Abstract: An electric circuit device connecting first and second external elements, the electric circuit device including: a first electronic component; a first bus bar electrically connected to the first electronic component; a second bus bar electrically connected to the electronic component and overlapped with the first bus bar in a direction perpendicular to main surfaces of the first and second bus bars; a first external terminal electrically connecting the first bus bar to the first external element; a second external terminal electrically connecting the second bus bar to the second external element; a first region in the first external terminal electrically coupled to the first external element; and a second region in the second external terminal electrically coupled to the second external element, and at least partially overlapped with the first region in the direction.

Abstract: A shaft-integrated gear includes a rotational shaft formed of a resin material; and a cylindrical gear that is formed of a metal material, wherein the cylindrical gear fits around a gear support part of the rotational shaft.

Abstract: To provide a highly transparent thermoplastic resin composition without requiring, for example, a special molecular design or incorporation of an additive, with the refractive index of the composition being readily controllable. The highly transparent and refractive-index-controllable thermoplastic resin composition can be produced by blending a thermoplastic resin (A) containing a structural unit derived from a (meth)acrylic acid ester monomer represented by a specific chemical formula and a structural unit derived from an aromatic vinyl monomer represented by a specific chemical formula, with a thermoplastic resin (B) obtained by hydrogenating aromatic double bonds of a thermoplastic resin which contains a structural unit derived from a (meth)acrylic acid ester monomer represented by a specific chemical formula and a structural unit derived from an aromatic vinyl monomer represented by a specific chemical formula.

Abstract: A manufacturing method of a carrier for a double-side polishing apparatus by performing a lapping process on the carrier for a double-side polishing apparatus, being gear shaped and having a holding hole to hold a semiconductor wafer; including: providing an outer carrier, being larger than the carrier for a double-side polishing apparatus in size, having a hole to hold the carrier for a double-side polishing apparatus, and being configured to arrange the center of the hole to be eccentric to the center of the outer carrier; holding the carrier for a double-side polishing apparatus by the outer carrier, with the carrier for a double-side polishing apparatus being put in the hole; and performing a lapping process on the carrier for a double-side polishing apparatus with the center of the hole being eccentric to the center of the outer carrier.

Abstract: A molded article comprising a fuel-barrier layer formed of a resin composition comprising a polyamide resin (A) as a continuous phase and a resin (B) as a disperse phase, wherein (A) is a polyamide resin (A1) comprising at least one of a constituent unit derived from a lactam having 10 to 12 carbon atoms and a constituent unit derived from an aminocarboxylic acid having 10 to 12 carbon atoms, or a polyamide resin (A2) comprising a constituent unit derived from an aliphatic diamine having 6 to 12 carbon atoms and a constituent unit derived from an aliphatic dicarboxylic acid having 10 to 12 carbon atoms, the (B) is a resin selected from a semi-aromatic polyamide resin, the ratio by volume of (A)/(B) is 95/5 to 51/49, and the mean disperse particle diameter of (B) is 150 nm or more.

Abstract: A pressure inside a chamber in which a bearing is arranged is reduced. Thus, a pressure inside an oil tank and the pressure inside the chamber are made lower than atmospheric pressure, and are placed in a minimal or no pressure difference condition. Next, a lubricating oil is supplied from the oil tank into the chamber through power of a liquid transfer pump. The lubricating oil is thus injected into the bearing inside the chamber. Thus, the lubricating oil can be supplied from the oil tank into the chamber while maintaining the pressure at substantially the same level lower than that of the atmospheric pressure. Accordingly, gas can be prevented from dissolving into the lubricating oil which has once been deaerated by a pressure reduction inside the oil tank. In addition, because a driving force of the liquid transfer pump is used for supply of the lubricating oil, it is easy to control the amount of the lubricating oil to be supplied.

Abstract: The present invention provides a method for producing a silicon wafer including a step of, after growing the oxide film on one surface of a raw material silicon wafer by chemical-vapor deposition, performing double-side polishing of the raw material silicon wafer in such a manner that a suede polishing pad or a velour polishing pad with an asker-C rubber hardness of 50° or more but less than 90° is used for the oxide-film surface.

