Abstract: An illumination system includes: a light irradiation unit that projects light toward a predetermined illumination area; an image acquisition unit that acquires an image of the illumination area; an object detecting unit that detects a shading object based on image information of the illumination area, acquired by the image acquisition unit; an information generating unit that generates the control information for setting each of the plurality of reflecting mirrors to an on state or an off state such that a plurality of irradiation patterns are alternately irradiated, each of the plurality of irradiation patterns having different arrangement of the dark pixels and the light pixels from each other; and an irradiation control unit that controls the light irradiation unit based on the generated control information.

Abstract: The method for producing a semiconductor device includes: forming an opening in an area of at least one of the complementary metal-oxide semiconductor wafer that includes a first part and the other semiconductor wafer that includes a second part, the opening terminating within the area and not penetrating through the area, the area including corresponding one of the first part and the second part and an outer peripheral part of the corresponding one of the first part and the second part; forming a conduction hole within the first part, the conduction hole communicating with a metallic material in the complementary metal-oxide semiconductor wafer; arranging a first joining material inside the conduction hole and on the first part, and a second joining material on the second part; and joining the arranged first joining material and the arranged second joining material.

Abstract: An irradiation apparatus includes a shielded object detecting unit, an illumination setting unit, an irradiating device, and an illumination controlling unit. The shielded object detecting unit detects a shielded object. Glare is allowable to the shielded object at an upper limit of illumination brightness or less. A driver can visually recognize the shielded object at an lower limit of the illumination brightness or more. The illumination setting unit sets the illumination brightness based on the upper limit and the lower limit of the illumination brightness. The illumination controlling unit controls the irradiating device such that light is emitted in a predetermined irradiation pattern in which a first part of the shielded object is illuminated at the illumination brightness set by the illumination setting unit and a second part of the shielded object is illuminated at a higher illumination brightness than that of the first part.

Abstract: The MEMS device includes MEMS units and a circuit board. Each MEMS unit includes a substrate, a movable part with a movable electrode, a driving electrode, a diagnosis electrode, a plurality of through electrodes, and a plurality of MEMS side electrical contacts. The circuit board includes a plurality of circuit side electrical contacts, a drive circuit that is connected electrically with the driving electrode and the movable electrode through the circuit side electrical contact, the MEMS side electrical contact, and the through electrode, and a diagnosis circuit that is connected electrically with the diagnosis electrode and the movable electrode through the circuit side electrical contact, the MEMS side electrical contact, and the through electrode. The diagnosis electrodes of at least two MEMS units are connected electrically with each other, and are connected to a same MEMS side electrical contact through a same through electrode.

Abstract: A first electrode of a first switching element is connected to a first electrode of a second switching element via a first lead frame. A second electrode of the first switching element is connected to an element of a snubber circuit via a second lead frame. A second electrode of the second switching element is connected to the element of the snubber circuit via a third lead frame. A first portion of the element of the snubber circuit is joined to a front face of the second lead frame and a second portion thereof is joined to a front face of the third lead frame. A resin portion has a slit formed to extend from an outer surface of the resin portion to an inside of a gap between opposed end faces of the second lead frame and the third lead frame.

Abstract: Installed in a probe device is a holding member for inspection which can be mounted on a chuck. The holding member for inspection includes a support plate capable of mounting thereon a chip in which the power device is formed; pins for positioning the chip mounted on the support plate; and a metal film formed on a surface of the support plate in a range from a mounting area on which the chip is mounted to an exposed area on which the chip is not mounted. When inspecting the power device, the chip is fixed onto the mounting area in the holding member for inspection, one probe pin is brought into contact with a terminal on a top surface of the chip; and another probe pin is brought into contact with the metal film in the exposed area.

Abstract: Installed in a probe device is a holding member for inspection which can be mounted on a chuck. The holding member for inspection includes a support plate capable of mounting thereon a chip in which the power device is formed; pins for positioning the chip mounted on the support plate; and a metal film formed on a surface of the support plate in a range from a mounting area on which the chip is mounted to an exposed area on which the chip is not mounted. When inspecting the power device, the chip is fixed onto the mounting area in the holding member for inspection, one probe pin is brought into contact with a terminal on a top surface of the chip; and another probe pin is brought into contact with the metal film in the exposed area.