Patents by Inventor Kazuya Sanada
Kazuya Sanada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 6802721Abstract: An electronic device includes a circuit board, a flexible printed wiring board, and an electric connector. The circuit board includes an electronic circuit. The flexible printed wiring board is electrically connected to the electronic circuit. The electric connector includes a plurality of leads and a connector body. Each lead has a substantially straight end and a bent end. A surface of the connector body is substantially parallel to a surface of the flexible printed wiring board. Each bent end of the leads is located on the surface of the connector body to be substantially parallel to the surface of the flexible printed wiring board. The connector is electrically connected to the flexible printed wiring board using the leads. With the structure of the connector, the circuit board and the electric connector is relatively readily connected by the flexible printed wiring board in the manufacturing process of the electronic device.Type: GrantFiled: January 27, 2003Date of Patent: October 12, 2004Assignee: Denso CorporationInventors: Kazuya Sanada, Toshiaki Yagura, Satoru Kawamoto, Akihiro Yanagisawa
-
Patent number: 6719187Abstract: The present invention provides a circuit board connecting method that includes an alkane application step and a heat-press-bonding step. The alkane application step is a preliminary step which applies an alkane group to a printed circuit board. The heat-press-bonding step heat-press-bonds a flexible circuit board to the printed circuit board by positioning their printed wire terminals and conductive thick-film terminals to face one another. In the heat-press-bonding step, the alkane group boils and cleans the surface of the printed wire terminals and conductive thick-film terminals, thereby removing the oxide film to expose the metallic portion of the terminals. The alkane group soaks into a thermoplastic film or base plate, causing it to swell and thereby bond the flexible circuit board to the printed circuit board tightly. Accordingly, both electrical and mechanical firm bonding is accomplished at a very low cost and short time.Type: GrantFiled: June 9, 2003Date of Patent: April 13, 2004Assignee: Denso CorporationInventors: Toshihiro Miyake, Koichi Shigematsu, Kazuya Sanada, Hideharu Ishihara, Yoshitaro Yazaki
-
Patent number: 6657137Abstract: In a connection structure for both first and second circuit boards, plural first terminals are arranged on the first circuit board in an arrangement direction, and plural second terminal are arranged on the second circuit board in the arrangement direction. The first and second circuit boards are disposed so that the first connection terminals and the second connection terminals are overlapped to each other, and the first connection terminals and the second connection terminals are connected by using an electrical conductive material. In the connection structure, an arrangement pitch of the first and second connection terminals is made smaller at an endmost portion or/and in vicinity of the endmost portion in the arrangement direction.Type: GrantFiled: July 16, 2001Date of Patent: December 2, 2003Assignee: Denso CorporationInventors: Toshihiro Miyake, Kazuya Sanada
-
Publication number: 20030205610Abstract: The present invention provides a circuit board connecting method that includes an alkane application step and a heat-press-bonding step. The alkane application step is a preliminary step which applies an alkane group to a printed circuit board. The heat-press-bonding step heat-press-bonds a flexible circuit board to the printed circuit board by positioning their printed wire terminals and conductive thick-film terminals to face one another. In the heat-press-bonding step, the alkane group boils and cleans the surface of the printed wire terminals and conductive thick-film terminals, thereby removing the oxide film to expose the metallic portion of the terminals. The alkane group soaks into a thermoplastic film or base plate, causing it to swell and thereby bond the flexible circuit board to the printed circuit board tightly. Accordingly, both electrical and mechanical firm bonding is accomplished at a very low cost and short time.Type: ApplicationFiled: June 9, 2003Publication date: November 6, 2003Inventors: Toshihiro Miyake, Koichi Shigematsu, Kazuya Sanada, Hideharu Ishihara, Yoshitaro Yazaki
-
Publication number: 20030143871Abstract: An electronic device includes a circuit board, a flexible printed wiring board, and an electric connector. The circuit board includes an electronic circuit. The flexible printed wiring board is electrically connected to the electronic circuit. The electric connector includes a plurality of leads and a connector body. Each lead has a substantially straight end and a bent end. A surface of the connector body is substantially parallel to a surface of the flexible printed wiring board. Each bent end of the leads is located on the surface of the connector body to be substantially parallel to the surface of the flexible printed wiring board. The connector is electrically connected to the flexible printed wiring board using the leads. With the structure of the connector, the circuit board and the electric connector is relatively readily connected by the flexible printed wiring board in the manufacturing process of the electronic device.Type: ApplicationFiled: January 27, 2003Publication date: July 31, 2003Inventors: Kazuya Sanada, Toshiaki Yagura, Satoru Kawamoto, Akihiro Yanagisawa
