Abstract: According to one embodiment, a semiconductor storage device includes a board, a first electronic device mounted on the board, at least one second electronic device mounted on the board, and a heat dissipator. At least a portion of the second electronic device overlaps at least one of the board and the first electronic device in a first direction that is a thickness direction of the board. The heat dissipator includes a first member that includes a first portion located between the first electronic device and the second electronic device in the first direction, and a second member that includes a portion located between the first member and the second electronic device in the first direction. The second member is smaller in coefficient of thermal conductivity than the first member.

Abstract: There is provided a rotating electric machine stator manufacturing method for forming a resin film on coil film peeled-off portions of a rotating electric machine stator by liquid resin material, the method including: an immersion process of immersing the coil film peeled-off portions of the rotating electric machine stator in the liquid resin material; and a heat curing process of heat curing the liquid resin material after release of the immersing to form the resin film, wherein the liquid resin material has thixotropy; and the immersion process includes a process of causing the rotating electric machine stator to move in a direction other than a vertical direction at least once at least while the coil film peeled-off portions are immersed in the liquid resin material.

Abstract: A semiconductor storage device according to an embodiment includes a board, an electronic component, and a holder. The board has a first surface. The electronic component includes a component main body and a first lead. The component main body is at a position out of the board in a direction parallel to the first surface. The first lead protrudes from the component main body toward the board. The holder is on the board. The holder holds the first lead.

Abstract: According to one embodiment, a semiconductor storage device includes a board, a first electronic device mounted on the board, at least one second electronic device mounted on the board, and a heat dissipator. At least a portion of the second electronic device overlaps at least one of the board and the first electronic device in a first direction that is a thickness direction of the board. The heat dissipator includes a first member that includes a first portion located between the first electronic device and the second electronic device in the first direction, and a second member that includes a portion located between the first member and the second electronic device in the first direction. The second member is smaller in coefficient of thermal conductivity than the first member.

Abstract: A method of cutting an electronic component mounted on a circuit board includes: a step of applying adhesive to a predetermined area including at least an outermost peripheral portion of an upper surface of the electronic component and attaching a dustproof sheet to the upper surface of the electronic component; and a step of cutting the electronic component while maintaining a state where the dustproof sheet is attached to the outermost peripheral portion.

Abstract: A method of cutting an electronic component mounted on a circuit board includes: a step of applying adhesive to a predetermined area including at least an outermost peripheral portion of an upper surface of the electronic component and attaching a dustproof sheet to the upper surface of the electronic component; and a step of cutting the electronic component while maintaining a state where the dustproof sheet is attached to the outermost peripheral portion.

Abstract: A method of manufacturing a gear member formed into a cylindrical shape, the gear member having an internal gear disposed without overlapping the bearing holding portion in an axial direction, the method including: preparing a cylindrical material with a small-diameter cylindrical portion having an inner diameter corresponding to a tooth tip diameter of the internal gear in a tooth width region of the internal gear such that the small-diameter cylindrical portion is extended from the tooth width region toward the one end portion to reach the bearing holding portion; and inserting a skiving cutter from the other end portion side opposite to the one end portion of the cylindrical material to form the internal gear by skiving in the tooth width region of the small diameter cylindrical portion, and terminating the skiving at a halfway position before reaching the bearing holding portion and across the tooth width region.

Abstract: According to one embodiment a semiconductor storage device includes a housing, a first rigid board, a controller, a second rigid hoard, a first semiconductor memory component, and a first connection board. The first rigid board includes a plurality of first terminals on a surface of the first rigid board. The second rigid board includes a plurality of second terminals on a surface of the second rigid board. The first connection board is in a state in which at least a part of the first connection board is bent. The first connection board includes a first end portion and a second end portion. The first end portion includes a plurality of third terminals connected to the plurality of first terminals of the first rigid board. The second end portion includes a plurality of fourth terminals connected to the plurality of second terminals of the second rigid board.

Abstract: According to one embodiment a semiconductor storage device includes a housing, a first rigid board, a controller, a second rigid hoard, a first semiconductor memory component, and a first connection board. The first rigid board includes a plurality of first terminals on a surface of the first rigid board. The second rigid board includes a plurality of second terminals on a surface of the second rigid board. The first connection board is in a state in which at least a part of the first connection board is bent. The first connection board includes a first end portion and a second end portion. The first end portion includes a plurality of third terminals connected to the plurality of first terminals of the first rigid board. The second end portion includes a plurality of fourth terminals connected to the plurality of second terminals of the second rigid board.

