Abstract: A system for inspecting a condition of parts packaged on a printed-circuit board. The inspection system includes a position detecting device to receive scattered light due to illumination of the printed-circuit board with a laser beam and convert the received scattered light into a position signal. This position signal is used for obtaining luminance data and at least two height data of the parts on the printed-circuit board. Proper height data of the parts is determined on the basis of the difference between the two height data. The inspection system determines the package condition by comparing the final height data with a predetermined reference data.

Abstract: A beam of light is applied to a surface of a circuit board provided with at least one solder portion. The light beam scans the surface of the circuit board. Height data are derived from a portion of the light beam which is scattered at the surface of the circuit board. The height data represent a height of a currently-scanned point of the surface of the circuit board. The height data are accumulatively added for the solder portion. A variation in the height data is calculated. The accumulative addition of the height data is executed and suspended in response to the calculated variation in the height data. A decision is made as to whether the solder portion is acceptable or unacceptable on the basis of a result of the accumulative addition.

Abstract: A printed-circuit board inspection apparatus for checking the condition of each circuit component mounted by soldering on a printed-circuit board is disclosed in which a luminance signal obtained from the reflected light scattering from the printed-circuit board being illuminated is converted through a given threshold level to binary signals, then the binary signals and mask data are processed to calculate the ratio of an area represented by the number of binary "1" signals to an area represented by the number of binary "0" signals, and the soldering condition of the component is judged based on the area ratio. With this arrangement, the inspection is not negatively influenced by the misalignment of the component with a mating soldering land, is capable of judging the amount of solder, and can be performed automatically and efficiently.

Abstract: A linescan apparatus for detecting salient pattern on a surface of a product comprises: a laser light source for continuously emitting a laser beam; a polygon mirror for reflecting the laser beam; a drive for rotating the polygon mirror to scan said laser beam; an f.theta. lens arranged such that the linescan laser beam strikes against the plane perpendicularly; a carrying device for moving the product in the direction substantially perpendicular to the plane; a mirror for reflecting the linescan laser beam reflected at a surface of the product to direct the linescan laser beam to the polygon mirror through the f.theta. lens, the mirror being positioned apart from the second plane; and a beam position detector for detecting unidimensional position of a spot mede by the linescan laser beam projected thereon from the mirror via the polygon mirror. This linescan apparatus provides three-dimensional data of a surface of the product.

Abstract: A heat storage material is described which comprises a mixture of sodium sulfate decahydrate or sodium thiosulfate pentahydrate, and urea. The mixing ratio by mole of the sulfate decahydrate to urea is in the range of 1:1 to 1:3 and the mixing ratio by mole of the thiosulfate pentahydrate to urea is in the range of 1:2 to 1:8.