-
Patent number: 6598780Abstract: The present invention provides a circuit board connecting method that includes an alkane application step and a heat-press-bonding step. The alkane application step is a preliminary step which applies an alkane group to a printed circuit board. The heat-press-bonding step heat-press-bonds a flexible circuit board to the printed circuit board by positioning their printed wire terminals and conductive thick-film terminals to face one another.Type: GrantFiled: December 20, 2000Date of Patent: July 29, 2003Assignee: Denso CorporationInventors: Toshihiro Miyake, Koichi Shigematsu, Kazuya Sanada, Hideharu Ishihara, Yoshitaro Yazaki
-
Patent number: 6499217Abstract: An efficient method of manufacturing a three-dimensional printed wiring board is provided in which a conductor foil can be reliably heat-fused to the board at a relatively low temperature and the three-dimensional shape such as convex and concave of a mold can be reproduced precisely with no residual stress. The method comprises the steps of providing a filmy insulator comprising a thermoplastic resin composition containing 65-35 wt % of a polyaryl ketone resin having a crystal-melting peak temperature of 260° C. or over, and 35-65 wt % of an amorphous polyetherimide resin, and having a glass transition temperature as measured when the temperature is increased for differential scanning calorie measurement of 150-230° C.Type: GrantFiled: February 6, 2001Date of Patent: December 31, 2002Assignees: Mitsubishi Plastics Inc., Denso CorporationInventors: Shingetsu Yamada, Jun Takagi, Koichiro Taniguchi, Kaoru Nomoto, Toshihiro Miyake, Kazuya Sanada, Makoto Totani
-
Publication number: 20020186551Abstract: In an electronic control unit for controlling operation of various devices, a circuit board carrying electronic components thereon and a connector for connecting the control unit to outside devices are electrically connected through a flexible printed-circuit sheet. A casing of the control unit is designed to contain therein a circuit board selected from variously sized circuit boards. The circuit board may be functionally divided into a certain number of circuit boards. Some varieties of each functionally divided circuit board are prepared, and circuit boards meeting a particular requirement are selected from the varieties and used in a control unit. Thus, the electronic control units meeting various requirements are efficiently and economically manufactured.Type: ApplicationFiled: July 24, 2002Publication date: December 12, 2002Inventors: Toru Murowaki, Toshiaki Yagura, Fujio Sahara, Kazuya Sanada, Taku Iida, Minoru Hozuka
-
Patent number: 6466447Abstract: In an electronic control unit for controlling operation of various devices, a circuit board carrying electronic components thereon and a connector for connecting the control unit to outside devices are electrically connected through a flexible printed-circuit sheet. A casing of the control unit is designed to contain therein a circuit board selected from variously sized circuit boards. The circuit board may be functionally divided into a certain number of circuit boards. Some varieties of each functionally divided circuit board are prepared, and circuit boards meeting a particular requirement are selected from the varieties and used in a control unit. Thus, the electronic control units meeting various requirements are efficiently and economically manufactured.Type: GrantFiled: January 24, 2001Date of Patent: October 15, 2002Assignee: Denso CorporationInventors: Toru Murowaki, Toshiaki Yagura, Fujio Sahara, Kazuya Sanada, Taku Iida, Minoru Hozuka
-
Patent number: 6442027Abstract: The electronic control unit controls operation of actuators connected thereto based on sensor signals fed thereto and processed therein. The unit includes a control circuit substrate carrying control elements such as a microcomputer and a driving circuit substrate carrying driving elements such as power transistors. The driving circuit substrate handling power and the control circuit substrate handling only signals are separately positioned in a metal casing with a separating space therebetween to suppress heat transfer from the driving circuit substrate to the control circuit substrate. A connector electrically connecting the unit to outside sensors and actuators is positioned in the separating space to utilize the separating space also as a space for containing the connector.Type: GrantFiled: December 20, 2000Date of Patent: August 27, 2002Assignee: Denso CorporationInventors: Kazuya Sanada, Toshiaki Yagura
-