Abstract: A method of manufacturing a gear member formed into a cylindrical shape, the gear member having an internal gear disposed without overlapping the bearing holding portion in an axial direction, the method including: preparing a cylindrical material with a small-diameter cylindrical portion having an inner diameter corresponding to a tooth tip diameter of the internal gear in a tooth width region of the internal gear such that the small-diameter cylindrical portion is extended from the tooth width region toward the one end portion to reach the bearing holding portion; and inserting a skiving cutter from the other end portion side opposite to the one end portion of the cylindrical material to form the internal gear by skiving in the tooth width region of the small diameter cylindrical portion, and terminating the skiving at a halfway position before reaching the bearing holding portion and across the tooth width region.

Abstract: A power conversion apparatus 2 has a configuration in which a plate-like bus-bar 80, 80? is disposed vertically so that a width direction thereof is set in a vertical direction, electrically connected to positive electric potential of a battery and fixed to a resin case 50 to include a flat plate-like bus-bar body 81, 82, to which positive electric potential of the battery is applied, and a voltage measuring terminal 82 to 85 branched from the bus-bar body 81, 82. The voltage measuring terminal 82 to 85 includes a projecting portion 83 projecting from the bus-bar body 81, 82, an upright portion 84 extending from the projecting portion 83 upward toward a circuit board 100, and a measuring terminal portion 85 that is an upper part of the upright portion 84 and electrically connected to the circuit board 100.

Abstract: A power conversion apparatus has a configuration in which plate-like bus-bars are laminated via an insulating material to define a pair of bus-bars. A laminated bus-bar, in which the pair of bus-bars is disposed vertically so that a width direction thereof is in a vertical direction, includes a pair of voltage measuring terminals that is correspondingly branched from a part of the pair of bus-bars to extend toward a circuit board. The pair of voltage measuring terminals is arranged symmetrically with respect to the pair of bus-bars to extend upward toward the circuit board, while extending in an intersecting direction intersecting with the pair of bus-bars, to be electrically connected to the circuit board.

Abstract: A power conversion apparatus has a configuration in which plate-like bus-bars are laminated via an insulating material to define a pair of bus-bars. A laminated bus-bar, in which the pair of bus-bars is disposed vertically so that a width direction thereof is in a vertical direction, includes a pair of voltage measuring terminals that is correspondingly branched from a part of the pair of bus-bars to extend toward a circuit board. The pair of voltage measuring terminals is arranged symmetrically with respect to the pair of bus-bars to extend upward toward the circuit board, while extending in an intersecting direction intersecting with the pair of bus-bars, to be electrically connected to the circuit board.

Abstract: A power conversion apparatus 2 has a configuration in which a plate-like bus-bar 80, 80? is disposed vertically so that a width direction thereof is set in a vertical direction, electrically connected to positive electric potential of a battery and fixed to a resin case 50 to include a flat plate-like bus-bar body 81, 82, to which positive electric potential of the battery is applied, and a voltage measuring terminal 82 to 85 branched from the bus-bar body 81, 82. The voltage measuring terminal 82 to 85 includes a projecting portion 83 projecting from the bus-bar body 81, 82, an upright portion 84 extending from the projecting portion 83 upward toward a circuit board 100, and a measuring terminal portion 85 that is an upper part of the upright portion 84 and electrically connected to the circuit board 100.

Abstract: A power drive unit is configured to comprise a heat sink, a power module pressed by a press member to the heat sink to be fastened thereto and a spring member that has a substantially circular shape and is installed between the power module and the press member. With this, the power module can be fastened to the heat sink without incurring layout limitation, degradation of heat release performance and the like. Also, since the power drive unit further includes a projection that protrudes from the press member to be engaged with an engagement hole bored at the center of the spring member, engagement of the projection of the press member with the engagement hole of the spring member functions to prevent displacement of the press member relative to the spring member, thereby making loads acting on the power modules uniform.

Abstract: A power drive unit is configured to comprise a heat sink, a power module pressed by a press member to the heat sink to be fastened thereto and a spring member that has a substantially circular shape and is installed between the power module and the press member. With this, the power module can be fastened to the heat sink without incurring layout limitation, degradation of heat release performance and the like. Also, since the power drive unit further includes a projection that protrudes from the press member to be engaged with an engagement hole bored at the center of the spring member, engagement of the projection of the press member with the engagement hole of the spring member functions to prevent displacement of the press member relative to the spring member, thereby making loads acting on the power modules uniform.