Abstract: The purpose of the present invention is to provide a resin composition which enables manufacturing an adhesive sheet for a electrostatic chuck which has excellent heat resistance, low elastic modulus, mitigates the substrate thermal expansion difference with a single layer, and is capable of adhesion and following. The resin composition contains a polymer (A) selected from polyimide and polyamic acid that have a diamine residue of a specific structure (below, the diamine residue (1)) and an acid anhydride residue of a specific structure (below, the acid anhydride residue (2)), and a thermosetting resin (B).

Abstract: An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.

Abstract: An epoxy resin B-stage film obtained by semi-curing an epoxy resin composition, the epoxy resin composition including: a liquid crystalline epoxy monomer capable of forming a cured product that includes a liquid crystal structure; and a curing agent, in which the epoxy resin B-stage film has an average thickness of less than 8 ?m, and in which the liquid crystal structure included in the cured product turns into a liquid crystal structure, in which molecules are orientated in a film thickness direction, by being cured.

Abstract: A resin composition having, in a cured state, a thermal conductivity of 5 W/(m·K) or more and a storage elastic modulus of 8 GPa or less.

Abstract: A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.

Abstract: An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.

Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.

Abstract: Provided is a method of producing a laminate, the method including: a resin layer forming step of forming a resin layer on a first member; and a member arranging step of arranging a second member on the resin layer, in which at least one of the following conditions (1) and (2) is satisfied: (1) the surface roughness (Rz) of a surface of the first member that contacts the resin layer is larger than the surface roughness (Rz) of a surface of the second member that contacts the resin layer; and (2) the surface of the second member that contacts the resin layer has a surface roughness (Rz) of 20 ?m or less.

Abstract: A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.

Abstract: A circuit board production method, the method comprising a process of disposing a circuit sheet on a substrate, the circuit sheet comprising circuits and a resin portion disposed at spaces between the circuits.

Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.

Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.

Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.