Abstract: A lighting control system includes a plurality of light sources, a plurality of light source drivers, each of the light source drivers being configured to adjust a light emission intensity of an associated one of the light sources in at least two levels, and an integrated controller configured to control the light source drivers to control conditions of the light sources in an integrated manner. The integrated controller is configured to control the light source drivers to execute a light intensity transition of reducing the light emission intensity from a first light intensity level to a second light intensity level that is lower than the first light intensity level with respect to each of the light sources such that a timing at which the light intensity transition ends is substantially the same for each of the light sources.

Abstract: A lighting control system includes a plurality of light sources, a plurality of light source drivers, each of the light source drivers being configured to adjust a light emission intensity of an associated one of the light sources in at least two levels, and an integrated controller configured to control the light source drivers to control conditions of the light sources in an integrated manner The integrated controller is configured to control the light source drivers to execute a light intensity transition of reducing the light emission intensity from a first light intensity level to a second light intensity level that is lower than the first light intensity level with respect to each of the light sources such that a timing at which the light intensity transition ends is substantially the same for each of the light sources.

Abstract: A multilayer structure including a polyolefin layer (A) and a polyamide resin composition layer (B), wherein the polyamide resin composition constituting the layer (B) contains a polyamide resin (b-1) in which a diamine constituent unit thereof contains a constituent unit derived from a xylylenediamine and a dicarboxylic acid constituent unit thereof contains a constituent unit derived from an ?,?-linear aliphatic dicarboxylic acid having from 4 to 20 carbon atoms and a modified polyolefin (b-2), and the content of the modified polyolefin (b-2) is from 5 to 30 parts by mass relative to 100 parts by mass of the polyamide resin (b-1).

Abstract: The multilayer structure includes a polyamide resin layers (A) and (B), wherein the layer (A) is composed of a polyamide resin (A1) containing at least any constituent unit of a constituent unit derived from a lactam having from 10 to 12 carbon atoms and a constituent unit derived from an aminocarboxylic acid having from 10 to 12 carbon atoms, or a composition (a) containing the resin (A1), the layer (B) is composed of a composition (b) containing a polyamide resin (B1) in which a diamine unit thereof includes a constituent unit derived from a metaxylylenediamine in an amount of 70 mol % or more and a dicarboxylic acid unit thereof includes a constituent unit derived from an aliphatic dicarboxylic acid having from 4 to 8 carbon atoms in an amount of 70 mol % or more, and a polyamide resin (B2) in which a diamine unit thereof includes a constituent unit derived from a xylylenediamine in an amount of 70 mol % or more and a dicarboxylic acid unit thereof includes a constituent unit derived from an aliphatic dica

Abstract: The present invention provides a method for evaluating a polishing pad by which a life of a polishing pad to polish a wafer is evaluated, the method being characterized in that a quantity of polishing residues deposited on the polishing pad is measured, and the life of the polishing pad is evaluated based on a measurement value provided by the measurement. Consequently, it is possible to provide the method for evaluating a polishing pad and the method for polishing a wafer that enable immediately evaluating the life of the polishing pad and also enable suppressing a reduction in productivity and a yield ratio at the time of polishing the wafer.

Abstract: A carrier for a double-side polishing apparatus comprising at least: a metallic carrier base that is arranged between upper and lower turn tables having polishing pads attached thereto and has a holding hole formed therein to hold a wafer sandwiched between the upper and lower turn tables at the time of polishing; and a ring-like resin insert that is arranged along an inner peripheral portion of the holding hole of the carrier base and is in contact with a peripheral portion of the held wafer, wherein an inner peripheral end portion of the holding hole of the carrier base has an upwardly opening tapered surface, an outer peripheral portion of the ring-like insert has a reverse tapered surface with respect to the tapered surface of the holding hole of the carrier base, and the resin insert is fitted in the holding hole of the carrier base through the tapered surface.

Abstract: Provided are [1] a packaging body consisting of a resin composition containing a polyester resin (A), a polyamide resin (B), and an oxidation reaction accelerator (C), wherein when a thickness of the packaging body is defined as d (?m), and an average long diameter, an average short diameter, and a volume fraction of dispersed particles of the polyamide resin (B) in the packaging body are defined as L (?m), W (?m), and Vf, respectively, the following expression (1A) is satisfied; an oxygen transmission rate after a lapse of 100 hours after preparing of the packaging body is 0.01 [cc/(package·day·0.21 atm)] or less; and a haze value is 8% or less, and [2] a method for preserving goods by filling in a packaging body containing a polyester resin (A), a polyamide resin (B), and an oxidation reaction accelerator (C), wherein a content of the polyamide resin (B) in the packaging body is 2.0 to 3.

