Abstract: To provide a hydrogen barrier agent capable of imparting hydrogen barrier performance to various materials; a hydrogen barrier film forming composition including the hydrogen barrier agent; a hydrogen barrier film including the hydrogen barrier agent; a method for producing a hydrogen barrier film, which uses the hydrogen barrier film forming composition; and an electronic element provided with the hydrogen barrier film. A compound having a specific structure including an imidazolyl group is used as the hydrogen barrier agent. Furthermore, the hydrogen barrier film forming composition is prepared by blending the above-mentioned hydrogen barrier agent into the base material component. In addition, the hydrogen barrier film is formed using the hydrogen barrier film forming composition.

Abstract: A resin composition including a silicon-containing resin component and a solvent, the silicon-containing resin component including at least one of (I) and (II) mentioned below, the solvent including at least one of a terpene compound having at least one of a hydroxy group and an acetoxy group, and a cyclic skeleton-containing acetate compound (excluding the terpene compound): (I) a polysilane-polysiloxane resin having a polysilane structure and a polysiloxane structure, and (II) a mixture of a resin having a polysilane structure and a resin having a polysiloxane structure.

Abstract: A method of pattern formation. The method is capable of inhibiting a post-development residue from remaining on a support equipped with an electrode, and a method of producing a polysilane-polysiloxane resin precursor that is suitable for use in the method of pattern formation. The method of pattern formation includes forming a film of a silicon-containing composition on the support equipped with an electrode forming a film of a resin composition on the film of a silicon-containing composition, and forming the film of a resin composition into a pattern.

Abstract: To provide a hydrogen barrier agent capable of imparting hydrogen barrier performance to various materials; a hydrogen barrier film forming composition including the hydrogen barrier agent; a hydrogen barrier film including the hydrogen barrier agent; a method for producing a hydrogen barrier film, which uses the hydrogen barrier film forming composition; and an electronic element provided with the hydrogen barrier film. A compound having a specific structure including an imidazolyl group is used as the hydrogen barrier agent. Furthermore, the hydrogen barrier film forming composition is prepared by blending the above-mentioned hydrogen barrier agent into the base material component. In addition, the hydrogen barrier film is formed using the hydrogen barrier film forming composition.

Abstract: To provide a hydrogen barrier agent capable of imparting hydrogen barrier performance to various materials; a hydrogen barrier film forming composition including the hydrogen barrier agent; a hydrogen barrier film including the hydrogen barrier agent; a method for producing a hydrogen barrier film, which uses the hydrogen barrier film forming composition; and an electronic element provided with the hydrogen barrier film. A compound having a specific structure including an imidazolyl group is used as the hydrogen barrier agent. Furthermore, the hydrogen barrier film forming composition is prepared by blending the above-mentioned hydrogen barrier agent into the base material component. In addition, the hydrogen barrier film is formed using the hydrogen barrier film forming composition.

Abstract: The present invention provides an energy-sensitive resin composition, a method of manufacturing a polyimide film or a polyimide molded product in which said composition is used, and a method of forming a pattern in which said composition is used. The composition supplies a polyimide resin exhibiting exceptional thermal resistance and low permittivity even by a heat treatment at a low temperature. The composition contains polyamic acid obtained by reacting tetracarboxylic dianhydride and diamine, a solvent, and a compound (A) decomposing by the action of light and/or heat and generating a base and/or an acid. The method of manufacturing a polyimide film or a polyimide molded product includes forming a coating film or molded product comprising the composition and decomposing the compound (A) in the film or product through exposure or heating. The method of forming a pattern sequentially includes forming, selectively exposing, developing and heating the film or product.

Abstract: A polyimide resin produced by heating a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in N,N,N?,N?-tetramethylurea.

Abstract: The present invention provides an energy-sensitive resin composition, a method of manufacturing a polyimide film or a polyimide molded product in which said composition is used, and a method of forming a pattern in which said composition is used. The composition supplies a polyimide resin exhibiting exceptional thermal resistance and low permittivity even by a heat treatment at a low temperature. The composition contains polyamic acid obtained by reacting tetracarboxylic dianhydride and diamine, a solvent, and a compound (A) decomposing by the action of light and/or heat and generating a base and/or an acid. The method of manufacturing a polyimide film or a polyimide molded product includes forming a coating film or molded product comprising the composition and decomposing the compound (A) in the film or product through exposure or heating. The method of forming a pattern sequentially includes forming, selectively exposing, developing and heating the film or product.

Abstract: A polyimide resin produced by heating a polyamic acid resulting from the reaction of a tetracarboxylic acid dianhydride component and a diamine component in N,N,N?,N?-tetramethylurea.