Patents by Inventor Kazutoshi Itoh

Kazutoshi Itoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10553463
    Abstract: A temperature control system includes a first temperature adjustment unit storing fluid at a first temperature; a second temperature adjustment unit storing fluid at a second temperature higher than the first temperature; a low-temperature flow path for passing fluid supplied from the first temperature adjustment unit; a high-temperature flow path for passing fluid supplied from the second temperature adjustment unit; a bypass flow path for circulating fluid; a combination flow path for passing fluid from the low-temperature flow path, the high-temperature flow path, and the bypass flow path merged at a merging part; a temperature adjustment part that passes fluid from the combination flow path and cools/heats a member of a semiconductor manufacturing device; and a control device that controls valve positions of variable valves attached to the three flow paths upstream of the merging part and adjusts the flow rate distribution ratio for the three flow paths.
    Type: Grant
    Filed: May 24, 2018
    Date of Patent: February 4, 2020
    Assignees: Tokyo Electron Limited, CKD Corporation
    Inventors: Atsushi Kobayashi, Atsuhiko Tabuchi, Hideki Wakai, Kazutoshi Itoh, Yasuhisa Hirose, Keiichi Nishikawa, Takahiro Minatani
  • Publication number: 20180269090
    Abstract: A temperature control system includes a first temperature adjustment unit storing fluid at a first temperature; a second temperature adjustment unit storing fluid at a second temperature higher than the first temperature; a low-temperature flow path for passing fluid supplied from the first temperature adjustment unit; a high-temperature flow path for passing fluid supplied from the second temperature adjustment unit; a bypass flow path for circulating fluid; a combination flow path for passing fluid from the low-temperature flow path, the high-temperature flow path, and the bypass flow path merged at a merging part; a temperature adjustment part that passes fluid from the combination flow path and cools/heats a member of a semiconductor manufacturing device; and a control device that controls valve positions of variable valves attached to the three flow paths upstream of the merging part and adjusts the flow rate distribution ratio for the three flow paths.
    Type: Application
    Filed: May 24, 2018
    Publication date: September 20, 2018
    Inventors: Atsushi KOBAYASHI, Atsuhiko TABUCHI, Hideki WAKAI, Kazutoshi ITOH, Yasuhisa HIROSE, Keiichi NISHIKAWA, Takahiro MINATANI
  • Patent number: 9984908
    Abstract: A temperature control system includes a first temperature adjustment unit storing fluid at a first temperature; a second temperature adjustment unit storing fluid at a second temperature higher than the first temperature; a low-temperature flow path for passing fluid supplied from the first temperature adjustment unit; a high-temperature flow path for passing fluid supplied from the second temperature adjustment unit; a bypass flow path for circulating fluid; a combination flow path for passing fluid from the low-temperature flow path, the high-temperature flow path, and the bypass flow path merged at a merging part; a temperature adjustment part that passes fluid from the combination flow path and cools/heats a member of a semiconductor manufacturing device; and a control device that controls valve positions of variable valves attached to the three flow paths upstream of the merging part and adjusts the flow rate distribution ratio for the three flow paths.
    Type: Grant
    Filed: November 13, 2012
    Date of Patent: May 29, 2018
    Assignees: Tokyo Electron Limited, CKD Corporation
    Inventors: Atsushi Kobayashi, Atsuhiko Tabuchi, Hideki Wakai, Kazutoshi Itoh, Yasuhisa Hirose, Keiichi Nishikawa, Takahiro Minatani
  • Patent number: 9508476
    Abstract: An electromagnetic coil includes a conductor winding 12a formed by winding a conductor 12b a plurality of times about a predetermined axis, and a ceramic layer 12c formed through thermal spraying on an axial end surface of the conductor winding 12a, and having a flattened surface. A maximal value t12 of thickness of the ceramic layer 12c is set to three times or less a maximal value t11 of depth of the recesses formed at the surface of turns of the conductor 12b at the axial end surface.
    Type: Grant
    Filed: July 29, 2015
    Date of Patent: November 29, 2016
    Assignee: CKD CORPORATION
    Inventors: Masayuki Kouketsu, Akihiro Ito, Kazutoshi Itoh, Takashi Hosono, Sadayoshi Muto
  • Publication number: 20150332828
    Abstract: An electromagnetic coil includes a conductor winding 12a formed by winding a conductor 12b a plurality of times about a predetermined axis, and a ceramic layer 12c formed through thermal spraying on an axial end surface of the conductor winding 12a, and having a flattened surface. A maximal value t12 of thickness of the ceramic layer 12c is set to three times or less a maximal value t11 of depth of the recesses formed at the surface of turns of the conductor 12b at the axial end surface.