Abstract: Provided are a multilayer structure including a polyamide layer (A) and a polyether polyamide layer (B) and also a multilayer structure including a polyolefin layer (C) and a polyether polyamide layer (B), wherein the polyamide layer (A) contains a polyamide (a) in which a diamine constituent unit thereof includes a constituent unit derived from a xylylenediamine (a-1), and a dicarboxylic acid constituent unit thereof includes a constituent unit derived from an ?,?-linear aliphatic dicarboxylic acid (a-2) having from 4 to 20 carbon atoms; and the polyether polyamide layer (B) contains a polyether polyamide (b) in which a diamine constituent unit thereof includes constituent units derived from a polyether diamine compound (b-1) having a specified structure and a xylylenediamine (b-2), and a dicarboxylic acid constituent unit thereof includes a constituent unit derived from an ?,?-linear aliphatic dicarboxylic acid (b-3) having from 4 to 20 carbon atoms.

Abstract: The present invention provides method of double-side polishing a wafer, including: simultaneously polishing both surfaces of the wafer by holding the wafer in a holding hole of a carrier, interposing the held wafer between upper and lower turn tables to which polishing pads are attached, rotating the carrier about an axis of the carrier and revolving the carrier; and repeating the polishing in a batch manner, wherein a direction in which the carrier is revolved is reversed every polishing batch while repeating the polishing in a batch manner. The method enables wafers with high flatness to be stably obtained while inhibiting reduction in productivity due to dressing.

Abstract: The present invention provides a metal coating material containing a polyether polyamide (A) in which a diamine constituent unit thereof includes constituent units derived from a polyether diamine compound (a-1) having a specified structure and a xylylenediamine (a-2), and a dicarboxylic acid constituent unit thereof includes a constituent unit derived from an ?,?-linear aliphatic dicarboxylic acid (a-3) having from 4 to 20 carbon atoms, the metal coating material having favorable abrasion resistance and oil resistance and excellent adhesive properties to metals.

Abstract: The present invention provides an inner liner for pneumatic tire, the inner liner being prepared by molding a resin composition containing a polyether polyamide (A) in which a diamine constituent unit thereof includes constituent units derived from a polyether diamine compound (a-1) represented by the general formula (1) and a xylylenediamine (a-2), and a dicarboxylic acid constituent unit thereof includes a constituent unit derived from an ?,?-linear aliphatic dicarboxylic acid (a-3) having from 4 to 20 carbon atoms.

Abstract: The present invention provides a polyamide resin composition containing a polyamide resin (A) in which a diamine constituent unit thereof includes a constituent unit derived from a xylylenediamine (a-1), and a dicarboxylic acid constituent unit thereof includes a constituent unit derived from an ?,?-linear aliphatic dicarboxylic acid (a-2) having from 4 to 20 carbon atoms; and a polyether polyamide (B) in which a diamine constituent unit thereof includes constituent units derived from a polyether diamine compound (b-1) represented by a specified structural formula and a xylylenediamine (b-2), and a dicarboxylic acid constituent unit thereof includes a constituent unit derived from an ?,?-linear aliphatic dicarboxylic acid (b-3) having from 4 to 20 carbon atoms.

Abstract: A method of producing a carrier for use in a double-side polishing apparatus, the method including engaging an insert with a holding hole formed in a carrier body and sticking the insert to the holding hole, the carrier body being configured to be disposed between upper and lower turn tables to which polishing pads are attached of the double-side polishing apparatus, the holding hole being configured to hold a wafer during polishing, the insert being configured to contact an edge of the wafer to be held, the method including: performing a lapping process and a polishing process on the insert; engaging the insert subjected to the lapping process and the polishing process with the holding hole of the carrier body; and sticking and drying the engaged insert while applying a load to the insert in a direction perpendicular to main surfaces of the carrier body.