% of MgO, 6 to 12% of CaO, 0.5 to 4% of SrO, and 0 to 0.5% of BaO. MgO+CaO+SrO+BaO is 18 to 22%, and MgO/CaO is 0.8 to 1.33.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: August 16, 2022
    Assignee: AGC Inc.
    Inventors: Hirofumi Tokunaga, Kazutaka Ono
  • Patent number: 11370694
    Abstract: An alkali-free glass substrate includes, as represented by molar percentage based on oxides, 11.0% or more of Al2O3, 8.0% or more of B2O3, and 1% or more of SrO. The alkali-free glass substrate has an average coefficient of thermal expansion ?100/200 at 100 to 200° C. of from 3.10 ppm/° C. to 3.70 ppm/° C., a Young's modulus of 76.0 GPa or less, and a density of 2.42 g/cm3 or more.
    Type: Grant
    Filed: November 19, 2018
    Date of Patent: June 28, 2022
    Assignee: AGC INC.
    Inventors: Shuhei Nomura, Kazutaka Ono
  • Publication number: 20220144685
    Abstract: Suppressing deflection and reducing weight are to be achieved. A supporting glass substrate has a ratio of a Young's modulus (GPa) to a density (g/cm3) that is 37.0 (GPa·cm3/g) or more and the ratio has a value larger than a ratio calculation value, the ratio calculation value being a ratio of a Young's modulus (GPa) calculated from a composition to a density (g/cm3). The ratio calculation value is represented by the following expression: ?=2·?{(Vi·Gi)/Mi·Xi}, where, in the expression, Vi is a filling parameter of a metal oxide contained in the supporting glass substrate, Gi is a dissociation energy of a metal oxide contained in the supporting glass substrate, Mi is a molecular weight of a metal oxide contained in the supporting glass substrate, and Xi is a molar ratio of a metal oxide contained in the supporting glass substrate.
    Type: Application
    Filed: January 27, 2022
    Publication date: May 12, 2022
    Applicant: AGC Inc.
    Inventors: Mikio NAGANO, Seiji INABA, Yasunari SAITO, Kiyoshi TAMAI, Kazutaka ONO, Yuha KOBAYASHI
  • Publication number: 20220102850
    Abstract: Provided is a glass substrate with which it is possible to reduce dielectric loss in high-frequency signals, and which also has excellent thermal shock resistance. This invention satisfies the relation {Young's modulus (GPa)×average thermal expansion coefficient (ppm/° C.) at 50-350° C.}?300 (GPa·ppm/° C.), wherein the relative dielectric constant at 20° C. and 35 GHz does not exceed 10, and the dielectric dissipation factor at 20° C. and 35 GHz does not exceed 0.006.
    Type: Application
    Filed: December 14, 2021
    Publication date: March 31, 2022
    Applicant: AGC Inc.
    Inventors: Shuhei NOMURA, Kazutaka ONO
  • Patent number: 11247933
    Abstract: An alkali-free glass substrate which is a glass substrate includes, as represented by molar percentage based on oxides, 0.1% to 10% of ZnO. The alkali-free glass substrate has an average coefficient of thermal expansion ?50/100 at 50 to 100° C. of from 2.70 ppm/° C. to 3.20 ppm/° C., an average coefficient of thermal expansion ?200/300 at 200 to 300° C. of from 3.45 ppm/° C. to 3.95 ppm/° C., and a value ?200/300/?50/100 obtained by dividing the average coefficient of thermal expansion ?200/300 at 200 to 300° C. by the average coefficient of thermal expansion ?50/100 at 50 to 100° C. of from 1.20 to 1.30.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: February 15, 2022
    Assignee: AGC INC.
    Inventors: Shuhei Nomura, Kazutaka Ono