Abstract: Provided is a semiconductor device in which deterioration of electric characteristics which becomes more noticeable as the semiconductor device is miniaturized can be suppressed. The semiconductor device includes a first oxide film, an oxide semiconductor film over the first oxide film, a source electrode and a drain electrode in contact with the oxide semiconductor film, a second oxide film over the oxide semiconductor film, the source electrode, and the drain electrode, a gate insulating film over the second oxide film, and a gate electrode in contact with the gate insulating film. A top end portion of the oxide semiconductor film is curved when seen in a channel width direction.

Abstract: A removal determination device that accurately determines a removal of an exhaust gas purification device from an exhaust pipe. The removal determination device comprises: an input temperature sensor detecting a temperature at an upstream side of casing; an output temperature sensor detecting a temperature at a downstream side of the casing; an engine stop time collector measuring a time period from an inactivation of an engine to a startup of the engine; and a determiner determining a presence of the exhaust gas purifying device based on the input temperature and the output temperature, in a case that the time period is equal to or longer than a predetermined time.

Abstract: A shock absorber includes a cylinder sealed with a working oil liquid, a piston slidably fitted in the cylinder, a piston rod connected to the piston and extended to the outside of the cylinder, and a plurality of passages through which the working oil liquid flows due to the sliding of pistons therein, and a damping force generating mechanism that is provided in a part of the passages and suppresses the flow of the working oil liquid to generate a damping force. The damping force generating mechanism includes a valve body through which the passage penetrates, an annular seat that projects from the valve body and surrounds the passage, and a disc that can be seated on the seat. A contact width at which the disc and the seat come into contact with each other is different depending on a position in the circumferential direction.

Abstract: A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.

Abstract: A conductive film includes an elongated release film and a plurality of conductive adhesive film pieces provided on the release film. Then, the plurality of adhesive film pieces are arranged in a longitudinal direction X of the release film. For this reason, the adhesive film piece can be set to an arbitrary shape. Accordingly, it is possible to attach the adhesive film piece to adhesive surfaces having various shapes and to efficiently use the adhesive film piece.

Abstract: A method of manufacturing a metal structure for an optical semiconductor device, including a treatment step (1) of immersing in and/or applying the solution containing a polyallylamine polymer a base body, the base body including an outermost layer at a portion or entire surfaces of the base body, the outermost layer including a plating of at least one selected from the group consisting of gold, silver, a gold alloy, and a silver alloy, so as to manufacture the metal structure for an optical semiconductor device having an increased adhesion to a resin material.

Abstract: A light emitting device includes a resin package including a first lead, a second lead, a resin portion holding the first lead and the second lead, at least one light emitting element mounted on the resin package, and a covering member covering at least a portion of an upper surface of each of the first lead, the second lead, and the resin portion. The resin portion includes at least one resin recess between the first lead and the second lead. At least a portion of the resin recess is located between a first portion of the first lead and a second portion of the second lead in a first direction, and is located between a first extended portion of the first lead and a second extended portion of the second lead in a second direction, and at least a portion of the resin recess is covered by the covering member.

Abstract: A metallic structure for an optical semiconductor device, including a base body having disposed thereon at least in part metallic layers in the following order; a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and a silver or silver alloy plated layer, wherein the silver or silver alloy plated layer has a thickness in a range of 0.001 ?m or more and 0.01 ?m or less.

Abstract: A light-emitting device includes: a first light-emitting element and a second light-emitting element, each configured to be independently driven; a wall portion located between the first light-emitting element and the second light-emitting element; a first light-transmissive member separated from the second light-emitting element by the wall portion and covering at least a portion of lateral surfaces of the first light-emitting element, wherein the first light-transmissive member contains a first wavelength converting member; and a second light-transmissive member covering the first light-emitting element, the second light-emitting element, and the first light-transmissive member in a plan view, wherein the second light-transmissive member contains a second wavelength converting member. A peak emission wavelength of the first wavelength converting member is longer than a peak emission wavelength of the second wavelength converting member.

Abstract: A metallic structure for an optical semiconductor device, including a base body having disposed thereon at least in part metallic layers in the following order; a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and a silver or silver alloy plated layer, wherein the silver or silver alloy plated layer has a thickness in a range of 0.001 ?m or more and 0.01 ?m or less.

Abstract: A light emitting device includes: a first light emitting element and a second light emitting element, each having a peak emission wavelength in a range of 430 nm to 480 nm; a first light transmissive member disposed on an upper face of the first light emitting element and containing a first phosphor; a second light transmissive member disposed on an upper face of the second light emitting element; and an encapsulant covering the first light transmissive member and the second light transmissive member and containing a second phosphor. The first light emitting element and the second light emitting element are configured to be independently driven. A chromaticity of light exiting from the first light transmissive member differs from a chromaticity of light exiting from the second light transmissive member.

