Abstract: In this vehicular imaging device, a positive electrode terminal for a heater and a negative electrode terminal for the heater, which are different from a heater film of a cover glass, are integrally formed with a bracket body of a bracket by insert molding. When the cover glass is disposed in the bracket body, a positive electrode side press-contact part of the positive electrode terminal for the heater and a negative electrode side press-contact part of the negative electrode terminal for the heater are brought into press contact with the heater film of the cover glass. Thus, the positive electrode terminal for the heater, the negative electrode terminal for the heater, and the heater film are electrically connected together.

Abstract: A communication system includes a first intermediate device 10A and a second intermediate device 10B, in which the first intermediate device includes a buffer management unit 15 that determines a buffer size based on delay information and secures a buffer, a transfer unit 11 that, when data to be transferred to a second device 50 is smaller than a credit of the second intermediate device, transfers a request including the data to the second intermediate device, and a generation unit 12A that generates a pseudo-response to the request and returns the pseudo-response to the first device, and the second intermediate device includes a buffer management unit 15 that determines a buffer size based on the delay information and secures a buffer, a transfer unit 11 that transfers the request to the second device and stores the request in the buffer to update the credit of its own device, and a discarding unit 12B that discards a response received from the second device, deletes the request stored in the buffer, and up

Abstract: Composition including (a) a fluoropolymer; and (b1) at least one of a compound represented by the formula (4) ((H—(CF2)7—COO)pM1) or the formula (4?) ((H—(CF2)8—COO)pM1) of the present disclosure, both respectively in an amount of 100 ppb or less relative to the fluoropolymer, or (b2) at least one of a compound represented by the formula (5) ((H—(CF2)13—COO)pM1) or the formula (5?) ((H—(CF2)14—COO)pM1) of the present disclose, both respectively in an amount of 100 ppb or less relative to the fluoropolymer.

Abstract: A utility vehicle includes: a travel structure including a front wheel, a rear wheel, a steering structure mounted to the front wheel, and a drive source that drives the front wheel and/or the rear wheel; circuitry that controls the travel structure to effect autonomous travel without manned operation in a given travel area; a route setter that sets a travel route for the autonomous travel; a vehicle location detector that detects a location of the utility vehicle; and a target detector that detects a monitoring target in the travel area. In case that the monitoring target is detected at a location during the autonomous travel, the circuitry stores the location of the monitoring target as history information. The route setter sets a reference point at the location where the monitoring target was detected and sets the travel route based on the reference point.

Abstract: A solder alloy essentially consists of tin, silver, copper, bismuth, antimony, and cobalt; relative to a total amount of the solder alloy, the silver content is 3 mass % or more and 3.5 mass % or less, the copper content is 0.4 mass % or more and 1.0 mass % or less, the bismuth content is 3.5 mass % or more and 4.8 mass % or less, the antimony content is 3 mass % or more and 5.5 mass % or less, the cobalt content is 0.001 mass % or more and 0.1 mass % or less, the tin content is the balance; and a total of the bismuth content and the antimony content is 7.3 mass % or more and 10.3 mass % or less.

Abstract: A solder alloy essentially consists of tin, silver, copper, bismuth, antimony, and cobalt; relative to a total amount of the solder alloy, the silver content is 3 mass % or more and 3.5 mass % or less, the copper content is 0.4 mass % or more and 1.0 mass % or less, the bismuth content is 3.5 mass % or more and 4.8 mass % or less, the antimony content is 3 mass % or more and 5.5 mass % or less, the cobalt content is 0.001 mass % or more and 0.1 mass % or less, the tin content is the balance; and a total of the bismuth content and the antimony content is 7.3 mass % or more and 10.3 mass % or less.

Abstract: A solder alloy substantially consists of tin, silver, indium, bismuth, and antimony. With respect to the total amount of the solder alloy, the content ratio of the silver is 2.8 mass % or more and 4 mass % or less; the content ratio of the indium is 6.2 mass % or more and 9.0 mass % or less; the content ratio of the bismuth is 0.7 mass % or more and 5.0 mass % or less; the content ratio of the antimony is 0.3 mass % or more and 5.0 mass % or less; and the content ratio of the tin is the remaining ratio and the value of A is 4.36 or less wherein A=0.87×[In content ratio (mass %)]?0.41×[Ag content ratio (mass %)]?0.82×[Sb content ratio (mass %)].

Abstract: A solder alloy is a tin-silver-copper solder alloy substantially consisting of tin, silver, copper, bismuth, nickel, cobalt, and indium. With respect to the total amount of the solder alloy, the content ratio of the silver is 2 mass % or more and 5 mass % or less; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is 0.5 mass % or more and 4.8 mass % or less; the content ratio of the nickel is 0.01 mass % or more and 0.15 mass % or less; the content ratio of the cobalt is 0.001 mass % or more and 0.008 mass % or less; the content ratio of the indium is above 6.2 mass % and 10 mass % or less; and the content ratio of the tin is the remaining ratio.

Abstract: A solder alloy essentially consists of tin, silver, copper, bismuth, antimony, and cobalt. Relative to a total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the copper content is 0.3 mass % or more and 1 mass % or less, the bismuth content is more than 4.8 mass % and 10 mass % or less, the antimony content is 3 mass % or more and 10 mass % or less, the cobalt content is 0.001 mass % or more and 0.3 mass % or less, and the tin content is the remaining portion.

Abstract: A solder alloy substantially consists of tin, silver, indium, bismuth, and antimony. With respect to the total amount of the solder alloy, the content ratio of the silver is 2.8 mass % or more and 4 mass % or less; the content ratio of the indium is 6.2 mass % or more and 9.0 mass % or less; the content ratio of the bismuth is 0.7 mass % or more and 5.0 mass % or less; the content ratio of the antimony is 0.3 mass % or more and 5.0 mass % or less; and the content ratio of the tin is the remaining ratio and the value of A in the discriminant (1) is 4.36 or less. A=0.87×[In content ratio (mass %)]?0.41×[Ag content ratio (mass %)]?0.

Abstract: A solder alloy is a tin-silver-copper solder alloy substantially consisting of tin, silver, copper, bismuth, nickel, cobalt, and indium. With respect to the total amount of the solder alloy, the content ratio of the silver is 2 mass % or more and 5 mass % or less; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is 0.5 mass % or more and 4.8 mass % or less; the content ratio of the nickel is 0.01 mass % or more and 0.15 mass % or less; the content ratio of the cobalt is 0.001 mass % or more and 0.008 mass % or less; the content ratio of the indium is above 6.2 mass % and 10 mass % or less; and the content ratio of the tin is the remaining ratio.

Abstract: A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, and the cobalt content is 0.001 mass % or more and 0.008 mass % or less.

Abstract: A solder alloy is a tin-silver-copper solder alloy, and contains tin, silver, copper, bismuth, nickel, and cobalt. Relative to the total amount of the solder alloy, the silver content is 2 mass % or more and 4 mass % or less, the nickel content is 0.01 mass % or more and 0.15 mass % or less, and the cobalt content is 0.001 mass % or more and 0.008 mass % or less.