Patents by Inventor Kazuto AIZAWA

Kazuto AIZAWA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11942353
    Abstract: An adhesive tape for semiconductor processing, which includes a base material, a buffer layer that is provided on at least one surface side of the base material, and an adhesive layer that is provided on the other surface side of the base material. This adhesive tape is configured such that: the buffer layer has a Young's modulus of 10-400 MPa at 23° C. and a rupture energy of 1-9 MJ/m3; and the Young's modulus of the base material at 23° C. is higher than the above-mentioned Young's modulus of the buffer layer.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: March 26, 2024
    Assignee: Lintec Corporation
    Inventors: Kazuto Aizawa, Jun Maeda
  • Patent number: 11842916
    Abstract: A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23° C. of 13 to 80 MJ/m3.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: December 12, 2023
    Assignee: Lintec Corporation
    Inventors: Kazuto Aizawa, Jun Maeda
  • Patent number: 11322385
    Abstract: A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [?m] is a thickness of the pressure sensitive adhesive layer and (C) [?m] is a creep amount.
    Type: Grant
    Filed: October 29, 2020
    Date of Patent: May 3, 2022
    Assignee: LINTEC Corporation
    Inventors: Kazuto Aizawa, Jun Maeda
  • Patent number: 11183416
    Abstract: The pressure sensitive adhesive tape for semiconductor processing includes a base which has a Young's modulus of 1000 MPa or more at 23° C., a buffer layer which is provided on at least one surface of this base, and a pressure sensitive adhesive layer provided on the other surface of the base. The buffer layer has a tensile storage elastic modulus (E23) of 100-2000 MPa at 23° C., and a tensile storage elastic modulus (E60) of 20-1000 MPa at 60° C.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: November 23, 2021
    Assignee: LINTEC Corporation
    Inventors: Kazuto Aizawa, Jun Maeda, Katsuhiko Horigome
  • Publication number: 20210265193
    Abstract: A semiconductor processing adhesive tape that includes a substrate, a buffer layer which is provided on at least one side of the substrate, and an adhesive layer which is provided on the other side of the substrate, wherein the buffer layer has an energy to break at 23° C. of 13 to 80 MJ/m3.
    Type: Application
    Filed: June 4, 2019
    Publication date: August 26, 2021
    Applicant: Lintec Corporation
    Inventors: Kazuto Aizawa, Jun Maeda
  • Publication number: 20210210372
    Abstract: An adhesive tape for semiconductor processing, which includes a base material, a buffer layer that is provided on at least one surface side of the base material, and an adhesive layer that is provided on the other surface side of the base material. This adhesive tape is configured such that: the buffer layer has a Young's modulus of 10-400 MPa at 23° C. and a rupture energy of 1-9 MJ/m3; and the Young's modulus of the base material at 23° C. is higher than the above-mentioned Young's modulus of the buffer layer.
    Type: Application
    Filed: June 4, 2019
    Publication date: July 8, 2021
    Applicant: Lintec Corporation
    Inventors: Kazuto Aizawa, Jun Maeda
  • Publication number: 20210043492
    Abstract: A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [?m] is a thickness of the pressure sensitive adhesive layer and (C) [?m] is a creep amount.
    Type: Application
    Filed: October 29, 2020
    Publication date: February 11, 2021
    Applicant: LINTEC Corporation
    Inventors: Kazuto AIZAWA, Jun MAEDA
  • Patent number: 10854495
    Abstract: A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [?m] is a thickness of the pressure sensitive adhesive layer and (C) [?m] is a creep amount.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: December 1, 2020
    Assignee: LINTEC Corporation
    Inventors: Kazuto Aizawa, Jun Maeda
  • Publication number: 20200040227
    Abstract: A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [?m] is a thickness of the pressure sensitive adhesive layer and (C) [?m] is a creep amount.
    Type: Application
    Filed: September 29, 2017
    Publication date: February 6, 2020
    Applicant: LINTEC Corporation
    Inventors: Kazuto AIZAWA, Jun MAEDA
  • Publication number: 20190382633
    Abstract: The pressure sensitive adhesive tape for semiconductor processing includes a base which has a Young's modulus of 1000 MPa or more at 23° C., a buffer layer which is provided on at least one surface of this base, and a pressure sensitive adhesive layer provided on the other surface of the base. The buffer layer has a tensile storage elastic modulus (E23) of 100-2000 MPa at 23° C., and a tensile storage elastic modulus (E60) of 20-1000 MPa at 60° C.
    Type: Application
    Filed: September 26, 2017
    Publication date: December 19, 2019
    Applicant: LINTEC Corporation
    Inventors: Kazuto AIZAWA, Jun MAEDA, Katsuhiko HORIGOME