Patents by Inventor Kazuto Ohno

Kazuto Ohno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8358185
    Abstract: A choke structure including: an inside surface conductive pattern formed in the surrounding of a through hole on the surface of a dielectric substrate opposing a waveguide substrate; an outside surface conductive pattern formed in the surrounding of the inside surface conductive pattern positioned apart therefrom; a conductor opening provided between the inside surface conductive pattern and the outside surface conductive pattern and in which a dielectric member is exposed; a dielectric transmission path short-circuited at an end that is formed by an inner layer conductor, which is provided away from the conductor opening by a predetermined distance in the layer-stacking direction of the dielectric substrate; and a plurality of penetrating conductors, which connect the inner layer conductor to the inside surface conductive pattern.
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: January 22, 2013
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazuto Ohno, Takuya Suzuki, Shigeo Udagawa
  • Publication number: 20110187482
    Abstract: A choke structure including: an inside surface conductive pattern formed in the surrounding of a through hole on the surface of a dielectric substrate opposing a waveguide substrate; an outside surface conductive pattern formed in the surrounding of the inside surface conductive pattern positioned apart therefrom; a conductor opening provided between the inside surface conductive pattern and the outside surface conductive pattern and in which a dielectric member is exposed; a dielectric transmission path short-circuited at an end that is formed by an inner layer conductor, which is provided away from the conductor opening by a predetermined distance in the layer-stacking direction of the dielectric substrate; and a plurality of penetrating conductors, which connect the inner layer conductor to the inside surface conductive pattern.
    Type: Application
    Filed: July 31, 2008
    Publication date: August 4, 2011
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kazuto Ohno, Takuya Suzuki, Shigeo Udagawa
  • Patent number: 5443574
    Abstract: A liquid-sealing type vibration-isolating device has a primary fluid chamber and a subsidiary fluid chamber which communicate with each other through a short idle orifice and a long shock orifice, and a switch-over valve for connecting the primary and subsidiary fluid chambers with each other through the idle orifice in the low speed revolution range of an engine mounted on the device and through the long shock orifice in the medium-high speed revolution range. During the shifting of the switch-over valve, in order to prevent sudden increase in the spring constant of the device, the primary fluid is short-circuited with the subsidiary fluid chamber through a communication port, the inside of a valve member, a communication bore and an auxiliary communication passage.
    Type: Grant
    Filed: May 24, 1994
    Date of Patent: August 22, 1995
    Assignees: Honda Giken Kogyo Kabushiki Kaisha, Nok-Megulastik Co., Ltd.
    Inventors: Shuji Ohtake, Hideki Matsuoka, Tetsuo Mikasa, Takeo Naganuma, Kazuto Ohno