Abstract: A semiconductor laser excited solid state laser device and method. The device including a semiconductor laser; a driving device; a solid state laser module which has maximum output efficiency at the set temperature and which generates, from excitation light, an output light of a predetermined output level when the optical noise is at or below a fixed level and the output level of the excitation light is the set output level; a single temperature adjustment device which adjusts the temperature of the semiconductor laser and the temperature of the solid state laser module; and a control device which controls the driving device such that the output light will be at the predetermined output level and controls the temperature adjustment device such that the temperature of the semiconductor laser and the solid state laser module will be the set temperature.

Abstract: The outer shape of a surface to be bonded of a first optical crystal member is formed as a shape in which the length in a direction parallel to an optical axis of the first optical crystal member differs from the length in a direction perpendicular to the optical axis of the first optical crystal member. The outer shape of a surface to be bonded of a second optical crystal member is formed as a shape coinciding with the outer shape of the surface to be bonded of the first optical crystal member or a shape obtained by enlarging or reducing the coinciding shape in an orientation in which an optical axis of the second optical crystal member and the optical axis of the first optical crystal member are adjusted to a prescribed angle.

Abstract: A semiconductor laser excited solid state laser device and method. The device including a semiconductor laser; a driving device; a solid state laser module which has maximum output efficiency at the set temperature and which generates, from excitation light, an output light of a predetermined output level when the optical noise is at or below a fixed level and the output level of the excitation light is the set output level; a single temperature adjustment device which adjusts the temperature of the semiconductor laser and the temperature of the solid state laser module; and a control device which controls the driving device such that the output light will be at the predetermined output level and controls the temperature adjustment device such that the temperature of the semiconductor laser and the solid state laser module will be the set temperature.

Abstract: The present invention realizes an interactive unit attachment structure that enables a projector to have an electronic pen function regardless of the type of projection surface. The attachment structure of the interactive unit, which is provided with a first sensor and a second sensor and which is attached to a wall hanging unit that suspends the projector from the wall such that the interactive unit can slide in a direction projecting from the wall, includes a slot in a slot provided in the wall hanging unit that extends in the direction of sliding and first and second protrusions provided in the interactive unit that protrude into the slot.

Abstract: The outer shape of a surface to be bonded of a first optical crystal member is formed as a shape in which the length in a direction parallel to an optical axis of the first optical crystal member differs from the length in a direction perpendicular to the optical axis of the first optical crystal member. The outer shape of a surface to be bonded of a second optical crystal member is formed as a shape coinciding with the outer shape of the surface to be bonded of the first optical crystal member or a shape obtained by enlarging or reducing the coinciding shape in an orientation in which an optical axis of the second optical crystal member and the optical axis of the first optical crystal member are adjusted to a prescribed angle.

Abstract: A bag-like flexible package is provided which is made of a flexible sheet capable of preventing unintended breakage, has good packing operation workability and a good stability of holding shock-absorbing materials, and exhibits a good workability for operations of suspended ceiling installation and wall mounting installation. The flexible package is made of flexible sheet and has a bag-like configuration having opening at one end thereof whereby it can receive goods therein that are inserted through opening. The flexible package has outwardly convex ridges, outwardly concave valleys, and notches formed on opening. Ridges and valleys are alternately arranged on flexible sheet , and extend in a direction that is orthogonal to or that is oblique to opening .

Abstract: A lens attaching/detaching device includes a lever holding plate that has an elastic piece which presses a lock releasing lever in a direction away from a locking mechanism and holds the lock releasing lever while the lock releasing lever is guided by a lower case. The lock releasing lever includes a first sliding part and a second sliding part which are guided by the lower case. The first sliding part and the second sliding part are arranged at different positions in a Z direction and an X direction orthogonal to a Y direction. An operation part is disposed at the same position as that of the first sliding part in the Z direction. An actuation part is disposed at the same position as that of the second sliding part in the Z direction. The lower case includes a first guiding part which guides the first sliding part and the second guiding part which guides the second sliding part.

Abstract: An electronic device is provided which is capable of reducing variations in the brightness of lights emitted from the light emitting parts. The electronic device has: a housing; a plurality of light sources provided within the housing, each light source emitting light along a light axis, the light axes of the light sources being directed in the same direction; and plurality of light guide plates provided within the housing, the light guide plates guiding the lights emitted from the light sources, respectively. Each light guide plate has a light incident plane on which the light emitted from the light source is incident and a light emitting part that is exposed at an outer surface of the housing.

Abstract: Wafer protecting grooves (10) are provided on an innermost wall (1b) of a container body (1). The wafer protecting grooves have a cross-sectional configuration in the shape of undulations having bottoms (10b), which are most distant from an opening (1a), at respective positions facing the outer edges of semiconductor wafers (W), and having an opening width wider than the thickness of each semiconductor wafer (W). In a normal state, an imaginary line (Q) connecting together the tops of the undulations is inward of or at the same position as the outer edges of the semiconductor wafers (W) facing the imaginary line. Thus, it is possible to obtain superior impact resistance that makes the semiconductor wafers (W) in the container body (1) unlikely to be damaged even when a large impact is applied thereto by a fall or other handling errors.

Abstract: An ink curable with actinic energy rays characterized by containing a photocleavage type photopolymerization initiator (A) comprising ?-aminoalkylphenone compound (A1) having a molar absorption coefficient measured at a wavelength of 363 nm of 100 (l/mol·cm) or more and less than 100,000 (l/mol·cm) and/or an acylphosphine oxide compound (A2) having a molar absorption coefficient measured at a wavelength of 365 nm of 100 (l/mol·cm) or more and less than 100,000 (l/mol·cm); and a hydrogen abstraction type photopolymerization initiator (B) comprising 4,4?-dialkylaminobenzophenone having a molar absorption coefficient at a wavelength of 365 nm of 10,000 (l/mol·cm) or more and less than 1,000,000 (l/mol·cm) and by optionally containing a tertiary amine compound (C) having a molar extinction coefficient as measured at a wavelength of 365 nm of 1 (l/mol·cm) or lower. The ink further includes a resin, a pigment, and a compound having an acrylate group.