Abstract: A substrate work system including an information management device to manage traceability information of configuration items that configure a circuit board product; an imaging device to image an identification code attached to the configuration item; and an imaging control device to read the identification code imaged by the imaging device, and transmit a serial number recorded in the identification code to the information management device.

Abstract: A tracing device includes an appropriateness determination section configured to determine whether an image processing, which is executed in a production process of a board product by a board work machine, satisfies an appropriateness condition indicating reliability of a result of the image processing when the result of the image processing stays within a permissible range in which the result of the image processing is determined normal and an information management section configured to record image data used in the image processing as traceability information according to the result of the determination made by the appropriateness condition determination section.

Abstract: An image processing device capable of reducing the load of image processing while shortening the time required for the image processing which uses super-resolution processing. The image processing device includes a process determination section which determines an execution necessity of the super-resolution processing in relation to image data during execution of a production process for every type of target object, a super-resolution processing section which executes the super-resolution processing which uses a plurality of items of the image data according to determination results of the process determination section to generate high resolution data, and a state recognition section which recognizes a state of the target object based on, of the image data and the high resolution data, the one corresponding to the determination results of the process determination section.

Abstract: An electronic component mounting method including a preparatory imaging step of storing preparation position information of component holding sections obtained based on preparation images imaged with no electronic component held by the component holding sections and with a rotary head indexed to multiple indexing angles; a pick-up step of picking up electronic components; an angle information acquisition step of acquiring indexing angle information of the rotary head; a component imaging step of imaging the electronic components with the indexing angle of the rotary head made to coincide with an indexing angle of the rotary head that corresponds to the specific positional information; and a measurement step of measuring a positional deviation amount between a position of the multiple component holding sections that is recognized from the specific positional information and a position of the electronic component that is recognized from the component image obtained in the component imaging step.

Abstract: A component image obtained by imaging a component for which component shape data for image processing is to be created is acquired and displayed on a screen of a display device, and a model pattern corresponding to a measurement target portion of the component image is displayed on the component image in a superimposed manner. At least one fine adjustment icon of fine adjustment icons for finely adjusting a size and/or position of the model pattern superimposed on the component image on the screen of the display device is displayed on the screen of the display device in a predetermined positional relationship with the model pattern.

Abstract: The image-capturing unit includes an imaging section; a holding section configured to hold a subject to be imaged by the imaging section; a light irradiation section configured to select light of one or more light sources out of multiple light sources having different wavelengths, and to irradiate the subject held in the holding section with the light; a storage section configured to store a correspondence among a color of the light emitted for irradiating the subject by the light irradiation section, a material of an irradiation surface irradiated with the light, and a resolution representing the number of pixels per unit length; and an image processing section configured to obtain the resolution from the correspondence, based on the color of the light emitted for irradiating the subject and the material of the irradiation surface of the subject, and to process a subject image by using the resolution.

Abstract: A mounting device sets a processing region for super-resolution processing based on an approximate position of a main body portion of a component included in a mark image for use in obtaining a position of a fiducial mark and then performs super-resolution processing. Thus, the processing region for super-resolution processing can be appropriately set and prevented from becoming larger than necessary with respect to the main body portion of the component. Further, the processing region for super-resolution processing is determined using the mark image captured under an imaging condition different from that for the component image for use in super-resolution processing. Thus, the processing region can be appropriately set while the component image is kept under an imaging condition suitable for super-resolution processing. Therefore, the processing region for performing super-resolution processing can be set more appropriately, and the super-resolution processing can be efficiently performed.

Abstract: An imaging unit of the disclosure includes: a camera; a holding member configured to hold an imaging target object to be imaged by the camera; a light irradiation device configured to irradiate lights of different wavelengths from multiple light sources towards the imaging target object held by the holding member; and a control device configured to obtain a proper resolving power value for a light or lights of one or more light sources selected from the multiple light sources for use for imaging, irradiate the light or lights of the one or more light sources so selected onto the imaging target object to image the imaging target object using the camera, and make use of the proper resolving power value in processing an image obtained from the camera.

Abstract: A transfer state inspection system including a camera configured to capture a transfer state of a transfer material of any of solder, flux, conductive paste, or adhesive transferred to multiple terminals on a lower surface of an electronic component; an image processing section configured to process an image captured by the camera to recognize the transfer state of the transfer material such that the transfer state inspection system inspects the transfer state of the transfer material based on a recognition result of the image processing section; an inspection target specifying section configured to specify whether inspection is necessary for at least a portion of the terminals among the multiple terminals on the lower surface of the electronic component via an operation from an operator or a production program; and an inspection executing section configured to not inspect the transfer state of the transfer material for terminals specified as unnecessary.

Abstract: An apparatus for performing work on a substrate includes an image processing device acquiring multiple images captured at different positions by performing imaging multiple times after a camera has been moved by a moving device such that a reference mark of a circuit board is within a range inside a field of view of the camera, creating a super resolution image using multi-frame super resolution processing, and recognizing the reference mark. The image processing device performs candidate region search processing of processing the image captured initially to search for a region within the image including a portion that has a possibility of being the reference mark as a candidate region after completion of the initial imaging, performs multi-frame super resolution processing on the candidate region after completion of final image capturing, creates a super resolution image of the candidate region, and recognizes the reference mark.

