Abstract: A gas-producing apparatus that produces hydrogen or oxygen, includes: an electrolysis cell that produces hydrogen and oxygen through electrolysis of water; and a gas-liquid separation device that is connected to the electrolysis cell and that receives the water and the hydrogen or the oxygen, wherein the gas-liquid separation device includes a first chamber and a second chamber, the first chamber and the second chamber are separated by a partition wall, and a lower part of the first chamber and a lower part of the second chamber communicate with one another.

Abstract: A gas-producing apparatus that produces hydrogen or oxygen, includes: an electrolysis cell that produces hydrogen and oxygen through electrolysis of water; and a gas-liquid separation device that is connected to the electrolysis cell and that receives the water and the hydrogen or the oxygen, wherein the gas-liquid separation device includes a first chamber and a second chamber, the first chamber and the second chamber are separated by a partition wall, and a lower part of the first chamber and a lower part of the second chamber communicate with one another.

Abstract: An implementing structure intermediate body including: a first chip having a first connection terminal; a second chip having a second connection terminal in a face that faces the first chip; and a film wiring substrate having a third connection terminal in one face, which is arranged between the first chip and the second chip, is loaded on a chip loading substrate having a fifth connection terminal so that another one face of the first chip is confronted thereby. In the film wiring substrate, there is a portion that is located outside any of the first chip and the second chip, at the tip part, is provided a fourth connection terminal connected to the third connection terminal by wiring, one part of the first connection terminal is connected with the second connection terminal, the third connection terminal is connected with another one part of the first connection terminal, and the fifth connection terminal is connected to the fourth connection terminal.

Abstract: An implementing structure intermediate body including: a first chip having a first connection terminal; a second chip having a second connection terminal in a face that faces the first chip; and a film wiring substrate having a third connection terminal in one face, which is arranged between the first chip and the second chip, is loaded on a chip loading substrate having a fifth connection terminal so that another one face of the first chip is confronted thereby. In the film wiring substrate, there is a portion that is located outside any of the first chip and the second chip, at the tip part, is provided a fourth connection terminal connected to the third connection terminal by wiring, one part of the first connection terminal is connected with the second connection terminal, the third connection terminal is connected with another one part of the first connection terminal, and the fifth connection terminal is connected to the fourth connection terminal.

Abstract: An ultrasonic transmission medium is received in a medium container, and an opening of the container is sealed by a polymer membrane. An inspection object is received in an inspection object receiving container body that is separate from the medium container and whose opening is formed opposite the polymer membrane of the medium container. The opening of the inspection object receiving container body is covered by the polymer membrane of the medium container, and a measurement environment space formed by a frame body, the polymer membrane, and the inspection object is reduced in pressure to cause the polymer membrane to be in intimate contact with the inspection object. Then, flaw detection is performed by emitting and applying an ultrasonic wave from an ultrasonic probe to the inspection object via the ultrasonic transmission medium and the polymer membrane.

Abstract: An ultrasonic transmission medium is received in a medium container, and an opening of the container is sealed by a polymer membrane. An inspection object is received in an inspection object receiving container body that is a separate body from the medium container and whose opening is formed opposite the polymer membrane of the medium container. The opening of the inspection object receiving container body is covered by the polymer membrane of the medium container, and a measurement environment space formed by a frame body, the polymer membrane, and the inspection object is reduced in pressure to cause the polymer membrane to be in intimate contact with the inspection object. Then, flaw detection is performed by emitting and applying an ultrasonic wave from an ultrasonic probe to the inspection object via the ultrasonic transmission medium and the polymer membrane.

Abstract: A conductive bump formed on an electrode of an electronic component. The conductive bump is composed of a first bump having one or more layers formed on the electrode and including resin containing at least a spherical-shaped conductive filler, and a second bump formed on an upper surface of the first bump and including photosensitive resin containing a scale-shaped conductive filler.

Abstract: An electronic component forming apparatus for forming an electronic component by radiating light to a photosensitive conductive resin provided on a forming work material, comprising radiation device for radiating light to the forming work material, detection device for detecting reflecting light reflected from the forming work material, and control device for controlling the radiating light responsive to an amount of the light detected by the detection device.

Abstract: A bottom surface of a medium tank 1 is closed with a polymer film 2, the polymer film 2 is stuck to the medium tank 1 by reducing the pressure of the inside of the medium tank 1, an ultrasonic wave transmission medium 5 is injected while reducing the pressure of the inside of the medium tank 1 so that the distal end of an ultrasonic probe 3 is immersed, the inside of the medium tank 1 is pressurized while keeping an inspection object 6 in contact with the polymer film 2, an ultrasonic wave reflected by the inspection object is received by the ultrasonic probe 3.

Abstract: The present invention of a manufacturing method and a apparatus for manufacturing an image pickup device integrated with lens in which a lens holding part having an optical lens is automatically adjusted with respect to a package on which an imaging chip is mounted so that an optical image from an optical axis adjusting pattern is formed on the image plane of the imaging chip and the lens holding part and the package are fixed to each other with an adhesive used therebetween as a position adjusting member at the adjusted position, and an image pickup device integrated with lens thus manufactured having excellent properties.