Patents by Inventor Kazuya Sayanagi

Kazuya Sayanagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7095292
    Abstract: On one surface of a dielectric substrate having a thickness of one quarter of a signal wavelength, a ground electrode, and a strip line, one end thereof being connected to a high-frequency element via a wire, are formed. On the opposite surface thereof, which opposes a waveguide, a ground electrode is formed, a first electrode opening having a predetermined length and width is formed, opposite to a proximity of an open end of the strip line, and a second electrode opening is formed so that a center line of a width thereof is separated outward by one quarter of the signal wavelength from a conductor wall of the waveguide. Furthermore, via holes having a length of one quarter of the signal wavelength, electrically connecting the ground electrodes on either surface, are formed. The waveguide is disposed in proximity to the dielectric substrate so that a center of the first electrode opening coincides with that of the waveguide.
    Type: Grant
    Filed: September 3, 2002
    Date of Patent: August 22, 2006
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kazuya Sayanagi, Ikuo Takakuwa
  • Patent number: 6847275
    Abstract: A ground electrode and a terminal electrode are formed on a first main surface of dielectric substrate forming a circuit board. Wiring electrodes are formed on a second main surface of the dielectric substrate. A semiconductor device and a filter are mounted on the wiring electrodes. A strip line electrode of the filter is connected to the ground electrode of the circuit board for conducting direct current, via a through-hole provided in the filter, a ground electrode of the filter, the wiring electrode, and a through-hole provided in the circuit board. With this arrangement, the terminal electrode is connected to a high-frequency signal terminal of the semiconductor device via the filter.
    Type: Grant
    Filed: October 10, 2001
    Date of Patent: January 25, 2005
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Kazuya Sayanagi, Akihiro Sasabata, Yutaka Sasaki
  • Publication number: 20030042993
    Abstract: On one surface of a dielectric substrate having a thickness of one quarter of a signal wavelength, a ground electrode, and a strip line, one end thereof being connected to a high-frequency element via a wire, are formed. On the opposite surface thereof, which opposes a waveguide, a ground electrode is formed, a first electrode opening having a predetermined length and width is formed, opposite to a proximity of an open end of the strip line, and a second electrode opening is formed so that a center line of a width thereof is separated outward by one quarter of the signal wavelength from a conductor wall of the wave guide. Furthermore, via holes having a length of one quarter of the signal wavelength, electrically connecting the ground electrodes on either surface, are formed. The waveguide is disposed in proximity to the dielectric substrate so that a center of the first electrode opening coincides with that of the waveguide.
    Type: Application
    Filed: September 3, 2002
    Publication date: March 6, 2003
    Inventors: Kazuya Sayanagi, Ikuo Takakuwa
  • Publication number: 20020072147
    Abstract: A ground electrode and a terminal electrode are formed on a first main surface of dielectric substrate forming a circuit board. Wiring electrodes are formed on a second main surface of the dielectric substrate. A semiconductor device and a filter are mounted on the wiring electrodes. A strip line electrode of the filter is connected to the ground electrode of the circuit board for conducting direct current, via a through-hole provided in the filter, a ground electrode of the filter, the wiring electrode, and a through-hole provided in the circuit board. With this arrangement, the terminal electrode is connected to a high-frequency signal terminal of the semiconductor device via the filter.
    Type: Application
    Filed: October 10, 2001
    Publication date: June 13, 2002
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Kazuya Sayanagi, Akihiro Sasabata, Yutaka Sasaki
  • Patent number: 5701128
    Abstract: An antenna-integrated strip line cable with which it is possible to improve the performance of a high-frequency appliance such as a portable telephone without making the appliance larger. An antenna-integrated strip line cable 1 is made up of a transmission line part 2, an antenna part 3 and a counterpoise 4. The transmission line part 2 is made up of two conductors 21, 22 disposed in parallel, insulators 23, 24 having plasticity or flexibility disposed between these two conductors 21, 22, and a central conductor 25 disposed between the insulators 23, 24 centrally in the width direction thereof. Wide-pattern impedance matching circuits 26a, 26b are provided in the central conductor 25. The antenna part 3 has portions of the insulator 24 and the central conductor 25 extending from the transmission line part 2. The counterpoise 4 has portions of the insulator 23 and the conductor 21 extending from the transmission line part 2.
    Type: Grant
    Filed: March 1, 1996
    Date of Patent: December 23, 1997
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takekazu Okada, Yuichi Maruyama, Kazuya Sayanagi
  • Patent number: 5525953
    Abstract: In a multi-plate high frequency parallel strip-line cable including a strip-shaped dielectric body made of either an electrical insulating material having a flexibility or another electrical insulating material having a plasticity, the dielectric body is composed of a pair of dielectric layers. A pair of thin-film-shaped earth conductors is formed on both surfaces of the dielectric body so as to oppose to each other, and a thin-film-shaped center conductor is formed between the pair of dielectric layers in the dielectric body so as to be located between a pair of earth conductors. Further, a circuit device part such as an impedance adjusting circuit, a filter, an attenuator or the like is formed between a pair of dielectric layers in the dielectric body so as to be electrically connected with the center conductor, thereby the parallel strip-line cable having either a flexibility or a plasticity.
    Type: Grant
    Filed: May 15, 1995
    Date of Patent: June 11, 1996
    Assignees: Murata Manufacturing Co., Ltd., Matsushita Electric Industrial Co., Ltd.
    Inventors: Takekazu Okada, Kazuya Sayanagi, Kiyoshi Nakanishi
  • Patent number: 5469130
    Abstract: In a high frequency parallel strip line cable including a pair of thin-film-shaped earth conductors formed on both surfaces of a dielectric body so as to oppose to each other, a thin-film-shaped center conductor is formed in the dielectric body so as to be located between the pair of earth conductors, and the connector part is formed in one end of the high frequency parallel strip line cable so as to expose one end of the center conductor. Further, a connector is provided for connecting with the connector part of the high frequency parallel strip line cable. In the connector, a connection concave for inserting the connector part is formed in a dielectric case.
    Type: Grant
    Filed: November 29, 1993
    Date of Patent: November 21, 1995
    Assignee: Murata Mfg. Co., Ltd.
    Inventors: Takekazu Okada, Yuichi Maruyama, Kazuya Sayanagi