Patent number: 6418021Abstract: A plurality of ceramic circuit boards mounted with heat-generative driving transistors and other electronic parts are bonded to a heat radiating fin, and the heat radiating fin is connected to a motherboard. Heat generated by the driving transistors can efficiently be absorbed and dissipated by the heat radiating fin, and assembling work necessary for combining the components to the motherboard can be reduced. The electronic parts, wiring patterns and the like on the circuit boards can simultaneously be encapsulated in a resin or the like after bonding the circuit boards to the heat radiating fin, packaging work can be reduced.Type: GrantFiled: July 13, 2000Date of Patent: July 9, 2002Assignee: Denso CorporationInventors: Toru Itabashi, Toshiaki Yagura, Kazuya Sanada, Yukihide Niimi
-
Publication number: 20020022385Abstract: In a connection structure for both first and second circuit boards, plural first terminals are arranged on the first circuit board in an arrangement direction, and plural second terminal are arranged on the second circuit board in the arrangement direction. The first and second circuit boards are disposed so that the first connection terminals and the second connection terminals are overlapped to each other, and the first connection terminals and the second connection terminals are connected by using an electrical conductive material. In the connection structure, an arrangement pitch of the first and second connection terminals is made smaller at an endmost portion or/and in vicinity of the endmost portion in the arrangement direction.Type: ApplicationFiled: July 16, 2001Publication date: February 21, 2002Inventors: Toshihiro Miyake, Kazuya Sanada
-
Publication number: 20010017766Abstract: In an electronic control unit for controlling operation of various devices, a circuit board carrying electronic components thereon and a connector for connecting the control unit to outside devices are electrically connected through a flexible printed-circuit sheet. A casing of the control unit is designed to contain therein a circuit board selected from variously sized circuit boards. The circuit board may be functionally divided into a certain number of circuit boards. Some varieties of each functionally divided circuit board are prepared, and circuit boards meeting a particular requirement are selected from the varieties and used in a control unit. Thus, the electronic control units meeting various requirements are efficiently and economically manufactured.Type: ApplicationFiled: January 24, 2001Publication date: August 30, 2001Inventors: Toru Murowaki, Toshiaki Yagura, Fujio Sahara, Kazuya Sanada, Taku Iida, Minoru Hozuka
-
Publication number: 20010015887Abstract: The electronic control unit controls operation of actuators connected thereto based on sensor signals fed thereto and processed therein. The unit includes a control circuit substrate carrying control elements such as a microcomputer and a driving circuit substrate carrying driving elements such as power transistors. The driving circuit substrate handling power and the control circuit substrate handling only signals are separately positioned in a metal casing with a separating space therebetween to suppress heat transfer from the driving circuit substrate to the control circuit substrate. A connector electrically connecting the unit to outside sensors and actuators is positioned in the separating space to utilize the separating space also as a space for containing the connector.Type: ApplicationFiled: December 20, 2000Publication date: August 23, 2001Inventors: Kazuya Sanada, Toshiaki Yagura
-
Publication number: 20010013535Abstract: The present invention provides a circuit board connecting method that includes an alkane application step and a heat-press-bonding step. The alkane application step is a preliminary step which applies an alkane group to a printed circuit board. The heat-press-bonding step heat-press-bonds a flexible circuit board to the printed circuit board by positioning their printed wire terminals and conductive thick-film terminals to face one another. In the heat-press-bonding step, the alkane group boils and cleans the surface of the printed wire terminals and conductive thick-film terminals, thereby removing the oxide film to expose the metallic portion of the terminals. The alkane group soaks into a thermoplastic film or base plate, causing it to swell and thereby bond the flexible circuit board to the printed circuit board tightly. Accordingly, both electrical and mechanical firm bonding is accomplished at a very low cost and short time.Type: ApplicationFiled: December 20, 2000Publication date: August 16, 2001Inventors: Toshihiro Miyake, Koichi Shigematsu, Kazuya Sanada, Hideharu Ishihara, Yoshitaro Yazaki
-
Patent number: 6185101Abstract: A plurality of ceramic circuit boards mounted with heat-generative driving transistors and other electronic parts are bonded to a heat radiating fin, and the heat radiating fin is connected to a motherboard. Heat generated by the driving transistors can efficiently be absorbed and dissipated by the heat radiating fin, and assembling work necessary for combining the components to the motherboard can be reduced. The electronic parts, wiring patterns and the like on the circuit boards can simultaneously be encapsulated in a resin or the like after bonding the circuit boards to the heat radiating fin, packaging work can be reduced.Type: GrantFiled: October 15, 1998Date of Patent: February 6, 2001Assignee: Denso CorporationInventors: Toru Itabashi, Toshiaki Yagura, Kazuya Sanada, Yukihide Niimi