Abstract: To facilitate the protection of an exposed portion of a core wire of a cable and enable the acquisition of desired electric wire characteristics A coating portion at an end of a composite electric wire is peeled to expose a core wire and the exposed core wires are bundled and welded to form a composite exposed portion having a welded portion. The composite exposed portion is heated and then immersed in a powder material with which an immersion portion of an immersion container is filled and the powder material is melted to allow a melt thereof to adhere to the composite exposed portion to form a protective member covering the composite exposed portion. Heat-up of the composite exposed portion is set to a melting temperature of the powder material or higher.

Abstract: To provide a method of manufacturing a cable when the cable is obtained by coating a core wire and a method of manufacturing a composite electric wire. To coat an outer circumferential side of a core wire or a plurality of bundled core wires with a coating portion made of an insulating polymeric material, first any exposure target region of the core wire is held below a melting temperature of the insulating polymeric material and a coating target region of the core wire positioned outside the exposure target region is heated to the melting temperature of a powder material (insulating polymeric material in a powder state). Then, the coating portion is formed by immersing the core wire of the coating target region having been heated in the powder material inside an immersion container to allow the insulating polymeric material to adhere to the core wire of the coating target region.

Abstract: In a manufacturing method of a housing-integrated optical semiconductor component, an optical device (26, 27) is packaged on a lead frame (24, 25) having a leg portion (28), and a periphery of the optical device (26, 27) is sealed by an optically transmissive material, whereby an optical semiconductor component (22) is manufactured. Thereafter, a housing (23) is integrally molded to the optical semiconductor component (22) so that the housing (23) covers a portion (30) of the optical semiconductor component, which is sealed by the optically transmissive material.

Abstract: In a manufacturing method of a housing-integrated optical semiconductor component, an optical device (26, 27) is packaged on a lead frame (24, 25) having a leg portion (28), and a periphery of the optical device (26, 27) is scaled by an optically transmissive material, whereby an optical semiconductor component (22) is manufactured. Thereafter, a housing (23) is integrally molded to the optical semiconductor component (22) so that the housing (23) covers a portion (30) of the optical semiconductor component, which is sealed by the optically transmissive material.