Patents by Inventor Kazuya Hamaya

Kazuya Hamaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF MANUFACTURING CIRCUIT BOARD
    Publication number: 20210212214
    Abstract: First, a router (400) is rotated about a shaft (406) to cause a tip end (402) of the router (400) to move in a vertical direction with respect to a conductive layer (130) while being in contact with the conductive layer (130). In this way, the router (400) is inserted into the conductive layer (130) to form an opening in the conductive layer (130). Next, the router (400) is rotated about the shaft (406) to cause a side surface (404) of the router (400) to move in a horizontal direction with respect to the conductive layer (130) while being contact with the conductive layer (130). In this way, the conductive layer (130) is formed into a conductive pattern (132).
    Type: Application
    Filed: April 24, 2019
    Publication date: July 8, 2021
    Applicant: SUMITOMO BAKELITE CO., LTD.
    Inventors: Shigeyuki Yagi, Kazuya Hamaya
  • Prepreg, method for manufacturing prepreg, substrate, and semiconductor device
    Patent number: 8110444
    Abstract: A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: February 7, 2012
    Assignee: Sumitomo Bakelite Company, Ltd.
    Inventors: Takeshi Hosomi, Maroshi Yuasa, Kazuya Hamaya, Takayuki Baba
  • Prepreg, method for manufacturing prepreg, substrate, and semiconductor device
    Patent number: 8044505
    Abstract: A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided.
    Type: Grant
    Filed: November 30, 2006
    Date of Patent: October 25, 2011
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Takeshi Hosomi, Maroshi Yuasa, Kazuya Hamaya, Takayuki Baba
  • PREPREG, METHOD FOR MANUFACTURING PREPREG, SUBSTRATE, AND SEMICONDUCTOR DEVICE
    Publication number: 20110256367
    Abstract: A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided.
    Type: Application
    Filed: June 28, 2011
    Publication date: October 20, 2011
    Applicant: SUMITOMO BAKELITE COMPANY LIMITED
    Inventors: Takeshi HOSOMI, Maroshi Yuasa, Kazuya Hamaya, Takayuki Baba
  • PREPREG, METHOD FOR MANUFACTURING PREPREG, SUBSTRATE, AND SEMICONDUCTOR DEVICE
    Publication number: 20100300619
    Abstract: A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided.
    Type: Application
    Filed: August 10, 2010
    Publication date: December 2, 2010
    Applicant: SUMITOMO BAKELITE COMPANY LIMITED
    Inventors: Takeshi Hosomi, Maroshi Yuasa, Kazuya Hamaya, Takayuki Baba
  • Prepreg, Method for Manufacturing Prepreg, Substrate, and Semiconductor Device
    Publication number: 20090302462
    Abstract: A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second resin layers to be set appropriately depending on a circuit wiring portion to be embedded into the second resin layer. Further, a method for manufacturing the above prepreg, and a substrate and a semiconductor device having the prepreg are also provided.
    Type: Application
    Filed: November 30, 2006
    Publication date: December 10, 2009
    Inventors: Takeshi Hosomi, Maroshi Yuasa, Kazuya Hamaya, Takayuki Baba