Abstract: A managing system for managing slurry, which is supplied to a wire saw. Slurry is prepared in a preparing tank and sent to the wire saw and used to cut workpieces. After usage for cutting workpieces, the slurry is sent to a separating apparatus from the wire saw. The separating apparatus separates impurities from the used slurry to recover a mixture of recyclable dispersing liquid and abrasive grains from the used slurry. The recovered mixture is returned to the preparing tank. The recovered mixture is mixed with fresh abrasive grains and dispersing liquid in the preparing tank to prepare slurry. The property (specific gravity and viscosity) of the slurry in the preparing tank is detected. The amount of fresh abrasive grains and dispersing liquid supplied to the preparing tank is adjusted in accordance with the detection results. Accordingly, slurry having properties that are optimal for the cutting of workpieces is prepared.

Abstract: A wire saw which can improve a working accuracy is provided. When a wire goes to a rightward direction by a rotation of a moving motor, the wire is inclined in such a manner as to be moved toward a right and outer periphery from an inner portion of a work, and a cutting start point of the work becomes a point within the work. Further, when a wire goes to a leftward direction by a rotation of the moving motor, the wire is inclined in such a manner as to be moved toward a left and outer periphery from an inner portion of a work, and a cutting start point of the work becomes a point within the work. Then, the work is cut from the cutting start point by a sufficient slurry containing float abrasive grains supplied to a portion on the wire.

Abstract: A slurry managing system for a wire saw is disclosed. The wire saw includes a wire that has a plurality of wire lines extending in parallel to one another. The wire is supplied with slurry containing abrasive grains in dispersing liquid to cut a workpiece so as to simultaneously produce a multiplicity of wafers. A mixer device mixes the slurry prior to supplying of the slurry to the wire saw. A first supplying device supplies the grains to the mixer device. A second supplying device supplies the dispersing liquid to the mixer device. A first adjusting device adjusts the amount of the grains supplied to the mixer device from the first supplying device. A second adjusting device adjusts the amount of the liquid supplied to the mixer device from the second supplying device.

Abstract: A slurry managing system for a wire saw is disclosed. The wire saw includes a wire that has a plurality of wire lines extending in parallel to one another. The wire is supplied with slurry containing abrasive grains in dispersing liquid to cut a workpiece so as to simultaneously produce a multiplicity of wafers. A mixer device mixes the slurry prior to supplying of the slurry to the wire saw. A first supplying device supplies the grains to the mixer device. A second supplying device supplies the dispersing liquid to the mixer device. A first adjusting device adjusts the amount of the grains supplied to the mixer device from the first supplying device. A second adjusting device adjusts the amount of the liquid supplied to the mixer device from the second supplying device.