Abstract: Provided is an IoT data collection system 100 including an agent device 10 configured to acquire IoT data, a management device 20 configured to manage the agent device 10, and a server device 30 configured to receive the IoT data from the agent device 10. The agent device 10 includes a first transmission unit configured to transmit an authentication activation key to the management device 20 at startup. The management device 20 includes a collation unit configured to collate a registered activation key and the authentication activation key, and a transmission unit configured to transmit an authentication agent ID to the agent device 10 when the collation result is matched. The agent device 10 further includes a second transmission unit configured to transmit the IoT data and the authentication agent ID to the server device 30.

Abstract: Provided is an IoT data collection system 100 including an agent device 10 configured to acquire IoT data, a management device 20 configured to manage the agent device 10, and a server device 30 configured to receive the IoT data from the agent device 10. The agent device 10 includes a first transmission unit configured to transmit an authentication activation key to the management device 20 at startup. The management device 20 includes a collation unit configured to collate a registered activation key and the authentication activation key, and a transmission unit configured to transmit an authentication agent ID to the agent device 10 when the collation result is matched. The agent device 10 further includes a second transmission unit configured to transmit the IoT data and the authentication agent ID to the server device 30.

Abstract: Acceleration sensors and a microcomputer are mounted on a sensor mounting board. At this time, the accelerations sensors are arranged so that, even in the case where any detection axes of the acceleration sensors is made horizontal, the other detection axes of the acceleration sensors cannot be horizontal. Then, the microcomputer selects an acceleration sensor in which detection accuracy is the best from among the acceleration sensors, and arithmetically operates a tilt angle of a tilt sensor unit based on an output signal of the selected acceleration sensor.

Abstract: A sensor package P is a surface-mounted sensor package which is adapted to be mounted on a printed board 200. The sensor package P includes a case 1 for accommodating a semiconductor acceleration sensor chip 100 having output pads 101. The case has a bottom wall 10, which is divided into a center area 10a for supporting the sensor chip 100 and a peripheral area 10b. Output electrodes 15 to be connected to the output pads 101 are formed on external surfaces of the peripheral area. These output electrodes 15 are soldered to the printed board 200 for electrical connection between the sensor chip and an electric circuit of the printed board as well as for holding the sensor package physically on the printed board. The feature of the present invention resides in that grooves 12 are formed in an interior surface of the bottom wall 10 between the center area 10a and the peripheral area 10b.

Abstract: A sensor package P is a surface-mounted sensor package which is adapted to be mounted on a printed board 200. The sensor package P includes a case 1 for accommodating a semiconductor acceleration sensor chip 100 having output pads 101. The case has a bottom wall 10, which is divided into a center area 10a for supporting the sensor chip 100 and a peripheral area 10b. Output electrodes 15 to be connected to the output pads 101 are formed on external surfaces of the peripheral area. These output electrodes 15 are soldered to the printed board 200 for electrical connection between the sensor chip and an electric-circuit of the printed board as well as for holding the sensor package physically on the printed board. The feature of the present invention resides in that grooves 12 are formed in an interior surface of the bottom wall 10 between the center area 10a and the peripheral area 10b.

Abstract: An acceleration sensor including a sensor chip for converting into an electrical signal an acceleration applied in a direction of a sensitive axis parallel to a board face of a printed circuit board, which has a first wire bonding face, a wiring base for supporting the sensor chip, which includes second and third wire bonding faces and a wiring pattern formed on the second and third wire bonding faces and a package for accommodating the wiring base having the sensor chip mounted thereon, which has a mounting face to be mounted on the board face of the printed circuit board and a fourth wire bonding face substantially parallel to the mounting face such that the wiring pattern on the third and second wire bonding faces of the wiring base can be connected to pads of the package and pads of the sensor chip, respectively.

Abstract: An acceleration sensor including a sensor chip for converting into an electrical signal an acceleration applied in a direction of a sensitive axis parallel to a board face of a printed circuit board, which has a first wire bonding face, a wiring base for supporting the sensor chip, which includes second and third wire bonding faces and a wiring pattern formed on the second and third wire bonding faces and a package for accommodating the wiring base having the sensor chip mounted thereon, which has a mounting face to be mounted on the board face of the printed circuit board and a fourth wire bonding face substantially parallel to the mounting face such that the wiring pattern on the third and second wire bonding faces of the wiring base can be connected to pads of the package and pads of the sensor chip, respectively.

Abstract: An acceleration sensor element constitutes a piezoresistance type acceleration sensor in which an acceleration sensor chip including a cantilever structure of mass and beam parts and a piezoresistor formed on the beam part is mounted on a main lead which is slanted for positioning the piezoresistor and the center of gravity of the mass part substantially on the same horizontal plane in a mounted state of the sensor. The element thereby improves the reliability and assures such property as other-axis sensitivity of the sensor at the time of shipment.

Abstract: In an acceleration detector for detecting three-dimensional components of acceleration applied thereto independently with respect to three axes X, Y and Z of an orthogonal coordinate system, a plurality of resistance elements having a piezo resistance effect are formed in a thin-sheet resilient member with an unique arrangement thereof for improving the sensitivity of the detector. Electric resistance of the resistance elements is varied in response to strain of the resistance elements accompanied with an elastic deformation of the resilient member. The resilient member is fixed at its periphery on a frame of the detector. A weight is connected with a center portion of the resilient member such that the elastic deformation is caused when the weight is displaced by receiving acceleration.