    Type: Application
    Filed: July 29, 2015
    Publication date: November 19, 2015
    Inventors: Masayuki KOUKETSU, Akihiro ITO, Kazutoshi ITOH, Takashi HOSONO, Sadayoshi MUTO
  • Publication number: 20140262199
    Abstract: A temperature control system includes a first temperature adjustment unit storing fluid at a first temperature; a second temperature adjustment unit storing fluid at a second temperature higher than the first temperature; a low-temperature flow path for passing fluid supplied from the first temperature adjustment unit; a high-temperature flow path for passing fluid supplied from the second temperature adjustment unit; a bypass flow path for circulating fluid; a combination flow path for passing fluid from the low-temperature flow path, the high-temperature flow path, and the bypass flow path merged at a merging part; a temperature adjustment part that passes fluid from the combination flow path and cools/heats a member of a semiconductor manufacturing device; and a control device that controls valve positions of variable valves attached to the three flow paths upstream of the merging part and adjusts the flow rate distribution ratio for the three flow paths.
    Type: Application
    Filed: November 13, 2012
    Publication date: September 18, 2014
    Applicants: Tokyo Electron Limited, CKD Corporation
    Inventors: Atsushi Kobayashi, Atsuhiko Tabuchi, Hideki Wakai, Kazutoshi Itoh, Yasuhisa Hirose, Keiichi Nishikawa, Takahiro Minatani
  • Patent number: 8201989
    Abstract: A fluid mixing system capable of quickly stabilizing flow rates of a plurality of fluids to be mixed is arranged to mix the fluids and deliver a mixture thereof to a container. The system includes a plurality of on-off valves for the respective fluids and delivering the fluids to the container. The on-off valves are caused to open and close in order according to respective duty ratios each indicating an opening/closing ratio in a cycle.
    Type: Grant
    Filed: July 30, 2008
    Date of Patent: June 19, 2012
    Assignee: CKD Corporation
    Inventors: Kazutoshi Itoh, Yasunori Nishimura
  • Publication number: 20110277325
    Abstract: A passage block formed with a passage connectable to a fluid control device comprises a first block member formed with a plurality of first-coupling-face apertures, a second block member formed with a plurality of second-coupling-face apertures in correspondence with the first-bonding-apertures, a first passage-end contact portion formed around each of the first-coupling-face apertures, a second passage-end contact portion formed around each of the second-coupling-face apertures, and a passage-end contact section provided in such a manner that a lower surface of the first block member and an upper surface of the second block member are arranged to face each other so that the first and second passage-end contact portions contact with each other, and the first and second block members are heated under pressure to diffusion-bond the first and second passage-end contact portions to each other.
    Type: Application
    Filed: July 19, 2011
    Publication date: November 17, 2011
    Applicant: CKD CORPORATION
    Inventors: Mitsuru Mamyo, Kazutoshi Itoh
  • Patent number: 7904257
    Abstract: A flow verification system is adapted to verify flow characteristics just after a flow control device starts flow control by verifying a flow rate in a gas piping system which includes a first cutoff valve, the flow control device installed downstream from the first cutoff valve, and a pressure sensor for measuring pressure downstream from the flow control device, flow verification is made based on the pressure measured by the pressure sensor. The flow verification system also includes a benchmark storage device for storing a benchmark which is calculated by integrating the pressure values measured by the pressure sensor during a normal flow control operation, and an abnormality detection device for detecting an abnormal flow of process gas.
    Type: Grant
    Filed: July 18, 2008
    Date of Patent: March 8, 2011
    Assignee: CKD Corporation
    Inventors: Akiko Nakada, Kazutoshi Itoh, Akihito Sugino
  • Publication number: 20090095364
    Abstract: A fluid flow distribution and supply unit for distributing and supplying a fluid is adapted to immediately control a flow rate of a fluid to be distributed and promptly output the fluid at a predetermined flow distribution ratio. The fluid flow distribution and supply unit comprises a flow rate control device for controlling a flow rate of the fluid and a plurality of on/off valves connected to a secondary side of the flow rate control device. The on/off valves are duty controlled to open and close by determining one cycle corresponding to an operation period of the on/off valves and time-dividing the one cycle at the flow distribution ratio.
