Abstract: A novel glycidyl sulfonamide compound having a (poly)siloxane main chain of its molecule is used alone or in admixture with an epoxy resin to give a cured material being excellent in flexibility, elongation and impact strength without deteriorating thermal resistance, chemical resistance and water absorption thereof. An epoxy resin composition or a resin composition for an epoxy paint containing a glycidyl sulfonamide compound, the epoxy resin and a curing agent for epoxy resin provides a cured material or a coating film having the above-mentioned excellent properties. A process for preparing a glycidyl sulfonamide compound characterized in that subjecting an amine modified silicone having a (poly)siloxane main chain of its molecule to condensation reaction with a sulfonyl chloride to give a sulfonamide compound, which is subjected to an addition reaction with an epihalohydrin to give the glycidyl sulfonamide compound.

Abstract: Novel glycidyl compounds represented by general formula (I): ##STR1## (wherein all the symbols are as defined in the appended claims), and a process for preparation of the glycidyl compounds are disclosed. The glycidyl compounds are prepared by reacting ethersulfonamide represented by general formula (III): ##STR2## (wherein all the symbols are as defined in the appended claims) and epihalohydrin, and then reacting the resultant adduct with an aqueous caustic alkali solution.

Abstract: A process for preparing a polyglycidyl compound in which an aromatic hydroxycarboxylic acid having phenolic hydroxyl group is reacted with an epihalohydrin in the presence of a phase transfer catalyst and the dehydrohalogenation is then conducted by acting an aqueous alkali solution on the reaction mixture obtained in the first step.

Abstract: A glycidyl compound having the formula (I): ##STR1## wherein R is hydrogen atom or methyl group, p is an integer of 1 to 4 and Ar is aromatic hydrocarbon group selected from the group consisting of groups having the formula (II), (III) and (IV): ##STR2## wherein R.sup.1 R.sup.2 are the same or different and each is an alkyl group having 1 to 4 carbon atoms.The glycidyl compound can be cured by either heat, radical initiators or irradiation of ultraviolet rays and curing compounds prepared by using the glycidyl compound have high heat resistance and high surface hardness.

Abstract: A molding article comprises a molding of an aromatic polyester comprising an aromatic dicarboxylic acid and a bivalent phenol compound on which a layer of a metal or a metal oxide is deposited. The molding article has excellent heat resistance, transparency and surface resistance.

Abstract: An aromatic polyester having improved heat resistance, hydrolysis resistance and alkali resistance which comprises recurring units of the general formula: ##STR1## and recurring units of the general formula: ##STR2## wherein R.sup.1 and R.sup.2 are an alkyl or alkoxyl group having 1 to 4 carbon atoms, R.sup.3, R.sup.4, R.sup.5 and R.sup.6 are the same or different and each is an alkyl or alkoxyl group having 1 to 4 carbon atoms, Cl or Br, x and y are an integer of 1 to 4, z, x', y' and z' are 0 or an integer of 1 to 4, and X is an alkylidene or cycloalkylidene group having 1 to 8 carbon atoms, --O--, --S--, --SO.sub.2 -- or --CO--.

Abstract: An epoxy resin of the general formula: ##STR1## wherein X.sub.1 and X.sub.2 are --OH or ##STR2## and X.sub.3 is --OH, ##STR3## or a group of the general formula: ##STR4## in which X.sub.4, X.sub.5 and X.sub.6 are --OH or ##STR5## provided that at least one of X.sub.1 to X.sub.6 is ##STR6## The epoxy resin is prepared by reacting gallic acid or tannic acid with an epihalohydrin in the presence of a phase transfer catalyst and reacting the obtained reaction mixture with an aqueous alkali solution.

Abstract: A polyesteramide having structural units of the general formula: ##STR1## wherein Ar is a bivalent aromatic group comprising at least 10% by mole of a group having the following formula: ##STR2## in which R.sup.1, R.sup.2, R.sup.3 and R.sup.4 are the same or different and each is methyl group or ethyl group, and structural units of the general formula: ##STR3## wherein R is a bivalent organic group. At least 10% by mole of a bifunctional phenol compound to be used is a tetraalkylbisphenol-F, and whereby the obtained polyesteramide has improved hydrolysis resistance and electric characteristic with an excellent heat resistance.

Abstract: A heat resistant resin composition comprising a, polyamide imide resin having carboxyl groups and modified with an N-methylolated methacryl- or acryl- amide compound and, when desired, further with a bismaleimide compound. The composition has improved properties over conventional polyamide imide resins. When the composition is used, for example, in the form of a film for printed circuit boards, the film has improved heat resistance and enhanced flexural strength and is capable of withstanding soldering baths at high temperatures.

Abstract: A heat resisting aromatic polyester resin comprising (a) recurring units of the formula (I): ##STR1## wherein X is a bivalent group selected from the group consisting of an unsubstituted or substituted bivalent hydrocarbon group having 1 to 10 carbon atoms,--O--, --S--, --SO.sub.2 --and--CO--, and (b) recurring units of the formula (II): ##STR2## wherein X is as defined above, R and R' are a group selected from the group consisting of alkyl, aryl, aralkyl, alkoxyl, aryloxyl and phenylalkoxyl groups having 1 to 20 carbon atoms, their substituted groups, a halogen atom and a mixture thereof, p+q=1 to 8, and m and n are 0 or 1, but n is not 0 when m is 1, provided that up to 10% by mole of the total of the units: ##STR3## in the formulas (I) and (II) may be replaced with units: ##STR4## the ratio of (a)/[(a)+(b)]being from 0.05 to 0.95 by mole. The polyester resin is substantially amorphous and soluble in some organic solvents, and has an excellent heat resistance.