Abstract: A resin package defining a recess includes a first lead having an element-mounting region, a second lead having a wire-connecting region, and a resin body including first to third resin portions. The third resin portion surrounds the element-mounting region. Each of the first and second leads includes a first plating and a second plating covering at least a portion of the first plating. The wire-connecting region is located outward of the third resin portion. The element-mounting region is located on an outermost surface of the second plating. In a top view, the wire-connecting region is located laterally inward of a portion of the second plating of the second lead that has an outermost surface located higher than that of the first plating of the second lead.

Abstract: A method of manufacturing light emitting devices, the method including: providing a first structure, the providing a first structure including: providing a lead frame, the providing a lead frame including: providing a metal plate having a plurality of pairs of first and second metal parts, each of the first and second metal parts including at least one first region and at least one second region; using an electrodeposition technique, disposing a mask of a resist film on the at least one first region; disposing a first plating containing silver or silver alloy on the at least one second region; and removing the resist film; molding a resin molded body in one piece with the lead frame with parts of a lower surface of the lead frame being exposed, in which, the first structure includes an upper surface defining a plurality of recesses each having an upward-facing surface, at least parts of the first plating being located at the upward-facing surface of each of the plurality of recesses; providing a second struct

Abstract: A metallic structure for an optical semiconductor device including a conductive base body having disposed thereon metallic layers in the following order: a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and an indium or indium alloy plated layer, wherein the indium or indium alloy plated layer has a thickness in a range of 0.002 ?m or more and 0.3 ?m or less.

Abstract: A method of manufacturing a light emitting device, including: providing a first structure including: providing a lead frame which includes providing a metal plate including a plurality of pairs of first and second metal parts, each metal part including an upper surface, a lower surface, and an end surface, the end surface of the first metal part and the end surface of the second metal part of each pair are opposite to each other, and a first region including the end surface, and disposing a mask of a resist film on the first region using an electrodeposition technique, disposing a first plated layer containing gold or gold alloy on a second region including the upper surface other than the first region on at least one of the upper surface, the lower surface, and the end surface of each of the first and second metal parts using a plating technique, and removing the resist film, providing a resin molded body molded integrally with the lead frame with parts of a lower surface of the lead frame being exposed, in

Abstract: A lead frame includes a plurality of unit structures, an outer frame, a plurality of extending portions, and a plurality of coupling portions. The unit structures each includes a first lead portion and a second lead portion aligned in a first direction, and grouped into first and second groups including a plurality of the unit structures aligned in the first direction. The extending portions each includes a first extending portion extending in the second direction and connecting the first lead portions of the unit structures in the first and second groups a second extending portion connecting the second lead portions of the unit structures in the first and second groups. The coupling portions connect all the first extending portions and the second extending portions. At least one of the extending portions located at one of ends in the first direction is not directly connected to the outer frame.

Abstract: A metallic structure for an optical semiconductor device including a conductive base body having disposed thereon metallic layers in the following order: a nickel or nickel alloy plated layer, a gold or gold alloy plated layer, and an indium or indium alloy plated layer, wherein the indium or indium alloy plated layer has a thickness in a range of 0.002 ?m or more and 0.3 ?m or less.

Abstract: A shock absorber includes a cylinder sealed with a working oil liquid, a piston slidably fitted in the cylinder, a piston rod connected to the piston and extended to the outside of the cylinder, and a plurality of passages through which the working oil liquid flows due to the sliding of pistons therein, and a damping force generating mechanism that is provided in a part of the passages and suppresses the flow of the working oil liquid to generate a damping force. The damping force generating mechanism includes a valve body through which the passage penetrates, an annular seat that projects from the valve body and surrounds the passage, and a disc that can be seated on the seat. A contact width at which the disc and the seat come into contact with each other is different depending on a position in the circumferential direction.

Abstract: A light-emitting device includes: a first light-emitting element and a second light-emitting element, each having a peak emission wavelength in a range of 430 nm to 480 nm; and a sealing member covering the first light-emitting element and the second light-emitting element, the sealing member containing a first fluorescent material. The first light-emitting element and the second light-emitting element are configured to be individually driven. The sealing member includes a protruding portion at an upper surface thereof. The first light-emitting element is disposed in a first region, which is located under the protruding portion. The second light-emitting element is disposed in a second region, which is located under the upper surface of the sealing member at a position different from the first region.

Abstract: A lead frame includes a plurality of unit structures, an outer frame, a plurality of extending portions, and a plurality of coupling portions. The unit structures each includes a first lead portion and a second lead portion aligned in a first direction, and grouped into first and second groups including a plurality of the unit structures aligned in the first direction. The extending portions each includes a first extending portion extending in the second direction and connecting the first lead portions of the unit structures in the first and second groups a second extending portion connecting the second lead portions of the unit structures in the first and second groups. The coupling portions connect all the first extending portions and the second extending portions. At least one of the extending portions located at one of ends in the first direction is not directly connected to the outer frame.