    Type: Application
    Filed: September 8, 2008
    Publication date: April 16, 2009
    Applicant: CKD CORPORATION
    Inventors: Kazutoshi Itoh, Yasunori Nishimura, Keiichi Nishikawa, Akihito Sugino
  • Publication number: 20090059717
    Abstract: A fluid mixing system capable of quickly stabilizing flow rates of a plurality of fluids to be mixed is arranged to mix the fluids and deliver a mixture thereof to a container. The system includes a plurality of on-off valves for the respective fluids and delivering the fluids to the container. The on-off valves are caused to open and close in order according to respective duty ratios each indicating an opening/closing ratio in a cycle.
    Type: Application
    Filed: July 30, 2008
    Publication date: March 5, 2009
    Applicant: CKD CORPORATION
    Inventors: Kazutoshi Itoh, Yasunori Nishimura
  • Publication number: 20090063059
    Abstract: A flow verification system is adapted to verify flow characteristics just after a flow control device starts flow control by verifying a flow rate in a gas piping system which includes a first cutoff valve, the flow control device installed downstream from the first cutoff valve, and a pressure sensor for measuring pressure downstream from the flow control device, flow verification is made based on the pressure measured by the pressure sensor.
    Type: Application
    Filed: July 18, 2008
    Publication date: March 5, 2009
    Applicant: CKD CORPORATION
    Inventors: Akiko Nakada, Kazutoshi Itoh, Akihito Sugino
  • Publication number: 20080223455
    Abstract: To provide a gas supply unit capable of stabilizing a gas supply amount, the gas supply unit includes a mass flow controller, a first fluid control valve connected to the mass flow controller, a second fluid control valve connected in parallel to the first fluid control valve, and a third fluid control valve placed on a secondary side of the second fluid control valve. An opening degree of the third fluid control valve is adjusted based on a pressure difference between secondary pressure of the first fluid control valve and secondary pressure of the second fluid control valve.
    Type: Application
    Filed: March 10, 2008
    Publication date: September 18, 2008
    Applicants: CKD CORPORATION, KABUSHIKI KAISHA TOSHIBA
    Inventors: Jota Fukuhara, Hotaka Ishizuka, Yoshio Sugimoto, Yasunori Nishimura, Kazutoshi Itoh, Akihito Sugino, Hiroshi Tomita
  • Publication number: 20080202614
    Abstract: A passage block formed with a passage connectable to a fluid control device comprises a first block member formed with a plurality of first-coupling-face apertures, a second block member formed with a plurality of second-coupling-face apertures in correspondence with the first-bonding-apertures, a first passage-end contact portion formed around each of the first-coupling-face apertures, a second passage-end contact portion formed around each of the second-coupling-face apertures, and a passage-end contact section provided in such a manner that a lower surface of the first block member and an upper surface of the second block member are arranged to face each other so that the first and second passage-end contact portions contact with each other, and the first and second block members are heated under pressure to diffusion-bond the first and second passage-end contact portions to each other.
    Type: Application
    Filed: January 3, 2008
    Publication date: August 28, 2008
    Applicant: CKD CORPORATION
    Inventors: Mitsuru Mamyo, Kazutoshi Itoh
  • Patent number: 4941973
    Abstract: Magnetic attracting means, especially a permanent magnet, is disposed in a high pressure feed water heater drain pipe line or air separator water tank of feed water and condensed water systems in a thermoelectric power plant. By adoption of this arrangement, iron oxides contained in water in the feed water and condensed water systems can effectively be attracted and removed by this magnetic attracting means.
    Type: Grant
    Filed: June 29, 1988
    Date of Patent: July 17, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Mamoru Suzuki, Katsumi Suzuki, Kazutoshi Itoh, Akira Minato, Tsuyoshi Kambayashi, Yoshiyuki Hoshino
  • Patent number: 4912934
    Abstract: A hermetically closed circulation type, vapor absorption refrigerator which comprises a high temperature regenerator, a low temperature regenerator a condenser, an evaporator, an absorber and heat exchangers in a hermetically closed circulation system as essential constituent members composed of iron-based materials, where refrigeration is produced by repetitions of concentration of an absorbing solution sealed into the circulation system, dilution with a cooling medium and heat exchange, the inside wall of the high temperature regenerator being provided with a composite film of molybdenum oxides and iron oxide can be operated stably with a high reliability or corrosion resistance.
    Type: Grant
    Filed: October 5, 1988
    Date of Patent: April 3, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Masahiko Itoh, Heihatiro Midorikawa, Kazutoshi Itoh, Yasumasa Furutani, Michihiko Aizawa