Abstract: In a pressure sensor, a cap-shaped shielding member (17) to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip (16) is supported by an end surface of a disk conductive plate (19) between one end surface of the sensor chip (16) in a liquid sealing chamber (13) and a diaphragm (32). The conductive plate (19) is electrically connected via a group of input-output terminals (40ai) and bonding wires (Wi), for example, and the sensor chip (16) is supported by one end portion of a chip mounting member (18) which is electrically connected via the group of input and output terminals (40ai) and the bonding wires (Wi).

Abstract: In a pressure sensor including a substrate supported by input-output terminals, the substrate is provided with a circular hole located substantially at its central part, and an arc-shaped communication hole formed adjacent to three through-holes to which three of lead pins are inserted and fixed, respectively.

Abstract: In a pressure sensor, a cap-shaped shielding member (17) to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip (16) is supported by an end surface of a disk conductive plate (19) between one end surface of the sensor chip (16) in a liquid sealing chamber (13) and a diaphragm (32). The conductive plate (19) is electrically connected via a group of input-output terminals (40ai) and bonding wires (Wi), for example, and the sensor chip (16) is supported by one end portion of a chip mounting member (18) which is electrically connected via the group of input and output terminals (40ai) and the bonding wires (Wi).

Abstract: The present invention aims to provide a pressure sensor capable of improving waterproofness and airtightness by using a sealing adhesive without the use of an atmosphere-side O-ring or packing and improving workability by filling the sealing adhesive in one direction. In the pressure sensor, a protective cover is formed by any combination of a joint, a lower cover, a pressure detection unit, and a case portion. The protective cover includes a side wall forming an outer periphery and a bottom on the pressure chamber side of the side wall. An opening on a side of the protective cover opposite to the bottom is filled with the sealing adhesive to maintain waterproofness and airtightness of a signal transmission unit.

Abstract: In a pressure sensor, an electric field acting on one end surface of a sensor chip (16) is blocked by a shielding member (17), and an electric field acting on another end surface of the sensor chip (16) is removed through one end portion of a chip mounting member (18), a group of input and output terminals (40ai), and a bonding wire (Wi).

Abstract: In a pressure sensor, a cap-shaped shielding member (17) to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip (16) is supported by an end surface of a disk conductive plate (19) between one end surface of the sensor chip (16) in a liquid sealing chamber (13) and a diaphragm (32). The conductive plate (19) is electrically connected via a group of input-output terminals (40ai) and bonding wires (Wi), for example, and the sensor chip 16 is supported by one end portion of a chip mounting member (18) which is electrically connected via the group of input and output terminals (40ai) and the bonding wires (Wi).

Abstract: In a pressure sensor including a substrate supported by input-output terminals, the substrate is provided with a circular hole located substantially at its central part, and an arc-shaped communication hole formed adjacent to three through-holes to which three of lead pins are inserted and fixed, respectively.

Abstract: A pressure sensor includes a diaphragm made of metal and configured to separate a pressure chamber from a liquid seal chamber, a housing made of metal and disposed around the liquid seal chamber, a pressure detection element disposed in the liquid seal chamber in a liquid . . . sealable manner to detect the pressure of the fluid, and a potential adjustment member disposed between the pressure detection element and each of the diaphragm and the housing and being conductive, the potential adjustment member being connected to a zero potential terminal of the pressure detection element, wherein a distance between the potential adjustment member and each of the diaphragm and the housing is larger than a predetermined insulating distance.

Abstract: In a pressure sensor including a substrate supported by input-output terminals, the substrate is provided with a circular hole located substantially at its central part, and an arc-shaped communication hole formed adjacent to three through-holes to which three of lead pins are inserted and fixed, respectively.

Abstract: In a sensor chip junction structure, if a moving distance of a tip of a press jig (56) is any of 50 ?m and 30 ?m, for example, a characteristic line of a load (shearing force) (N) applied to an adhesive layer (50) formed on a sensor chip that is integral with a glass pedestal, the glass pedestal having a thickness set in a range from 0.3 mm to 2.5 mm is either located on any of a characteristic line Lt1 (y=1.3889x3) and a characteristic line Lt2 (y=0.463x3) or located in a region above zero and equal to or below any of the characteristic line Lt1 and the characteristic line Lt2.

Abstract: In a pressure sensor, an electric field acting on one end surface of a sensor chip (16) is blocked by a shielding member (17), and an electric field acting on another end surface of the sensor chip (16) is removed through one end portion of a chip mounting member (18), a group of input and output terminals (40ai), and a bonding wire (Wi).

Abstract: In a pressure sensor, a cap-shaped shielding member (17) to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip (16) is supported by an end surface of a disk conductive plate (19) between one end surface of the sensor chip (16) in a liquid sealing chamber (13) and a diaphragm (32). The conductive plate (19) is electrically connected via a group of input-output terminals (40ai) and bonding wires (Wi), for example, and the sensor chip 16 is supported by one end portion of a chip mounting member (18) which is electrically connected via the group of input and output terminals (40ai) and the bonding wires (Wi).

Abstract: In a sensor chip junction structure, if a moving distance of a tip of a press jig is any of 50 ?m and 30 ?m, for example, a characteristic line of a load (shearing force) (N) applied to an adhesive layer formed on a glass pedestal and having a thickness set in a range from 0.3 mm to 2.5 mm is either located on any of a characteristic line Lt1 (y=1.3889x3) and a characteristic line Lt2 (y=0.463x3) or located in a region above zero and equal to or below any of the characteristic line Lt1 and the characteristic line Lt2.

Abstract: The present invention aims to provide a pressure sensor capable of improving waterproofness and airtightness by using a sealing adhesive without the use of an atmosphere-side O-ring or packing and improving workability by filling the sealing adhesive in one direction. In the pressure sensor, a protective cover is formed by any combination of a joint, a lower cover, a pressure detection unit, and a case portion. The protective cover includes a side wall forming an outer periphery and a bottom on the pressure chamber side of the side wall. An opening on a side of the protective cover opposite to the bottom is filled with the sealing adhesive to maintain waterproofness and airtightness of a signal transmission unit.

Abstract: A pressure sensor includes a diaphragm made of metal and configured to separate a pressure chamber from a liquid seal chamber, a housing made of metal and disposed around the liquid seal chamber, a pressure detection element disposed in the liquid seal chamber in a liquid sealable manner to detect the pressure of the fluid, and a potential adjustment member disposed between the pressure detection element and each of the diaphragm and the housing and being conductive, the potential adjustment member being connected to a zero potential terminal of the pressure detection element, wherein a distance between the potential adjustment member and each of the diaphragm and the housing is larger than a predetermined insulating distance.

Abstract: In a sensor unit, a lower end surface of a terminal block (24) is attached to an upper end surface (12ES1) of a housing (12) by using a silicone-based adhesive in such a way as to cover an upper end surface (14ES1) of a hermetic glass (14). A covering layer (10A) made of a silicone-based adhesive is formed in a given thickness on the entire upper end surface (14ES1) of the hermetic glass (14), from which a group of input-output terminals (40ai) protrude.

Abstract: In a pressure sensor including a substrate supported by input-output terminals, the substrate is provided with a circular hole located substantially at its central part, and an arc-shaped communication hole formed adjacent to three through-holes to which three of lead pins are inserted and fixed, respectively.