Patents by Inventor Kazuya KIGUCHI

Kazuya KIGUCHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210206906
    Abstract: A resin composition having, in a cured state, a thermal conductivity of 5 W/(m·K) or more and a storage elastic modulus of 8 GPa or less.
    Type: Application
    Filed: May 31, 2018
    Publication date: July 8, 2021
    Inventors: Kazuya KIGUCHI, Tomoo NISHIYAMA, Hidetoshi INOUE, Yoshihiro AMANO, Daisuke FUJIMOTO
  • Patent number: 10988585
    Abstract: A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: April 27, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Tomoo Nishiyama, Yoshitaka Takezawa, Hideyuki Katagi, Kazuya Kiguchi
  • Publication number: 20210016546
    Abstract: An epoxy resin has a mesogenic structure and a siloxane structure. An epoxy resin composition includes the epoxy resin having the mesogenic structure and the siloxane structure, and a curing agent.
    Type: Application
    Filed: March 15, 2018
    Publication date: January 21, 2021
    Inventors: Kazuya KIGUCHI, Tomoo NISHIYAMA, Daisuke FUJIMOTO, Norihiko SAKAMOTO
  • Patent number: 10851200
    Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: December 1, 2020
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Kazuya Kiguchi, Tomoo Nishiyama, Yoshitaka Takezawa
  • Publication number: 20200324538
    Abstract: Provided is a method of producing a laminate, the method including: a resin layer forming step of forming a resin layer on a first member; and a member arranging step of arranging a second member on the resin layer, in which at least one of the following conditions (1) and (2) is satisfied: (1) the surface roughness (Rz) of a surface of the first member that contacts the resin layer is larger than the surface roughness (Rz) of a surface of the second member that contacts the resin layer; and (2) the surface of the second member that contacts the resin layer has a surface roughness (Rz) of 20 ?m or less.
    Type: Application
    Filed: May 31, 2017
    Publication date: October 15, 2020
    Inventors: Tomoo NISHIYAMA, Kazuya KIGUCHI, Yoshitaka TAKEZAWA
  • Publication number: 20200223994
    Abstract: A resin sheet includes an epoxy resin including an epoxy resin oligomer and an epoxy resin monomer; a curing agent; and an inorganic filler, wherein a content of the inorganic filler is more than 30% by volume but less than 80% by volume.
    Type: Application
    Filed: August 25, 2016
    Publication date: July 16, 2020
    Inventors: Tomoo NISHIYAMA, Yoshitaka TAKEZAWA, Hideyuki KATAGI, Kazuya KIGUCHI
  • Publication number: 20200163221
    Abstract: A circuit board production method, the method comprising a process of disposing a circuit sheet on a substrate, the circuit sheet comprising circuits and a resin portion disposed at spaces between the circuits.
    Type: Application
    Filed: April 10, 2017
    Publication date: May 21, 2020
    Inventors: Tomoo NISHIYAMA, Mitsuo TOGAWA, Yoshitaka TAKEZAWA, Yuki NAKAMURA, Kazuya KIGUCHI, Yasuo MIYAZAKI, Shinji AMANUMA
  • Patent number: 10590232
    Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.
    Type: Grant
    Filed: May 23, 2017
    Date of Patent: March 17, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Kazuya Kiguchi, Tomoo Nishiyama, Yoshitaka Takezawa
  • Publication number: 20200071455
    Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.
    Type: Application
    Filed: November 8, 2019
    Publication date: March 5, 2020
    Inventors: Kazuya KIGUCHI, Tomoo NISHIYAMA, Yoshitaka TAKEZAWA
  • Publication number: 20190338069
    Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.
    Type: Application
    Filed: May 23, 2017
    Publication date: November 7, 2019
    Inventors: Kazuya KIGUCHI, Tomoo NISHIYAMA, Yoshitaka TAKEZAWA