Patents by Inventor Kazutoyo Matsumura

Kazutoyo Matsumura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120238686
    Abstract: The present invention relates to a thermoplastic resin composition which comprises 100 parts by weight of a polyamide resin (component A) and 1 to 400 parts by weight of a granular inorganic filler (component B) comprising an inorganic filler having an average particle diameter of 0.01 to 100 ?m and a water-soluble polyester resin binder, and having a bulk density of 0.4 to 1.5 g/mL; and a resin molded article obtained by molding the thermoplastic resin composition. The thermoplastic resin composition is improved in various properties such as extrusion moldability, rigidity, impact resistance, thermal stability and hue, and exhibits an excellent balance between these properties.
    Type: Application
    Filed: April 11, 2012
    Publication date: September 20, 2012
    Applicants: MATSUMURA SANGYO CO., LTD., MITSUBISHI ENGINEERING-PLASTIC CORPORATION
    Inventors: Makoto NAKAMURA, Hiroshi Nakano, Katsuhiro Otsuka, Kazutoyo Matsumura
  • Patent number: 8178608
    Abstract: The present invention relates to a thermoplastic resin composition which comprises 100 parts by weight of a thermoplastic resin (component A) and 1 to 400 parts by weight of a granular inorganic filler (component B) comprising an inorganic filler having an average particle diameter of 0.01 to 100 ?m and a water-soluble polyester resin binder, and having a bulk density of 0.4 to 1.5 g/mL; and a resin molded article obtained by molding the thermoplastic resin composition. The thermoplastic resin composition is improved in various properties such as extrusion moldability, rigidity, impact resistance, thermal stability and hue, and exhibits an excellent balance between these properties.
    Type: Grant
    Filed: April 3, 2007
    Date of Patent: May 15, 2012
    Assignees: Mitsubishi Engineering-Plastics Corporation, Matsumura Sangyo Co., Ltd.
    Inventors: Makoto Nakamura, Hiroshi Nakano, Katsuhiro Otsuka, Kazutoyo Matsumura
  • Publication number: 20100010141
    Abstract: The present invention relates to a thermoplastic resin composition which comprises 100 parts by weight of a thermoplastic resin (component A) and 1 to 400 parts by weight of a granular inorganic filler (component B) comprising an inorganic filler having an average particle diameter of 0.01 to 100 ?m and a water-soluble polyester resin binder, and having a bulk density of 0.4 to 1.5 g/mL; and a resin molded article obtained by molding the thermoplastic resin composition. The thermoplastic resin composition is improved in various properties such as extrusion moldability, rigidity, impact resistance, thermal stability and hue, and exhibits an excellent balance between these properties.
    Type: Application
    Filed: April 3, 2007
    Publication date: January 14, 2010
    Inventors: Makoto Nakamura, Hiroshi Nakano, Katsuhiro Otsuka, Kazutoyo Matsumura
  • Publication number: 20040116578
    Abstract: Provided are a granular inorganic filler which is highly effective in improving the physical properties of resins and excellent in working efficiency, working atmosphere, productivity and economical efficiency, a process for producing the filler, and resin compositions excellent in mechanical properties, surface appearance, flame retardance and antiblock properties. The filler is produced by granulating a mixture comprising inorganic filler particles having a mean particle diameter of 0.01 to 20 &mgr;m and a binder in such a way as to give an apparent density of 0.1 to 3.0 g/ml and a breakage rate of 5 to 80 wt %. The resin compositions are prepared by adding the granular inorganic filler to resins.
    Type: Application
    Filed: December 16, 2003
    Publication date: June 17, 2004
    Inventors: Yasutaka Imanishi, Tateki Arakawa, Junichi Kawashima, Mikio Miyaji, Kazutoyo Matsumura, Tsuyoshi Hamaie, Ryohei Watanabe, Katsuhiro Otsuka