Abstract: A battery pack and a method of diagnosing a failure of an overcurrent detection circuit are provided to diagnosing the overcurrent detection circuit so as to maintain the overcurrent detection circuit in a safe state. A detection signal output from a current detection element connected to an output side of a battery unit is compared with a threshold value. An overcurrent is detected when the detection signal indicates an overcurrent value exceeding the threshold value. In the method, a failure of the overcurrent detection circuit is detected by inputting an overcurrent diagnostic signal to the overcurrent detection circuit.

Abstract: A system for detecting a presence of a person in a hoistway, having: one or more controllers configured to authenticate the person in the hoistway; the one or more controllers being operationally connected to an elevator car in the hoistway and configured to determine whether the person is within a predetermined distance of the elevator car from a signal emitter on the person; wherein when the person is within the predetermined distance of the elevator car, the one or more controllers is configured to transmit a feedback request to the person and stop the elevator car unless the one or more controllers receives feedback to the feedback request within a predetermined period of time.

Abstract: A method for producing a two-dimensional small intestinal organoid having a villus structure, the method including a step 1 of culturing a cell derived from a small intestinal epithelium in an extracellular matrix to obtain a three-dimensional small intestinal organoid, a step 2 of dispersing the three-dimensional small intestinal organoid and monolayer culturing on the extracellular matrix to obtain a two-dimensional small intestinal organoid, and a step 3 of further culturing the two-dimensional small intestinal organoid while letting a culture medium of the two-dimensional small intestinal organoid to flow so that the two-dimensional small intestinal organoid forms a villus structure.

Abstract: A wiring substrate includes a laminated sheet including a first conductor pattern, an inorganic dielectric layer, and a second conductor pattern. The first conductor pattern, the inorganic dielectric layer, and the second conductor pattern are laminated in this order. Also, the first conductor pattern is divided into a plurality of regions.

Abstract: A wiring substrate includes a laminated sheet including a first conductor pattern, an inorganic dielectric layer, and a second conductor pattern. The first conductor pattern, the inorganic dielectric layer, and the second conductor pattern are laminated in this order. Also, the first conductor pattern is divided into a plurality of regions.

Abstract: A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode, and removing the support substrate to expose a second surface of the first electrode after forming the first wiring.

Abstract: A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode, and removing the support substrate to expose a second surface of the first electrode after forming the first wiring.

Abstract: A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode, and removing the support substrate to expose a second surface of the first electrode after forming the first wiring.

Abstract: A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.

Abstract: A screening method for a substance acting on a maintenance of the epithelial properties of cells which enables obtainment of highly-reliable data quickly at low costs is provided. The screening method includes (a) a step for culturing cells on a cell culture substrate that can form a spheroid, (b) a step for causing the cells to contact a test substance, and (c) a step for evaluating an effect of the test substance acting on a maintenance of the epithelial properties of the cells with a change in a morphology of the spheroid being as an indicator. In this case, the step (c) can carry out an evaluation through a measurement of the number of spheroids in a predetermined size or a measurement of the hypoxic areas in the spheroid.

Abstract: A method of manufacturing a circuit board includes forming a first electrode on a support substrate, covering the support substrate and the first electrode with a first insulating layer, polishing the first insulating layer to expose a first surface of the first electrode, forming a first wiring on the first insulating layer after exposing the first surface of the first electrode, the first wiring being connected to the first electrode, and removing the support substrate to expose a second surface of the first electrode after forming the first wiring.

Abstract: A semiconductor chip mounting layer of a package substrate unit includes an insulation layer, a conductive seed metal layer formed on the top surface of the insulation layer, conductive pads formed on the top surface of the conductive seed metal layer, metal posts formed substantially in the central portion on the top surface of the conductive pads, and a solder resist layer that is formed to surround the conductive pads and the metal posts.

Abstract: A process for producing a circuit board includes the steps of etching the third metal layer of a three-layer metal laminate into a predetermined interconnection pattern by photolithography; forming a laminate on the interconnection pattern by a buildup method, the laminate including interconnection patterns with insulating layers provided therebetween, the interconnection patterns being electrically connected to each other; separating a first metal layer from a supporting substrate to detach the laminate; removing the first metal layer of the three-layer metal laminate by etching using a second metal layer as a barrier layer; and removing the exposed second metal layer by etching.

Abstract: A process for producing a circuit board includes the steps of etching the third metal layer of a three-layer metal laminate into a predetermined interconnection pattern by photolithography; forming a laminate on the interconnection pattern by a buildup method, the laminate including interconnection patterns with insulating layers provided therebetween, the interconnection patterns being electrically connected to each other; separating a first metal layer from a supporting substrate to detach the laminate; removing the first metal layer of the three-layer metal laminate by etching using a second metal layer as a barrier layer; and removing the exposed second metal layer by etching.

Abstract: A process for producing a circuit board includes the steps of detachably laminating a metal foil layer on a surface of a supporting substrate; forming a laminate on the metal foil layer by a buildup method, the laminate including interconnection patterns with insulating layers provided therebetween, the interconnection patterns being electrically connected to each other; separating the metal foil layer from the supporting substrate to detach the laminate; and etching the metal foil layer by photolithography so as to form a predetermined interconnection pattern.

Abstract: A relay apparatus for relatively rotating members includes a first member (rotating member) having an internal cylindrical portion, a second member (fixed member) having an external cylindrical portion which surrounds the internal cylindrical portion with a predetermined gap and is relatively rotated with respect to the internal cylindrical portion, a flexible flat cable which is stored along an annular space between the internal cylindrical portion and the external cylindrical portion to be spirally wound and which has an inner peripheral portion held by the internal cylindrical portion and an outer peripheral portion held by the external cylindrical portion, and a C-shaped moving member, movably arranged along the space, for inverting the flexible flat cable 13 in an opening portion 21c. One member of the first member 11 and the second member as rotatably driven and, has a flange formed on the cylindrical portion, and the moving member is arranged on the flange.

Abstract: An antenna having a central axis is supported on a supporting member which in turn is supported on an azimuth gimbal. The antenna and the supporting member are rotatable around an elevation axis perpendicular to the central axis gimbal is supported on a base and is rotatable around an azimuth axis perpendicular to the elevation axis. A first gyro having an input axis parallel to the elevation axis is secured to the supporting member, and a second gyro having an input axis perpendicular to both the central axis and the elevation angle axis is secured to the supporting member. An accelerometer is provided for outputting a signal representative of an inclination angle of the central axis relative to a horizontal plane. An azimuth transmitter is provided for outputting a signal representative of a rotation angle of the azimuth gimbal around the azimuth axis.

Abstract: The two-stage rubber switch comprises a housing; an operating knob; two push bodies slidably supported by the housing; a contact wiring board having four mutually-opposing contact end portions arranged two by two under each push body; a rubber switch member interposed between the housing and the contact wiring board and having four conductive contact pieces arranged so as to be opposed to the four mutually-opposing contact end portions, respectively on the contact wiring board; and two-stage switching members in particular, such as semispherical rubber buckling portions formed together with the rubber switch member or elastically slidable push members. Further, it is preferable to use some semispherical rubber buckling portions of the rubber switch member as click feeling providing members.

Abstract: A lid lock mechanism in an automobile switch panel device. The mechanism includes an open-top case, a switch panel accommodated in said case, a lid to cover the open-top case, pivotal shafts provided in the open-top case, and clutch members provided in a pair of holes in the lid. At a predetermined opening angle, the lid is maintained in a locked condition while the lid is easily closed manually with a force stronger than a predetermined level.