Abstract: An electronic component-inspection wiring board including a first laminate composed of plural first ceramic layers and having pads formed on a front surface to transmit inspection signals to an electronic component, wiring layers formed between the first ceramic layers , and via-conductors connecting pads to the wiring layers exposed on a rear surface of the first laminate; and a second laminate composed of second ceramic layers having plural via-conductors extending between front surface and rear surface of the second laminate, wherein lands connecting a via-conductor exposed on the rear surface of the first laminate and a via-conductor exposed on the front surface of the second laminate are disposed between the first laminate and the second laminate, and the diameter d1 of the land is 2-5 times larger than the diameter d2 of a via-conductor connected to the land.

Abstract: A wiring substrate K for an electronic-component inspection apparatus includes a substrate body (1) composed of a plurality of stacked ceramic layers s1 to s8 and having a front surface (2) and a back surface (3); and front-surface terminal electrodes f formed on the front surface (2) of the substrate body (1). Unit inspection patterns a1, individual ones of which are constituted by a plurality of the front-surface terminal electrodes f disposed to correspond to a plurality of terminal electrodes m of a single electronic component cn to be inspected, are regularly disposed in vertical and horizontal directions as viewed from above such that the centroids g of the unit inspection patterns a1 coincide with alternate ones of intersections j between vertical imaginary lines L1 to L3 and horizontal imaginary lines N1 to N4 passing through the centroids g of the unit inspection patterns a1.

Abstract: An electronic component-inspection wiring board (1) including: a first laminate (C1) composed of plural first ceramic layers (s1-s3) and having plural pads (6) formed on a front surface (2) thereof for electrically connecting and transmitting inspection signals to an electronic component subject to inspection, wiring layers (7, 9) formed between the first ceramic layers (s1-s3), and plural via-conductors (v) connecting respective pads (6) to the wiring layers (7, 9) and/or which are exposed on a rear surface (3) of the first laminate (C1); and a second laminate (C2) composed of second plural ceramic layers (s4-s6) made of the same ceramic material as that of the first ceramic layers (s1-s3), having plural via-conductors (V) extending between front surface (4) and rear surface (5) of the second laminate (C2), and the rear surface (3) of the first laminate (C1) overlying the front surface (4) of the second laminate (C2), wherein lands (10) connecting a via-conductor (v) exposed on the rear surface (3) of the fi