Kazuto Kadokawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
Abstract: A part has a body unit; and one or more leg formed on the body unit. One or more slit is formed on the body unit adjacent to the leg. The legs are inserted to insert holes of a printed wiring board or the like and soldered thereto. Since the slit is formed adjacent to the leg, the heat applied to the leg for the soldering is not radiated by the body unit by virtue of the slit. Therefore, the part can be reliably attached to the printed wiring board or the like.
Abstract: A part has a body unit; and one or more leg formed on the body unit. One or more slit is formed on the body unit adjacent to the leg. The legs are inserted to insert holes of a printed wiring board or the like and soldered thereto. Since the slit is formed adjacent to the leg, the heat applied to the leg for the soldering is not radiated by the body unit by virtue of the slit. Therefore, the part can be reliably attached to the printed wiring board or the like.
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