Abstract: A process for manufacturing an aromatic polyester by reacting an aromatic dicarboxylic acid dichloride with an alkali metal salt of a bisphenol comprises adding 0.01 to 100 mol %, based on the total monomer quantity, of an acid halide into the reaction system.

Abstract: A polyether of the general formula: ##STR1## in which Ar stands for a divalent organic group of the aromatic series, R stands for CH.sub.3, CH.sub.3 CH.sub.2, Cl or Br, and n is an integer of 0 to 4. It contains at least 1 mol % of unit `B`. A method of manufacturing such a polyether is also disclosed.

Abstract: A heat resistant resin composition comprising a polyamide imide resin having carboxyl groups and modified with an N-methylolated methacryl- or acryl-amide compound and, when desired, further with a bismaleimide compound. The composition has improved properties over conventional polyamide imide resins. When the composition is used, for example, in the form of a film for printed circuit boards, the film has improved heat resistance and enhanced flexural strength and is capable of withstanding soldering baths at high temperatures.

Abstract: A novel polyether resin having the repeating units of the formula: ##STR1## wherein Ar is a divalent aromatic group, and R.sup.1 and R.sup.2 are divalent aliphatic hydrocarbon groups having 1 to 4 carbon atoms, and method of producing same wherein alkylene dihalide and alkali metal salts of bifunctional phenols are reacted in the presence of a phase transfer catalyst. The novel resin may be used, for example, as a film sheet or as an agent for improving the impact strength of polystyrene.

Abstract: A composition comprising a varnish of heat-resistant resin having active hydrogen in the molecule and a bismaleimide compound or derivative thereof admixed with the varnish affords a heat-resistant resin product of improved properties. Especially when a bismaleimide compound or derivative thereof is added to a varnish of polyimide resin having active hydrogen in the molecule and the composition is applied to a metal film substrate to form a resin film, the film has improved peel strength and, in itself, also has improved strength and elongation.

Abstract: A curable vinyl polymer having at least one silyl group of the formula: ##STR1## wherein R.sub.1 and R.sub.2 are each a hydrogen or a monovalent hydrocarbon radical having 1 to 10 carbon atoms, X is a group selected from halogen, alkoxy, acryloxy, aminoxy, phenoxy, thioalkoxy and amino groups; and "a" is a whole number equal to 0, 1 or 2, and having molecular weight of between 200 and 30,000, preferably between 1,500 and 25,000; and method for producing same, and products comprised of same; and wherein said method comprises reacting hydrosilane represented by the formula: ##STR2## wherein the same designations as above apply, with a polymer having carbon-carbon double bonds in the terminal or side chains of the polymer in which the main chain is a vinyl polymer having a molecular weight of between 200 and 30,000, and at a temperature of between 50.degree. and 150.degree. C.

Abstract: A method of preventing scale formation and adhesion onto the surfaces of a polymerization vessel and auxilliary equipment used in polymerization of vinyl chloride monomer, wherein the surfaces are coated prior to polymerization with a coating agent having the concurrent properties of (a) one or more functional groups having the ability to chelate, (b) one or more functional groups having the ability to inhibit action of free radicals, and (c) substantial insolubility to vinyl chloride monomer and insoluble to water. The concurrent presences of these functional characteristics syngergistically act to prevent scale adhesion onto the surfaces after substantial numbers of repeated polymerization charges.

Abstract: Diallyl Phthalate compounds having a molecular weight of 250 to 20,000 and having at least one silyl group represented by the formula: ##STR1## wherein R.sub.1, R.sub.2 and R.sub.3 are each a hydrogen or a monovalent hydrocarbon radicals having 1 to 10 carbon atoms, such as alkyl, aryl or aralkyl radicals; X is a group selected from halogen, alkoxy, acryloxy, aminoxy, phenoxy, thioalkoxy and amino groups, and "a" is an integer 0, 1 or 2, in the molecule; and process for producing same wherein a diallyl phthalate monomer or prepolymer having molecular weight of 20,000 or less is reacted with a hydrosilane compound having the formula: ##STR2## wherein the designations are the same as above, and at a temperature within the range of 50.degree. to 150.degree. C.

Abstract: An ambient temperature curable composition comprising a compound having a silyl group capable of being cured at ambient temperature in the presence of water and a silicon compound having a group capable of reacting with the terminal silyl group.

Abstract: A curable polyester oligomer having a molecular weight of between 300 and 10,000 and at least one silyl radical at the side chain or at the end of the molecule, with the silyl radical being represented by the formula: ##STR1## wherein R, R.sub.1 and R.sub.2 represent hydrogen or any monovalent hydrocarbon radical with 1 to 10 carbon atoms, selected from the group consisting of alkyl radical, aryl radical and aralkyl radical; R.sub.3 represents divalent hydrocarbon radical with 0 to 10 carbon atoms, "X" represents any radical selected from the group consisting of halogen, alkoxy, acyloxy, aminoxy, phenoxy, thioalkoxy, and amino radicals; "a" is an integer 0, 1 or 2; and "b" is an integer 0 or 1.