Abstract: A light receiving device includes a semiconductor layer, and at least one electrode provided on a surface of the semiconductor layer and electrically connected to the semiconductor layer. A plurality of mesas are formed from the semiconductor layer. The plurality of mesas are arranged in a two-dimensional array. The at least one electrode includes a plurality of electrodes, and each of the plurality of mesas is provided with a corresponding one of the plurality of electrodes. A contact portion has a periphery forming a closed curved shape, the contact portion being a portion at which the plurality of electrodes and the semiconductor layer are in contact with each other.

Abstract: An electronic device includes a first chip, a second chip bonded to the first chip with a bump, a first metal pattern provided on a first surface that is a surface of the first chip facing the second chip, and a second metal pattern provided on a second surface that is a surface of the second chip facing the first chip. The first chip has a first transmission region. A transmittance for light of the first transmission region is higher than a transmittance of a region other than the first transmission region in the first chip. The first metal pattern and the second metal pattern overlap the first transmission region in a thickness direction of the first chip and the second chip. The second metal pattern is located outside the first metal pattern in a direction in which the first surface and the second surface extend.

Abstract: A method of manufacturing a light receiving module according to an embodiment includes positioning a light receiving element, positioning a lens that causes light to converge on the light receiving element, and positioning an optical fiber such that an end surface of the optical fiber is located at a position spaced apart from the lens by a certain distance. The certain distance is a distance that is offset from a focal length of the lens.