Patents by Inventor Kazutoshi Hirata

Kazutoshi Hirata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Sound insulation floor structure and sound insulation floor component as well as method for reducing floor impact sound
    Patent number: 8631900
    Abstract: A sound insulation floor structure comprises a floor backing member, a floor finishing layer, and an intermediate layer between the floor backing member and the floor finishing layer, the intermediate layer comprising a buffer member comprising a nonwoven structure. The nonwoven structure comprises a thermal adhesive fiber under moisture which is melt-bonded to a fiber of the nonwoven structure to fix the fibers. For example, the sound insulation floor structure may comprise, in sequence, a floor backing member 1, a buffer layer 2, an air layer 3, a hard layer 4, and a floor finishing layer 5. In the floor structure, a support member 6 is disposed between the buffer layer 2 and the hard layer 4. The support member may occupy 10 to 70% of a floor area. The sound insulation floor structure prevents subsidence of a floor member due to walking, achieves comfortableness to walk, and has improved floor impact sound insulation.
    Type: Grant
    Filed: March 3, 2011
    Date of Patent: January 21, 2014
    Assignee: Kuraray Co., Ltd.
    Inventors: Noboru Miyake, Masahiko Takamatsu, Hideki Kanezako, Kazutoshi Hirata, Kohei Hayashi, Sumito Kiyooka, Atsumi Adachi, Masaru Koike, Satoshi Koizumi
  • SOUND INSULATION FLOOR STRUCTURE AND SOUND INSULATION FLOOR COMPONENT AS WELL AS METHOD FOR REDUCING FLOOR IMPACT SOUND
    Publication number: 20130025965
    Abstract: A sound insulation floor structure comprises a floor backing member, a floor finishing layer, and an intermediate layer between the floor backing member and the floor finishing layer, the intermediate layer comprising a buffer member comprising a nonwoven structure. The nonwoven structure comprises a thermal adhesive fiber under moisture which is melt-bonded to a fiber of the nonwoven structure to fix the fibers. For example, the sound insulation floor structure may comprise, in sequence, a floor backing member 1, a buffer layer 2, an air layer 3, a hard layer 4, and a floor finishing layer 5. In the floor structure, a support member 6 is disposed between the buffer layer 2 and the hard layer 4. The support member may occupy 10 to 70% of a floor area. The sound insulation floor structure prevents subsidence of a floor member due to walking, achieves comfortableness to walk, and has improved floor impact sound insulation.
    Type: Application
    Filed: March 3, 2011
    Publication date: January 31, 2013
    Applicant: KURARAY CO., LTD.
    Inventors: Noboru Miyake, Masahiko Takamatsu, Hideki Kanezako, Kazutoshi Hirata, Kohei Hayashi, Sumito Kiyooka, Atsumi Adachi, Masaru Koike, Satoshi Koizumi