Abstract: A substrate work system including an information management device to manage traceability information of configuration items that configure a circuit board product; an imaging device to image an identification code attached to the configuration item; and an imaging control device to read the identification code imaged by the imaging device, and transmit a serial number recorded in the identification code to the information management device.

Abstract: Mounting device 11 captures an image of reference mark 25 at a first position at which mounting head 22 is stopped under first imaging conditions, and captures an image of component 60 under second imaging conditions. Then, mounting device 11 moves mounting head 22 and captures an image of reference mark 25 at a second position at which mounting head 22 is stopped under the first imaging conditions, and captures a second image of component 60 under the second imaging conditions. Further, mounting device 11 generates an image of component 60 picked up by mounting head 22 based on the positional relationship of reference mark 25 using the first image and the second image.

Abstract: A board production work method which includes a position detection process which detects an arrangement position of a detection target provided on a printed circuit board, and a work executing process which subjects the printed circuit board to predetermined production work based on the detected arrangement position, in which the position detection process includes an image acquisition step of imaging the printed circuit board under multiple imaging conditions and acquiring multiple items of original image data containing luminance values of each pixel arranged in two-dimensional coordinates, a difference calculation step of using two of the multiple items of original image data as calculation targets, calculating differences between luminance values of pixels with same coordinate values, and acquiring difference image data which is formed of luminance difference values of each of the pixels, and a position determination step of determining the arrangement position based on the difference image data.

Abstract: A mounting device sets a processing region for super-resolution processing based on an approximate position of a main body portion of a component included in a mark image for use in obtaining a position of a fiducial mark and then performs super-resolution processing. Thus, the processing region for super-resolution processing can be appropriately set and prevented from becoming larger than necessary with respect to the main body portion of the component. Further, the processing region for super-resolution processing is determined using the mark image captured under an imaging condition different from that for the component image for use in super-resolution processing. Thus, the processing region can be appropriately set while the component image is kept under an imaging condition suitable for super-resolution processing. Therefore, the processing region for performing super-resolution processing can be set more appropriately, and the super-resolution processing can be efficiently performed.

Abstract: A mounting device that, during movement of a mounting head, captures a first image that includes components that are collected in the mounting head and first fiducial marks, captures a second image that includes the components that are collected in the mounting head and second fiducial marks, and generates an image of the components that are collected in the mounting head using the first image and the second image based on the positional relationship of the first fiducial marks and the second fiducial marks. At this time, the mounting device captures the first image after the components and the first fiducial marks enter the same imaging range prior to the second fiducial marks entering the imaging range, and after that, captures the second image after the first fiducial marks come out from the imaging range and the components and the second fiducial marks enter the same imaging range.

Abstract: Mounting device 11 captures an image of reference mark 25 at a first position at which mounting head 22 is stopped under first imaging conditions, and captures an image of component 60 under second imaging conditions. Then, mounting device 11 moves mounting head 22 and captures an image of reference mark 25 at a second position at which mounting head 22 is stopped under the first imaging conditions, and captures a second image of component 60 under the second imaging conditions. Further, mounting device 11 generates an image of component 60 picked up by mounting head 22 based on the positional relationship of reference mark 25 using the first image and the second image.

Abstract: A component orientation determination data creation device for creating component orientation determination data used in a component orientation determination system that determines an orientation of the component by comparing a brightness value of a determination region specified in the component orientation determination data within an image of the component captured by a camera with a determination threshold. A difference image between an image of the component in a correct orientation and an image of the component in another orientation is calculated by acquiring multiple images of the component in different orientations by changing the orientation with respect to the camera of the component that is the target for the component orientation determination data creation.

Abstract: A mounting device that, during movement of a mounting head, captures a first image that includes components that are collected in the mounting head and first fiducial marks, captures a second image that includes the components that are collected in the mounting head and second fiducial marks, and generates an image of the components that are collected in the mounting head using the first image and the second image based on the positional relationship of the first fiducial marks and the second fiducial marks. At this time, the mounting device captures the first image after the components and the first fiducial marks enter the same imaging range prior to the second fiducial marks entering the imaging range, and after that, captures the second image after the first fiducial marks come out from the imaging range and the components and the second fiducial marks enter the same imaging range.

Abstract: An image processing device capable of reducing the load of image processing while shortening the time required for the image processing which uses super-resolution processing. The image processing device includes a process determination section which determines an execution necessity of the super-resolution processing in relation to image data during execution of a production process for every type of target object, a super-resolution processing section which executes the super-resolution processing which uses a plurality of items of the image data according to determination results of the process determination section to generate high resolution data, and a state recognition section which recognizes a state of the target object based on, of the image data and the high resolution data, the one corresponding to the determination results of the process determination section.

Abstract: A power-source apparatus for a vehicle comprises a generator driven by an engine and generating power, a power-storage device storing the power generated by the generator thereat and supplying the power stored thereat to an electric load, and a control device configured to detect a deterioration state of the power-storage device and change a voltage of the power-storage device during a soak in accordance with the deterioration state of the power-storage device detected. Thereby, the improvement of the fuel economy can be achieved and also the necessary durability of the power-storage device can be ensured.